• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Journal of Welding and Joining
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• v.27 no.1
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• pp.65-70
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• 2009

Ir-192 radiation sealed sources are widely employed to the therapeutic applications as well as the non-destructive testing. Production of Ir-192 sources requires a delicate but robust welding technique because it is employed in a high radioactive working environment. A GTA(Gas Tungsten Arc) welding technique is currently well established for this purpose. However, this welding method requires a frequent replacement of the electrode, which results in the delay of the production to take a preparatory action such as to isolate the radiation sources from the working place before getting access to the welding machine. Hence, a resistance welding technique is considered as an alternative method of the GTA welding technique. The advantages of resistance welding are high welding speed and high-rate production. Also it has very long life of electrode comparing to GTA welding. In this study, the resistance welding system and proper welding conditions were established for sealing Ir-192 source capsule. As a results of various experiments, it showed that electrode displacement can be employed as a indicator to predict welding quality. We proposed two mathematical models(linear and curvilinear) to estimate electrode displacement with process parameters such as applied force, welding current and welding time by using regression analysis method. Predicting results of both linear and curvilinear model were relatively good agreement with experiment.

• Journal of Welding and Joining
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• v.32 no.5
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• pp.32-43
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• 2014

Welding and joining technology has become a core field. Therefore it is more widely applied to nonferrous metals, inorganic and polymeric materials. That is because the high performance, high function and diversification trend of materials used as industrial technology develops. In the laser welding process, STS 304 and SCP1-S were used as the base materials, the output density was fixed $7MW/cm^2$, the protective gas was argon(Ar) and the transfer rate was fixed 5 mm/sec. and it was progressed while the magnetic field is gradually increasing by 100 mT ranging 0 to 400 mT. The tensile test showed in average about 6 % tensile strength improvement in the case of the laser welding process using the magnetic fields. In the shielded metal arc welding process using SPHC only or the combination of SPHC+STS304 as base materials. The electric current was set at 80 Amperes and the protective gas used argon(Ar) the same as the laser welding process and the strength of magnetic fields. In the shielded metal arc welding process using the magnetic fields, the tensile tests showed about 5 % tensile strength improvement in the case of using SPHC only, 3 % tensile strength improvement in the case of using the combination of SPHC+ STS304. In comparing the results of numerical analysis to the results of experimental tests, it was revealed that the temperature, thermal stress distribution and the behavior of molten pool were similar to those of real tests. Consequently, it may be considered that the numerical assumption and the analytical model used in this study were reasonable.

• Journal of the Korean Applied Science and Technology
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• v.30 no.1
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• pp.49-56
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• 2013

Excellent electron transport properties with enhanced light scattering ability for light harvesting have made well-ordered one dimensional $TiO_2$ nanotube(TNT) arrays an alternative candidate over $TiO_2$ nanoparticles in the area of solar energy conversion applications. The principal drawback of TNT arrays being activated only by UV light has been addressed by coupling the TNT with secondary materials which are visible light-triggered. As well as extending the absorption region of sunlight, the introduction of these foreign components is also found to influence the charge separation and electron lifetime of TNT. In this study, a novel method to fabricate the TNT-based composite photoelectrodes employing visible responsive $CuInS_2$ (CIS) nanoparticles is presented. The developed method is a square wave pulse-assisted electrochemical deposition approach to wrap the inner and outer walls of a TNT array with CIS nanoparticles. Instead of coating as a dense compact layer of CIS by a conventional non-pulsed-electrochemical deposition method, the nanoparticles pack relatively loosely to form a rough surface which increases the surface area of the composite and results in a higher degree of light scattering within the tubular channels and hence a greater chance of absorption. The excellence coverage of CIS on the tubular $TiO_2$ allows the construction of an effective heterojunction that exhibits enhanced photoelectrochemical performance.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.110-110
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• 2017

