• 한국공작기계학회논문집
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• 제15권1호
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• pp.119-126
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• 2006

The finishing process of die requires the processing technique of a height efficiency and precision. Because the precision of die gives the quality of goods the influence directly. The hydro-static polishing device employs the hydro-static axis and is able to polish the structure of complex picture under the constant pressure and is got constant surface roughness at all polished plane. Therefore, In order to polish precision sculptured surface, it was used the hydro-static polishing device. Polishing device's polishing characteristic is estimated by polishing conditions which are size of abrasive, material of tools. And, because the surface quality of workpiece depends on polishing pattern which relates to motion of abrasive grain. The polishing characteristic according to polishing pattern was evaluated.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.257-257
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• 2013

4세대 방사광가속기를 2014년 말 건설 완공 목표로 언듈레이터 시제품 제작하여 테스트 진행과정에 있다. 좁은 틈의 언듈레이터를 지나가는 펄스전자의 진행이 잘되려면 낮은 임피던스가 요구되는데, 전자의 진행을 방해하는 주요 요인으로 진공 표면 거칠기와 산화층 두께에 영향을 많이 받는다. 이러한 영향을 줄이기 위하여 연질의 알루미늄 6063-T6를 재료로 압출공정에 혼합가스를 주입하여 표면 산화를 최소화하였다. 본 실험은 6 m 압출형 진공용기에 압출공정만 거친 것과 유체연마 메디아 종류별, 크기별, 처리시간에 따른 표면개선 효과와 산화층 변화를 알아보았다. 그리고 최종 유체연마 메디아제거 과정에 경면 연마된 표면에 2차 스크레치가 발생하는 원인을 진단하고 이를 방지하기 위한 알코올 주입형 정압시스템을 개발한 것을소개한다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.139-144
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• 2004

This polishing machine has many advantages to polish complicated shaped molds due to spindle header with constant pressure. But, because of new polishing machine, there is no study of the standardization of polishing by polishing conditions yet. So we want to know the relation between polishing conditions(a kind of tool, grain size) and surface roughness. The result of experimental was obtained surface roughness of 0.061${\mu}{\textrm}{m}$ Ry in case of using wood tool and grain of 6${\mu}{\textrm}{m}$ diamond.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.743-747
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• 1997

Polishing work for a curved surface die demands simple and repetitive operations and requires much time while it also demands high precision. Therefore it is operated by skilled worker in handiwork. Howener workers avoid polishing work gradually because of the poor environments such as dust and noise. In order to reduce the polishing time and to alleviate the problem of shortage of skilled workers, researches for automation of polishing have been pursued in the developed countries. In the research, a polishing robot with 2 degrees of freedom motion attached to machining center with 3 degrees of freedom and pneumatic system forms an automatic polishing system which keeps the polishing tool vertically on the surface of die and maintains constant pneumatic pressure. A synchronization between machining center and polishing robot is accomplished by using M code of machining center. A rulled surface and shadow mask are polished by the developed polishing robot.

• 한국정밀공학회지
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• 제16권4호통권97호
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• pp.163-177
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• 1999

Polishing work for a curved surface die demands simple and repetitive operations and requires much time while it demands also high precision. Therefore it is operated by a skilled worker in handiwork. However the workers avoid gradually a polishing work because of the poor environmental conditions such as dust and noise. In order to reduce the polishing time and to alleviate the problem of shortage of skilled workers, an automatic polishing robot system which is composed of a polishing robot with two degrees of freedom motion and pneumatic system is developed, and it is attached to machining center with three degrees of freedom. The system keeps the polishing tool vertically on the surface of die and maintains constant pneumatic pressure. The polishing robot with DSP(digital signal processor) controller is controlled by sliding mode control. A synchronization between machining center and polishing robot is accomplished by using M code of machining center. A performance experiment for polishing work is executed by the developed automatic polishing robot system. The result shows that the developed automatic polishing robot has a good performance and well polished workpiece surface is obtained.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1082-1086
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• 2004

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.