• Journal of Sensor Science and Technology
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• v.7 no.6
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• pp.426-431
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• 1998

This paper describes electrochemical etch-stop characteristics in THAH/IPA/pyrazine solution. I-V curves of n- and p-type Si in THAH/IPA/pyrazine solution were obtained. OCP(Open Circuit Potential) and PP (Passivation Potential) of p-type Si were -1.2 V and 0.1 V, and of n-type Si were -1.3 V and -0.2 V, respectively. Both n- and p-type Si, etching rates were abruptly decreased at potentials anodic to the PP. The etch-stop characteristics in THAH/IPA/pyrazine solution were observed. Since accurate etching stop occurs at pn junction, Si diaphragms having thickness of epi-layer were fabricated. Etching rate is highest at optimum etching condition, TMAH 25wt.%/IPA 17vol.%/pyrazine 0.1g/100ml. thus the elapsed time of etch-stop was reduced.

• Journal of the Korean association of regional geographers
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• v.8 no.2
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• pp.150-160
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• 2002

The purpose of this study is to introduce the new regional geography approaches that have been lively discussed in English speaking countries since 1980s. The discussion of the new regional geography is based on intellectual interchange between geographers and social theorists. The new regional geographers regard a space as a more active thing. A space is not a merely passive container. It is not a outer settings, but a essential dimention of the human being. The new regional geography has been discussed in four perspectives: structuration theory perspective, spatial division of lavour theory perspective, world-systems theory perspective, and post-poststructuralism perspective. The new regional approaches well provide a new direction to regional studies. However, it is so abstracted in concepts for the empirical examinations that it is necessary to introduce a meso-level of concept.

• Journal of KIISE:Computing Practices and Letters
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• v.14 no.9
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• pp.841-849
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• 2008

Natural disaster such as inundation due to the typhoon induced storm-surge has inflicted severe losses on the coastal area. The problem of global warming and sea surface rising has issued and thus influences the increase of frequency and potential power of storm-surge. What we can do is to make intelligent effort to predict and prevent the losses through the early warning and prevention activity from the accurate prediction and forecasting about the time-varying storm-surge height and its arriving time resulted from the numerical simulation with sea observations. In this paper, we developed the web service based GIS-Enabled storm-surge visualization system to predict and prevent the storm-surge disasters. Moreover. for more accurate topography around coastal area and fine-grid storm-surge numerical model, we have accomplished GIS-based coastal mapping through LiDAR measurement.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.3
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• pp.681-686
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• 2017

Degradation is commonly observed in field-aged PV modules due to corrosion of the photovoltaic ribbon. The reduced performance is caused by a loss of fill factor due to the high series resistance in the PV ribbon. This study aimed to mitigate the degradation by corrosion using five sacrificial anodes - Al, Zn and their alloys - to identify the most effective material to mitigate the corrosion of the PV ribbon. The corrosion behavior of the five sacrificial anode materials were examined by open circuit potential measurements, potentiodynamic polarization tests, and galvanic current density and potential measurements using a zero resistance ammeter. Immersion tests for 120 hours were also conducted using materials and damp heat test tests were performed for 1500 hours using 4 cell mini modules. The Al-3Mg and Al-3Zn-1Mg sacrificial anodes had a low corrosion rate and reduced drop in power, making then suitable for long-term use.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.26.2-26.2
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• 2011

최근 주목 받고 있는 산화아연(ZnO)은 레이저 다이오드, 가스 센서, 자외선 센서, 투명전극 등으로 다양하게 사용될 수 있어 연구개발이 폭 넓게 이루어지고 있는 상황이다. 특히, 3.3 eV의 direct bandgap 에너지를 가지고 있는 ZnO은 현재 자외선센서로 많이 적용되고 있는 물질인 GaN계열을 대체할 수 있는 유망한 물질로 주목 받고 있다. 공기중의 산소나 수분의 표면반응에 의한 자외선 측정을 하는 ZnO을 나노선으로 만들게 되면, 표면대비 부피비가 박막에 비해 급격히 증가하기 때문에 민감도가 커지고 반응시간이 짧아지게 된다. 본 연구에서는 자외선센서의 민감도와 반응성을 향상시키기 위해 전기화학적 합성법을 통해 ZnO의 박막과 나노선을 제조하였다. 사진공정을 통해 3 ${\mu}m$의 간격을 가진 금(Au) 전극을 만든 후, 전기화학적 합성법을 통해 아연이온이 포함된 용액에서 정전류를 흘려보내 아연 또는 ZnO을 증착시킬 수 있었다. 첫 번째로 ZnO을 양쪽 Au 전극에서 동시에 증착하여 두 박막이 접합하였고, 두 번째는 100nm의 지름을 가진 Ni 나노선를 전극 양쪽에서 자석을 통해 자기장을 형성해 정렬시키고 ZnO을 Au 전극과 Ni 나노선에 증착한 후, Ni 나노선를 산화시킴으로써, ZnO 나노구조를 형성하였다. 세 번째로는 Au 전극 양쪽에 아연을 전기화학적 합성을 하여 박막으로 증착하고 고온에서 산화과정을 통해 100 nm 이하의 지름을 가진 ZnO 나노선를 형성하였다. 이렇게 만들어진 세가지 구조의 ZnO의 나노구조와 결정성은 주사전자현미경과 X선 회절 분석기를 통해 측정하였으며, 자외선에 대한 민감도와 반응성은 365 nm의 파장을 가진 자외선발생기와 소스미터장치를 통해 측정하였다. 박막에서 100 nm 이하의 지름을 가진 ZnO 나노선로 갈 수록 자외선에 대한 민감도와 반응성이 향상되었다.

