• The Korean Journal of Zoology
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• v.33 no.1
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• pp.6-11
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• 1990

Analysis of genetic structure in Kimpo natural population of Drosophila was carried out by utilizing the deleterious gene on the second chromosome of Drosophila melanogaster. Male flies tested were continuously collected for eight years; in late September 1974 and 1981-1987. The frequency of deleterious gene (lethal plus semilethal) ranged from 27.02% in 1983 to 41.48% in 1987, and the values estimated from the eight years samples are highly signihcent from each other with a homogenety test (X$^2$=52.0157, d.f.=28, P<0.005). Allelic rates ranged from 1.30% in 1981 to 5.03% in 1974. And the effective population size by using the rate of allelism was estimated average at 3, 300 pairs. Elimination rate by homozygous of lethal gene ranged from 0.0004 in 1984 to 0.0019 in 1974, and that is for smaller than mutation rate(0.005) at second chromosome. We suppose that stable frequency (about 20%) lethal genes of D. melanogaster in Kimpo natual population are maintained by invade of P-type mutator factor (P element) versus eliminated in heterozygous and homozygous condition of lethal gene.

• Journal of Adhesion and Interface
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• v.24 no.3
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• pp.86-94
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• 2023

To fabricate all-solution-processed flexible Organic Light-Emitting Diodes (OLEDs), we demonstrated a bonding technology using a polyethyleneimine (PEI) as an adhesion layer between the two substrates. As the adhesion layer requires not only a high adhesion strength, but also a high current density, we have tried to find out the optimum condition which meets the two requirements at the same time by changing experimental factors such as PEI concentration, thickness of the layer and by mixing some additives into the PEI. The adhesion strength and the electrical current density were investigated by tensile tests and electron only device (EOD) experiments, respectively. The results showed that at higher PEI concentration the adhesion strength showed higher value, but the electrical current through the PEI layer decreased rapidly due to the increased PEI layer thickness. We added Sorbitol and PolyEthyleneGlycohol (PEG) into the 0.1 wt% PEI solution to enhance the adhesion and electrical properties. With the addition of the 0.5 wt% PEG into the 0.1 wt% PEI solution, the device showed an electrical current density of 900 mA/cm² and a good adhesion characteristic also. These data demonstrated the possibility of fabricating all-solution-processed OLEDs using two-substrate bonding technology with the PEI layer as an adhesion layer.

• Journal of Aquaculture
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• v.9 no.3
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• pp.287-291
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• 1996

[ $F_2$ ] generation of gynogenetic diploids were produced in olive flounder, Paralichthys olivaceus, by brother-sister mating with full-sibling gynogenetic diploids ($F_1$). The induced ovulations and spawnings were conducted by using intraperitoneal injections of HCG (2,000 IU/kg body weight) with photoperiod controls. Floating rates of artificially ovulated eggs were ranged from 22.9 to $65.7\%$. Fertilization and hatching rates were ranged from 69.0 to $86.2\%$ and 36.8 to $85.8\%$, respectively. All of those three rates between two experimental groups were not significantly different (P>0.05). Average survival rates of $F_2$ generation of 40-day-old 효nogenetic diploid larvae were slightly lower than those of controls (P<0.05), however growth rates were much higher than those of their diploid controls.

• Composites Research
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• v.31 no.4
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• pp.139-144
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• 2018

Long Fiber-reinforced composites have advantages of excellent production efficiency and formability of complex shapes compared to conventional continuous fiber reinforced composite materials. However, if we need to make complicated composite shapes or to assemble parts made of different materials, a variety of joining methods are needed. In general, long fiber prepreg sheet (LFPS) contains mold release agent to facilitate demolding after thermoforming. Therefore, mechanical fastening is required in addition to the adhesive bonding to get proper joining strength. In this study, we proposed a stainless steel insert for co-cure bonding which cures LFPS and bonds the stainless steel insert through thermoforming process. The wing of the insert which is spread during the thermoforming process induces adhesion and mechanical wedging effect and serves as a hook to resist the pulling force. The burn-out method was used to confirm the unfolded state of the stainless steel insert wings inserted into the composite material. The static pull-out test was performed to quantitatively evaluate the joining strength. From these experimental results, the condition which guarantees the most appropriate joining strength was derived.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.9
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• pp.110-118
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• 2007

