• Korean Journal of Materials Research
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• v.7 no.2
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• pp.102-106
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• 1997

Micro gas sensors including thin film catal) tic type require stress-free memhrancs for etch stop of Si anisotropic etching and sublayer of sensing elements hecause stress is one of the main factors affecting breakdown of thin membranes. This paper reports the effects of deposition conditions on stress and refractive index of $SiN_{x}/SiO_{x}/(NON)$ films deposited by low pressure c11ernic;rl vapor deposition(L, t'CVI)) 2nd reactve sputtering. In the case of I.PCVI1, the stresses of $SiN_{x}$ and NON films arc $7.6{\times}10^{8}dyne/cm^2$ and $3.3{\times}10^{8}dyne/cm^2$, respectibely, and the refractive indices are 3.05 and 152, respectively. In the cxse oi the sputtered SiN, , compressi\e stress decreased in magnitude and then turned to tensility as increasing proc, ess pressure by lmtorr to 30mtorr and cicreasmg applied power density by $2.74W/cm^2$ to $1.10W/cm^2$. The hest value of film stress obt;~ined under condition of lOmtorr and $1.37W/cm^2$ in this' experiment was $1.2{\times}10^{9}dyne/cm^2$ cnnipressive. The refr~ict~ve index decreased from 2 05 to 1 89 as decreasing applied power density by lnitorr to 3Orntorr and increasing process pressure hy $2.74W/cm^2$ to $1.10W/cm^2$. Stresses of films deposited by both LPCVL) and sputtering decreased as incre;lsing temperature and showed plastic behavior as decreasing temperature.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2017.04a
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• pp.158-158
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• 2017

비닐포장 하부에 위치한 콩의 생장 초기에 발생한 초엽을 인식하기 위한 연구를 수행중이다. 선행 연구에서 비닐포장에 접촉한 콩 초엽으로 인해 비닐포장 상부 표면의 열 반응 분포에 변화가 있음을 발견하였다. 현장에서 주행 중에 콩 초엽의 위치를 실시간으로 인식하고 연동된 선형 또는 회전형 엑츄에이터를 제어하여 정확한 위치에 천공을 수행하기 위해서는 계측 시스템과 제어 시스템간의 시간적 차이를 최소할 수 있는 실시간 신호 처리 기술이 필수적이다. 선행 연구에서 사용한 다중 IR 센서의 분해능은 $16{\times}4pixel$이며 주파수는 3 Hz로, 폭이 30cm 내외인 비닐포장 상부의 정밀 분석에 한계가 있음을 발견하였다. 이를 해결하기 위하여 분해능과 계측 주기를 개선할 수 있는 초소형 ($1cm{\times}1cm{\times}1cm$) 열화상 센서를 이용하였다. LWIR(Longwave infrared)영역에 해당하는 $8{\mu}m{\sim}14{\mu}m$의 영역에서 $0.05^{\circ}C$의 분해능을 보이는 $ Lepton^{TM}$ (500-0690-00, FLIR, Goleta, CA)모델을 사용하였다. 프레임당 $80{\times}60$ 픽셀의 정보가 2 Byte의 단위로 계측이 되며 9 Hz의 주파수로 대상면의 열 분포를 측정할 수 있다. 이론적으로 초당 정보 전송량은 86,400 Byte ($80{\times}60{\times}2{\times}9$)이며, 1 m를 진행하는 주행형 천공기에 적용할 경우 1 프레임당 10cm 정도의 면적을 측정하므로, 최대 위치 판정 분해능은 약 10 cm / 60 pixel = 0.17 cm/pixel로 상대적으로 정밀한 위치 판별이 가능하다. $80{\times}60{\times}2Byet$의 정보를 0.1초 이내에 분석해야 하는 기술적 과제를 해결하기 위하여 천공 작업기에 적합한 상용 SBC(Single board computer)의 클럭 속도(1 Ghz)로 처리 가능한 공간 분포 분석 알고리즘을 개발하였다. 전체 이미지 도메인을 한 번에 분석하는데 소요되는 시간을 최소화하기 위하여 공간정보 행렬을 균등히 배분하고 별도의 프로세서에서 Feature를 분석한 후 개별 프로세서의 결과를 경합식으로 판정하는 기술을 연구하였다. 오픈 소스인 MPICH(www.mpich.org) 라이브러리를 이용하여 개발한 신호 분석 프로그램을 클러스터링으로 연동된 개별 코어에 설치/수행 하였다. 2D 행렬인 열분포 정보를 공간적으로 균등 분배하여 개별 코어에서 행렬의 Spatial domain analysis를 수행하였다. $20{\times}20$의 클러스터링 단위를 이용할 경우 총 12개의 코어가 필요하였으며, 초당 10회의 연산이 가능함을 확인하였다. 병렬 클러스터링 기술을 이용하여 1m/s 내외의 주행 속도에 대응이 가능한 비닐포장 상부 열 분포 분석 시스템을 구현하였다.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.224-232
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• 2000

