• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.185-188
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• 2002

An abrasive vitreous bonded solid mass having a vitrified abrasive structure comprising diamond grains which are held by an in inorganic bonding agent, the vitrified diamond wheel is impregnated with a composition which comprises a thermosetting synthetic resin and a surfactant. The vitrified diamond wheel is manufactured by preparing the composition including the resin and the surfactant, impregnating the abrasive structure with the composition, and curing the composition. The diamond wheel newly developed showed excellent performance in grinding carbide.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.1047-1050
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• 2002

In this paper, grinding characteristics of cylindrical plunge grinding in 200m/sec of grinding velocity was investigated by use of vitrified CBN wheel. From the experimental result, it was convinced that grinding power is decreased 2.5times and grinding efficiency is heightened 3times more according to increasing wheel velocity 80m/sec to 200m/sec And also, be expected to improvement of surface roughness and roundness by increasing the wheel velocity.

• 한국정밀공학회지
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• 제16권12호
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• pp.54-59
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• 1999

High precision internal plunge grinding is difficult because of the decrease in the quill stiffness due to the small diameter of wheel. In this paper, the characteristics of internal plunge grinding were investigated. Grinding experiments were performed at various grinding conditions with vitrified bonded CBN wheels. The grinding period was assumed to be consisted of rough grinding and fine grinding. The classification of grinding was determined int terms of the normal grinding forces and actual depth of cut. The experimental results indicate that the higher depth of cut and infeed speed result in the longer rough grinding time. The maximum normal grinding force was nearly equal to the static force and it decreases exponentially as the grinding continues.

• 한국정밀공학회지
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• 제18권8호
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• pp.150-156
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• 2001

This paper deals with the theoretical estimation and its experimental verification of grinding wheel wear in surface grinding process. A theoretical formulation is provided to predict the grinding wheel wear in surface grinding. To validate the theoretical prediction, the grinding wheel wear is measured by using a laser scanning micrometer. The associated surface roughness and grinding farce are also investigated both theoretically and experimentally. Through a series of simulations and experiments, it is shown that the predictions are in good agreement with the experimental results.

• 한국기계가공학회지
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• 제6권3호
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• pp.9-15
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• 2007

Three methods for grinding: cross grinding, slanted tool axis grinding and parallel grinding, were carried out to study the machinability of tungsten carbide mold for glass formed aspherics lens. In our research, the optimum grinding conditions were investigated in terms of feed-rate, relative velocity of wheel and work piece, tool marks and surface roughness. It is shown that cross grinding are most effective in removal ratio but poor in surface roughness. In addition, tool marks of each method were differentiated on direction and shape.

• 한국정밀공학회지
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• 제12권1호
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• pp.48-57
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• 1995

연삭가공중에 발생하는 트러블의 인식과 처리는 공학적 원리에 입각한 방법과 현장 숙련기술자의 경험적 지식을 바탕으로한 방법이있다. 그러나, 연삭가공은 관계되는 가공변수가 많아, 이들 상호간의 관계를 정량적으로 규명할 수 없어 대부분이 숙련자의 지식에 의존하는 것이 현실정이다. 본 논문은 이와같은 점에 착안하여 원통연삭을 대상으로 현장숙련자가 갖고 있는 경험적이고도 정성적인 지식의 호과적인 활용을 위해 계층분석으로 도입하여 이들이 갖고 있는 노하우를 정량화하고, 아울러 공학적원리를 가미한 연삭가공을 트러블 진단. 처리 시스템을 구축하였다. 또한 시스템 구성에 신뢰성을 높이기 위해 폴트 진단 모델을 도입하였다.

• 한국정밀공학회지
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• 제17권9호
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• pp.45-52
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• 2000

To reduce two preprocess operations to one in the surface grinding operation the laminated grinding wheel was introduced and its availability has already been investigated in the cylindrical grinding process. Thus in this study the experiment was carried out to attempt to prove that the laminated grinding wheel can be used in the surface grinding process with respect to the roughness and grinding force.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.124-130
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• 1995

연삭작업에 있어서 요구되는 가공능률과 가공정밀도를 얻기 위해서는 적절한 결합도를 갖는 연삭숫돌을 선택하 는 것이 중요한 요건이 된다. 본 연구에서는 결합도를 평가하기 위한 일정한 기준을 설정할 목적으로 AE계측 시스템을 이용하여 대월식결합도시험방법에 따라 연삭숫돌표면의 일부를 파괴시켰을 때 발생되는 AE신호를 검출 하고 연삭숫돌의 파괴량과 AE 신호특성과의 관계 및 AE를 이용한 결합도평가의 가능성을 검토하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• 한국정밀공학회지
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• 제18권1호
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• pp.187-194
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• 2001

The objective of this study is to develop a model for the grinding process for predicting the temperature, thermal stress and thermal deformation. The thermal load during grinding is modeled as uniformly distributed, 2D heat source moving across the surface of elastic half space, which is insulated or subjected to convective cooling. That non-dimensional temperature distribution, non-dimensional longitudinal stress distribution and non-dimensional thermal deformation distribution are calculated with non-dimensional heat source half width and non-dimensional heat transfer coefficient. Finite element models are developed to simulate moving heat source, which is modeled as uniformly or triangularly distributed, the FEM simulation is compared with numerical solution.