ISB (Inner structured and bonded) panel with a pyramidal inner structure is actively developing to reduce the weight and to improve the crashworthiness of the material. The objective of this paper is to investigate into the variation of impact characteristics of ISB panels with a pyramidal inner structure according to joining types between skin sheets and inner structures. Several drop impact tests have been performed. In order to examine the impact characteristics at a drawing condition, drawing type of experimental set-up has been proposed. From the results of the experiments, the influence of joining types between skin sheets and the inner structures on the characteristics of the deformation, the energy absorption and the failure has been quantitatively examined. In addition, it has been shown that maximum load decreased and the maximum displacement increases as the joining type changes from the bonding to the welding. The results of the observation of the specimen have been shown that major wrinkles form in the minor crimping direction irrespective of the joining types. Through the comparison of the experimental results for bonding and welding specimens, it has been shown that the absorption energy of the bonded specimen is nearly 1.3-1.5 times of the welded specimen at the same displacement.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.33-42
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• 2015

오늘날 연성회로기판(FCCL : Flexible Copper Clad Laminate)은 디스플레이, 스마트폰, 자동차, 항공, 의료 기기, 산업용 컨트롤 기기 등 거의 모든 고급 전자 제품들에 사용되고 있다. 특히 디스플레이 분야에서는 뛰어난 연성과 내구성을 바탕으로 경박단소화에 유리할 뿐만 아니라 구동부에 적용이 가능한 장점 등으로 그 적용처가 점점 늘어나고 있는 추세이다. 이 가운데서도 LCD와 OLED의 구동소자(Display Driver IC)를 장착하는 COF(Chip on Film)는 대표적인 연성회로기판(FCCL) 적용 부품으로서, 최근 인기를 끌고 있는 디스플레이의 제로-베젤(Zero-bezel)을 가능케 하는 핵심 부품이다. COF용 연성회로기판(FCCL) 소재로는 우수한 평탄도, 파인피치(Fine-pitch)구현성, 내굴곡성, 광투과성 등을 보유하고 있는 Sputtering Type FCCL이 사용되고 있다. 특히 최근 Display 분야의 화두가 되고 있는 POLED(Plastic-OLED) 패널을 장착한 Flexible Mobile 디스플레이의 경우, 기존의 COG(Chip on Glass) 접합방식이 아닌 COF 접합방식을 채택하고 있으며, 기존의 단면 COF보다 3배의 고해상도 구현이 가능한 양면 COF를 채택하기에 이르렀다. 기존의 COF 제작공정과 달리 Semi Additive 공정으로 제작되는 양면 COF 시장의 태동으로 양면 연성회로기판(FCCL)의 수요 증가가 예상되는 등 최근 디스플레이 기술 발전은 소재 분야에도 큰 변화를 잉태하고 있다. 이러한 최근 디스플레이 업계의 고해상도, 고속 신호 전송, 슬림화, Flexible 추세에 대응 가능한 최적의 특성을 보유하고 있는 Sputtering Type FCCL을 중심으로 디스플레이의 발전에 대응하는 소재의 기술 개발 동향을 살펴보고자 한다.

• Analytical Science and Technology
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• v.24 no.5
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• pp.336-344
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• 2011

The study attempted to find out any effect to prevent photo aging of epoxy resin used for conservation by way of adding UV stabilizer, one of plastic additives. Specimens were made by adding HALS and UVA UV stabilizer as each concentration to 3 kinds of epoxy resin, which are most frequently used for artifacts joining and restoration process, and aging effects were investigated through Color change, SEM, contact angle, FTIR analysis during UV aging experiments. Last, usage suitability was checked when UV stabilizer was added through Universal Tensile strength tester. In result, it is impossible to prevent decomposition of chemical structure in spite of adding UV stabilizer but in the case of epoxy A and R, it is believed that photo aging such as yellowing or crack can be minimized without giving a big influence to adhesive strength of epoxy resin through adding less than 0.1% of UVA. It is expected that above will solve photo aging problem of epoxy resin used for joining and restoration of artifacts and will extend its life as joining and restoration materials.