마이크로 플루이딕 디바이스는 화학, 생물학 실험 및 생체 의학 진단을 위한 플랫폼으로 지난 20년간 그 사용 및 연구가 증가되어 왔다. 마이크로 플루이딕 디바이스를 제작하는 데 있어 가장 일반적으로 사용되는 재료는 실리콘이지만 비용이 많이 들고 불투명하므로 광학 검출이 필요한 곳에 적용이 제한된다. 이러한 측면에서 열가소성 플라스틱은 상업화의 중요한 요소인 대량 생산에 있어 큰 잠재력을 가지고 있으며 저렴하고, 가공이 쉽고, 유연하고, 광학적으로 투명하고, 화학적으로 불활성이며, 생체적합성을 가진다. 본 연구에서는 열가소성 플라스틱의 일종인 PMMA Poly(methylmethacrylate)를 효율적으로 접합하기 위해 비교적 낮은 온도와 낮은 압력에서 에탄올을 활용한 접착방식을 개발하였다. 먼저, PMMA 기판의 전체 표면을 $80^{\circ}C$에서 20 분 동안 에탄올로 처리한 후, $60^{\circ}C$에서 20 분간 열 압착하는 방식으로 영구적인 결합이 이루어졌다. 결합 강도 및 채널의 sealing 정도를 확인하기 위해, 인장 강도, 누수 및 파열 테스트를 수행하였다. 결합강도는 약 12.4 MPa로 타 연구와 비교할 때 매우 높았으며 마이크로 채널의 전체 내부 체적보다 거의 450 배 높은 강한 액체 흐름을 견딜 정도로 견고한 결합이 유지되었다. 열가소성 플라스틱의 본딩에 사용되는 유기 용매는 광학 특성을 희생시키지 않으면서 결합 속도를 높일 수 있지만, 결합 공정 중에 용매로 인해 마이크로 채널이 막히는 현상이 발생될 수 있다. 따라서, 견고한 본딩을 유지하면서 채널 막힘을 방지하기 위해 마이크로 채널을 소수성으로 선택적으로 처리하여 내벽의 표면 특성을 튜닝해 주는 기법을 추가로 적용하였다. 본 연구에서 사용한 방법은 아민-PDMS (polydimethylsiloxane) 링커를 적용하여 기판 표면의 극성을 변경시켜 주었다. 아민-PDMS 링커는 PC (polycarbonate), PET (polyethylene terephthalate), PVC (polyvinyl chloride) 및 PI (polyimide)와 같은 다양한 열가소성 플라스틱의 표면 소수성을 현저히 증가시키며 화학적, 열적 안정성이 뛰어나다. 아민-PDMS 링커는 PMMA의 카보닐 그룹과 반응할 수 있는 아민 사이드 그룹을 포함하는 PDMS 백본으로 구성되며 처리된 대상표면을 소수성으로 만든다. 아민-PDMS 링커 처리 이후 채널은 소수성으로 변화되었으며 이는 접촉각(contact angle)의 증가로 확인되었다. 코팅된 채널을 에탄올로 30분간 80도에서 처리하여도 소수성은 그대로 유지되어 마이크로 채널의 선택적인 소수성 코팅이 성공적으로 수행되었다.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.463-469
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• 2013

In the previous work, a new forging process design, which included incremental upsetting, diffusion bonding and cogging, was suggested as a method to manufacture 1.9wt%C ultrahigh carbon workrolls. The previous study showed that incremental upsetting and diffusion bonding are effective in closing voids and healing of the closed void. In addition, compression tests of the 1.9wt%C ultrahigh carbon steel revealed that new microvoids form within the blocky cementite at temperatures of less than $900^{\circ}C$ and that local melting can occur at temperatures over $1120^{\circ}C$. Thus, the forging temperature should be controlled between 900 and $1120^{\circ}C$. Based on these results, incremental upsetting and diffusion bonding were used to check whether they are effective in closing and healing voids in a 1.9wt%C ultrahigh carbon steel. The incremental upsetting and diffusion bonding were performed using sub-sized specimens of 1.9wt%C ultrahigh carbon steel. The specimen was deformed only in the radial direction during the incremental upsetting until the reduction ratio reached about 45~50%. After deformation the specimens were kept at $1100^{\circ}C$ for the 1 hour in order to obtain a high bonding strength for the closed void. Finally, microstructural observations and tensile tests were conducted to investigate void closure behavior and bonding strength.

• Journal of Welding and Joining
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• v.28 no.5
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• pp.51-57
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• 2010

Brittle microstructure created in a heat affected zone (HAZ) during the welding of low alloy steel can be eliminated by post-weld heat treatment (PWHT). If the PWHT is not possible during a repair welding, the controlled bead depositions of multi-pass welding should be applied to obtain tempering effect on the HAZ without PWHT. In order to anticipate and control the tempering effect during the temper bead welding, the definition of temperature curve obtained from the analytical solution was suggested in this research. Because the analytical solution for heat flow is expressed as a mathematical equation of weld parameters, it may be effective in anticipating the effect of each weld parameter on the tempering in HAZ during the successive bead depositions. The reheating effect by the successive bead layer on the brittle coarse grained HAZ formed by earlier bead deposition was estimated by comparing the overlapped distance between the temperature curves in the HAZ. Three layered weld specimens of SA508 base metal with A52 filler were prepared by controlling heat input ratio between layers. The tempering effect anticipated by using the overlapped distance between the temperature curves was verified by measuring the micro-hardness distribution in the HAZ of prepared specimens. The temperature curve obtained from analytical solution was expected as a good tool to find optimal temper bead welding conditions.

• Journal of Welding and Joining
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• v.26 no.2
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• pp.85-91
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• 2008

In general, the quality of a welding process tends to vary with depending on the work environment or external disturbances. Hence, in order to achieve the desirable quality of welding, we should have the optimal welding condition that is not significantly affected by these changes in the environment or external disturbances. In this study, we used a dual response surface method in consideration of both the mean output variables and the standard deviation in order to optimize the V-groove arc welding process. The input variables for GMA welding process with the dual response surface are welding voltage, welding current and welding speed. The output variables are the welding quality function using the shape factor of bead geometry. First, we performed welding experiment on the interested area according to the central composite design. From the results obtained, we derived the regression model on the mean and standard deviation between the input and output variables of the welding process and then obtained the dual response surface. Finally, using the grid search method, we obtained the input variables that minimize the object function which led to the optimal V-groove arc welding process.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.