• The Journal of the Korea Contents Association
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• v.14 no.3
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• pp.22-32
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• 2014

Recently, GPGPU has been widely used for general-purpose processing as well as graphics processing by providing optimized hardware for parallel processing. Memory system has big effects on the performance of parallel processing units such as GPU. In the GPU, hierarchical memory architecture is implemented for high memory bandwidth. Moreover, both memory address coalescing and memory request merging techniques are widely used. This paper analyzes the GPU performance according to various memory organizations. According to our simulation results, GPU performance improves by 15.5%, 21.5%, 25.5%, 30.9% as adding 8KB L1, 16KB L1, 32KB L1, 64KB L1 cache, respectively, compared to case without L1 cache. However, experimental results show that some benchmarks decrease performance since memory transaction increases due to data dependency. Moreover, average memory access latency is increased as the depth of hierarchical cache level increases when cache miss occurs significantly.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Korean Journal of Social Welfare
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• v.59 no.3
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• pp.253-280
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• 2007

This study explores the discoures of family and family policy in the legislative process of Strong Family Act. Critical discourse analysis was used. The results are follows. The Strong Family Act made family issue as a political agenda in spite of much critics. The characteristics of the family discourse in "strong family camp": 1) The emphasis on the moral principle in family 2) denial of deinstitutionalization of family 3) regarding the family problem as a moral and individual problem 4) regarding the state as managing and controling the family. The characteristics of the family discourse in "critical camp": 1) strong family discourse is related to "the family" ideology 2) regarding the family problem as a social, structural problem 3) regarding the state as subsiding, supplementing families. The characteristics of the family policy discourse in "strong family camp": 1) casual efficiency as justifying logics 2) family policy as means to recover family values 3) deunifying the family policy. On the one hand, the characteristics of the family policy discourse in "critical camp": 1) social consensus and academic discussion as justifying logics 2) regarding the family policy as a means of gender equality and strategical point of welfare state expansion. The discourse of family and family policy, especially 'Strong Family Discourse" resulted in conjugation of nationalism and neoliberalism.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.47-54
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• 2008

In this paper, we studied how and why did abnormal IMC growth at component affect on board level mechanical reliability. First, interfacial reactions between Sn2.5Ag0.5Cu solder and electrolytic Ni/Au UBM of component side were investigated with reflow times and thermal aging time. Also, to compare mechanical reliability of component level, shear energy was evaluated using the ball shear test conducted with variation of shear tip speed. Finally, to evaluate mechanical reliability of board level, we surface-mounted component fabricated with each condition on PCB side. After conducting of 3 point bending test and impact test, we confirmed solder joint crack mode using cross-sectioning and dye & pry penetration method.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.55-61
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• 2008

This paper shows quantitative reliability evaluations of a Bluetooth module through extending previous qualitative methods limited to structure reliability tests and solder joint reliability tests for Bluetooth modules. Accelerated Life Testing (ALT) of the modules using temperature difference in temperature cycling as an accelerated stress was conducted for quantitative reliability evaluation under field environment conditions. Lifetime distribution parameters were estimated using the failure times obtained through the ALT, and then Coffin-Manson model was implemented. Results of the ALT showed that the failure mode of the modules was open and the failure mechanisms are both crack and delamination. The ALT reproduced the failure mode and mechanisms of failed Bluetooth modules collected from the field. Further, a quantitative reliability evaluation method with respect to various temperature differences in temperature cycling was proposed in this paper. $B_{10}$ lifetime of the module for the temperature difference $70^{\circ}C$ using the proposed method would be estimated as about 4 years.