• 한국방재학회:학술대회논문집
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• 2011.02a
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• pp.32-32
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• 2011

최근 국내외에서 친환경건축물에 관한 관심이 매우 높아짐으로 인해 콘크리트의 물량을 절감하여 이산화탄소량을 줄이는 중공슬래브는 다양한 형태로 세계적으로 개발이 되고 있는 추세이다. 특히 이방향 중공슬래브는 환경적인 측면에서 이방향 중공슬래브는 중공부 생성에 재생플라스틱을 활용하여 폐자원을 재사용하고, 콘크리트와 철근의 사용량 절감에 따른 화석에너지 및 이산화탄소 발생량을 감소한다는 장점이 있다. 또한 시스템 측면에서 이방향 중공슬래브는 기존의 철근콘크리트 플랫플레이트 바닥구조 시스템의 자중을 절감하여 구조체를 경량화 시키고, 이에 따라 장스팬 구현이 가능하며, 단열효과가 뛰어나다. 이와 같이 이방향 중공슬래브는 장점이 많지만 플랫플레이트 슬래브의 취약점인 뚫림전단 파괴에 주의해야 한다. 이에 본 연구에서는 선행으로 실시된 이방향 중공슬래브-기둥 접합부 뚫림전단 성능평가 실험을 바탕으로 하여 경량체가 이방향 중공슬래브-기둥 접합부 뚫림전단 성능에 미치는 영향을 살펴보기 위해 범용 유한요소해석 프로그램인 ABAQUS를 사용하여 경량체량 및 위치를 주요변수로 한 해석적인 변화를 검토하였다. 본 연구를 통해 경량체가 삽입된 이방향 중공슬래브의 뚫림전단 성능에 대해, 해석결과 경량체 량과 위치에 따라 최대 뚫림전단강도는 기준 실험체에 비해 74.3%, 73%의 강도저하를 나타내는 것으로 알 수 있었다. 이는 실험상의 강도저하 값인 84.1%, 56.4%와 다소 차이가 있으며, 해석에서 중공부 주위의 응력집중 현상이 제대로 반영되지 않은 것으로 판단된다. 또한 이방향 슬래브에 경량체를 삽입 할 경우 경량체가 시작하는 부분에서 응력이 급격히 감소하는 현상이 나타났으며, 이러한 급격한 응력감소는 기둥 주위 위험단면의 변화를 가져오는 것으로 추정된다. 즉, 위험단면의 변화는 기둥으로부터 경량체 사이의 거리에 따라 달라지며, 위험단면 내의 콘크리트 단면 손실은 뚫림전단 강도를 감소시킨다. 본 연구에서는 이방향 중공슬래브의 뚫림전단강도를 산정할 수 있는 근사식을 제안하였으며, 보다 정확한 이방향 중공슬래브의 뚫림전단강도의 산정식을 위해서는 위험단면의 변화와 콘크리트 단면손실로 인한 전단강도 저하의 관계에 대한 추가적인 연구가 필요하다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.5
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• pp.483-487
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• 2014

In this study, joining methods with SiC powder as the joining adhesives were studied in order to avoid the residual stresses coming from CTE (Coefficient of Thermal Expansion) mismatch between substrate and joining layer. The shear strength and microstructure of joined material between SiC substrates are investigated. The commercial Hexoloy-SA (Saint-Gobain Ceramics, USA) used in this work as substrate material. The fine ${\beta}$-SiC nano-powder which the average particle size is below 30 nm, $Al_2O_3$, $Y_2O_3$, and $SiO_2$ were used as joining adhesives. The specimens were joined with 20MPa and $1400-1900^{\circ}C$ by hot pressing in argon atmosphere. The shear test was performed to investigate the bonding strength. The cross-section of the joint was characterized by using an optical microscope and scanning electron microscopy (SEM).

• Journal of Korean Society of Steel Construction
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• v.16 no.5 s.72
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• pp.505-517
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• 2004

This paper presented equations on the stress evaluation of steel frame pier connections that were composed of a box beam and a circular column. The existing equations, which transformed the circular column into an equivalent box column had some problems; they underestimated a shear lag stress as the joint angle decreased, and overestimated a shear stress as the joint angel increased. Therefore, FE analyses were performed with various parameters, such as joint angle(${\alpha}$), span length-width ratio(L/B), and circular column-to-box beam stiffness ratio(${\alpha}$), and new equations on stress evaluation were proposed based on FE analyses. Furthermore, material and geometric nonlinear analyses were performed to estimate ultimate strength and to confirm the validity of the proposed equations.