• Proceedings of the KWS Conference
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• 2009.11a
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• pp.30-30
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• 2009

GTA 용접에서 용입, 용접부의 크기와 형상이 형성되는 아크 물리학적 현상을 이해함에 있어서 에너지 분포특성은 매우 중요한 인자이다. GTA 용접에서 아크 길이의 변화와 사용된 실드 가스 종류에 따라 음극인 텅스텐 전극 팁의 아크 루트 직경에 큰 변화를 주며, 양극인 모재 쪽의 에너지 분포에 영향을 미치며 된다. 기존의 연구자들은 저전류나 중전류 영역의 GTA 용접에서 텅스텐 전극의 선단각과 용입 형태와 의 관계를 plasma 기류 등에 의해 고찰하거나, 최대 아크압력에 미치는 전극형상의 영향에 대하여 연구하였다. 용접부에 작용하는 아크 압력의 분포는 결국 운동 에너지의 분포이다. 기존의 연구자들에 비하여 보다 간편한 실험을 통하여 양극 모재위의 아크 압력에 의한 에너지 분포특성을 규명하는 연구가 필요하다. 본 연구의 목적은 GTA 용접의 용접전류 100A~200A 영역에서 아크 길이 변화와 Ar 가스에 $H_2$ 혼합에 따른 측정된 아크 압력으로부터 기존연구자들의 아크 물리학적 결과들을 활용하여 양극 모재 위에 작용하는 전류밀도 분포를 유도하는 것이다. GTA 용접에서 아크 길이의 변화와 Ar 가스에 $H_2$ 혼합은 아크 압력분포에 큰 영향을 미치며, 이에 따라 에너지 분포특성에 많은 영향을 미친다. 아크 길이가 증가함에 따라 Ar가스와 $H_2$ 혼합가스의 에너지 분포는 감소하였고, Ar가스에 $H_2$ 혼합에 의해 아크 에너지가 증가하여 용입형상에 큰 영향을 미칠 것으로 판단된다. 이에 대한 연구는 향후 GTA 용접 응용분야 확대 적용될 것이며, 아크 물리학 연구에 기초적이고 아주 중요한 과학적인 자료가 될 것으로 판단된다.

• Journal of Sensor Science and Technology
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• v.2 no.1
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• pp.19-27
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• 1993

Capacitive pressure sensor for low pressure measurements has been fabricated by using $n^{+}$ epitaxial layer electrochemical etching stop and glass-to-silicon electrostatic bonding technique. The sensor had hybrid configuration of a sensor chip, which consists of sensor capacitor and reference capacitor, and two output signal detection IC chips. A fabricated sensor, with a $1.0{\times}1.0 mm^{2}$ square size and a $10{\mu}m$ thick flat diaphragm, showed a 7.1 pF zero pressure capacitance, and 5.2 % F.S, sensitivity in 10 KPa pressure range. By using a capacitance to voltage converter, the thermal zero shift of 0.051 %F.S./$^{\circ}C$ and the thermal sensitivity shift of 0.12 %F.S./$^{\circ}C$ for temperature range of $5{\sim}45^{\circ}C$ were obtained.

• Proceedings of the KWS Conference
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• v.43
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• pp.165-167
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• 2004

The failure pressure for corroded pipeline was measured by burst testing and classified with respect to corrosion sizes and corroded regions - the body, the girth weld and the seam weld of pipe. A series of finite element analyses were performed to obtain a limit load solution for corrosion defects on the basis of burst test. As a result, the criteria for failure assessment of corrosion defect within the body, the girth weld and the seam weld of API 5L X65 gas pipeline were proposed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.71-71
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• 2012

Memory 반도체 Test공정에서 사용되는 Probe Card의 Probing Area가 넓어지면서 종래에 사용되던 Cantilever제품의 사용이 불가능하게 되고, MEMS공정을 사용한 새로운 형태의 Advanced제품이 시장에 출현을 하였다. MEMS형의 제품은 다수의 Micro Spring을 MLC(Multi Layer Ceramic)위에 MEMS 공정을 사용하여 생성하는 방식으로서 MLC는 좁은 지역에 다수의 Pin을 생성 할 수 있는 공간을 만들어 주며, 또 다른 이유는 전기적 특성인 임피던스를 맞추고 다수의 Pin의 압력에 의하여 생기는 하중을 Ceramic기판으로 지탱하기 위한 목적도 있다. 이에 MLC와 같은 전기적 특성을 임피던스를 맞춘 RF-CPCB를 사용하여 작은 면적에 다수의 Pin접합이 가능한 방법을 마련한 후, 이 RF-PCB를 부착하여 Pin의 하중을 받는 Wafer와 유사한 열팽창을 갖는 Substrate를 사용하여 MLC를 대체하여 다양한 온도 조건에서 사용이 가능하며, 복잡하고 공정비가 많이 드는 MEMS 공정에 의한 일괄 Micro Spring 생성 공정을 전주 도금 또는 2D방식의 도금 Pin으로 대체하였으며, Probe Card의 중요한 물리적 특성인 Pin들의 정렬도를 마련하기 위해 Photo Process를 사용한 Wafer로 만든 Wafer Pin Array Frame을 사용하여 2D 제작 Pin을 일괄 또는 부분 접합이 가능한 방법으로 Probe Array Head를 제작하여 이들을 부착하여 Probe Array Head를 이전의 MEMS공정 방법에 비해 쉽고 빠르게 만들어 probe Card를 제작 할 수 있게 되었다.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.7
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• pp.179-185
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• 2001

Porthole die extrusion is profitable to manufacture long tube with hollow section. The material through portholes is gathered within chamber and welded under high pressure. This weldability which classifies the quality of tube product is affected by several variables and die shape. But, porthole die extrusion has been executed on the experience of experts due to the complicated die assembly and complexity of metal flow. Analytic approaches that are useful in profitable die design and in the improvement of productivity are inevitably demanded. Therefore, the objective of this study is respectively to analyze the behavior of metal flow and to determine welding pressure of hot extrusion product according to the various billet temperature, bearing length and tube thickness by FE analysis and its results are compared with tube expanding tests.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.11-15
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• 2011

Heat transfer equation is first reviewed and then governing equation of moisture diffusion. Analogy scheme is applied to analysis the moisture absorption problem of polymers. It make possible to numerically analyze the diffusion problem for single medium by using commercial finite element code if it is under the isothermal loading condition. It is extended to special multimaterial system by introducing pressure ratio function, whose moisture characteristics of materials are proportional to temperature only. The weight changes of silicon-nonconductive-polymer joint model due to moisture absorption is measured and been very close to the numerical results as for single media with boundary condition with zero concentration, but yields numerical errors as for multisystem media.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.206-209
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• 2005

It was investigated that two rods of aluminium can be welded by hot extru-pressure welding method with stepped welding dies, and that the welding pressure on the welding surface were analyzed by computer simulation according to the stepped shapes of welding dies. It was known by computer simulation that welding pressure on the welding section of rods welded using stepped welding dies without eccentricity is lowerer than the welding pressure of rods welded using stepped welding dies with eccentricity of welding surface, and that the welding pressure on the welding section of rods using eccentric-inclined stepped welding dies is higher than the welding pressure of rods using stepped welding dies without eccentricity. And it was known by experiments that two rods of aluminium can be welded on the end sections by hot pressure welding method using eccentric-inclined stepped welding dies without relative rotational movement of contacted aluminium rods needed for the purpose of friction heating and pressure.

• Journal of Welding and Joining
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• v.32 no.4
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• pp.46-54
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• 2014

In this study, the effect of bonding temperature and bonding pressure on deformation and tensile properties of diffusion bonded joint of STS304 compact heat exchanger was investigated. The diffusion bonds were prepared at 700, 800 and $900^{\circ}C$ for 30, 60 and 90 min in pressure of 3, 5, and 7 MPa under high vacuum condition. The height deformation of joint decreased and the width deformation of joint increased with increasing bonding pressure at $900^{\circ}C$. The ratio of non-bonded layer and void observed in the joint decreased with increasing bonding temperature and bonding pressure. Three types of the fracture surface were observed after tensile test. The non-bonded layer was observed in diffusion bonded joint preformed at $700^{\circ}C$, the non-bonded layer and void were observed at $800^{\circ}C$. On the other hand, the ductile fracture occurred in diffusion bonded joint preformed at $900^{\circ}C$. Tensile load of joint bonded at $800^{\circ}C$ was proportional to length of bonded layer and tensile load of joint bonded at $900^{\circ}C$ was proportional to minimum width of pattern. The tensile strength of joint was same as base metal.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.9-15
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• 2008

Mokumegane is one of the sophisticated metal craft techniques enabling wood grain surface effect. To embody the mokumegane, an ingot of well-bonded stacked metal plates has been required. Traditionally prepared mokumegane ingots were bonded using charcoal which enables reduction atmosphere, but sometimes end up with collapse of bonding interface due to the lack of reliable process control. We proposed a systematic vacuum direct bonding process for ingots. First, we confirmed copper//copper homogeneous plate bonding at $900^{\circ}C$ by applying uniaxial press of 2.5kg. We observed 80min required to obtain 90%-bonding ratio and the diffusion coefficient would be enhanced up to 100 times due to surface effect. Second, by considering enhanced diffusion behavior, we also obtained optimum bonding condition in copper/silver heterogeneous plates that ensures 90%-bonding ratio at $700^{\circ}C$ for 10min with apply uniaxial press. A 7-layered copper/silver ingot is prepared successfully, and eventually the prototype mokumegane cases for mobile phone were fabricated with these ingot.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.67.1-67.1
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• 2010

Triple junction solar cell을 위한 a-SiGe middle cell의 조건별 광학적 특성에 관한 연구를 실시하였다. a-SiGe I층은 GeH4 유량, 압력, H2 dilution ratio를 변화시켜 제조하였으며 전기적, 광학적 특성을 비교하여 최종적으로 선택된 조건을 triple junction solar cell에 적용하였다. a-SiGe I층은 Ge contents가 증가함에 따라 band gap은 감소하고 45% 이상의 조건에서는 700nm 전후 파장의 투과율이 감소하며, 압력이 감소함에 따라 band gap은 소폭 감소하나 700nm 전후 파장의 투과율은 증가하였다. 그리고 H2 ratio가 증가함에 따라 band gap은 소폭 감소하나 투과율에는 큰 변화가 없었다. 상기 결과를 바탕으로 최종적으로 선택된 조건에서 triple-junction solar cell을 제작하여 평가한 결과 초기 변환효율 9%의 결과를 얻었다.