Aluminum metal process in surface micromachining enables to fabricate Al electrodes or Al structures, which improve electrical characteristics by reducing contact- and line-resistance or makes the whole process to be simple by using oxide as sacrificial layer. However, it is not possible to use conventional sacrificial layer etching process, because HF solution attacks aluminum as well as sacrificial oxide. The mixed solution of BHF and glycerine as an alternative shows the adequate properties to meet with this end. The exact etching properties, however, are sensitively depends on the geometry of the released structure, because the most etching process of sacrificial layer proceeds to the lateral direction in narrow space. Also, the surface roughness of aluminum affects to the etching characteristics. This paper reports experimental results on the effect of microstructure and surface roughness of aluminum to the etching properties. Considering these effects, we propose the optimized etching condition, which can be used practically for the fabrication of aluminum electrodes and microstructures by using standard surface micromachining process without modification or additional process.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.3
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• pp.96-101
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• 2015

This paper describes a design and implementation of the NFC bridge chip which performs interface between kinds of devices and mobile phones including NFC controller through NFC communication. The NFC bridge chip consists of the digital part and the analog part which are based on NFC Forum standard. Therefore the chip treats RF signals and then transforms the signal to digital data, so it can interface kinds of devices with the digital data. Especially the chip is able to detect RF signals and then wake up the host processor of a device. The wakeup function dramatically decreases the power consumption of the device. The carrier frequency is 13.56MHz, and the data rate is up to 424kbps. The chip has been fabricated with SMIC 180nm mixed-mode technology. Additionally an NFC bridge chip application to the blood glucose measurement system is described for an application example.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2018.10a
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• pp.329-331
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• 2018

In this paper, we propose a monitoring system that starts with the supply of raw materials for threading, is processed into a lathe machine, and checks for defects of the product are automatically performed by the robot with Smart Factory technology through assembly and disassembly. Completion check according to the production instruction quantity and production instruction is made by checking the production status according to whether or not the raw material is worn by the displacement sensor, and checking the pitch and the contour of the processed female and male to determine OK and NG. The robotic system acts as a relay for loading and unloading of raw materials, pallet transfer, and overall process, and it acts as an intermediary for organically driving. The location information of the threaded products is collected by using the non-contact wireless tag and the energy saving system Production efficiency and utilization rate were checked. The environmental sensor collects the air-conditioning environment data (temperature, humidity), measures the temperature and humidity accurately, and checks the quality of product processing. It monitors and monitors the driving hazard level environment (overheating, humidity) of the product. Controls for CNC and robot module PLC as a heterogeneous system.

• Fire Science and Engineering
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• v.34 no.3
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• pp.67-75
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• 2020

In this study, the risk of heat generation due to normal and overload currents that vary with the abnormal loosening angle of wire-connecting bolts were identified. The risks were analyzed based on the thermal characteristics to minimize the carbonization accidents of terminal blocks inside distribution panels typically used in industrial sites. We applied a method for measuring the heating temperature and temperature variations in the terminal blocks in real-time by installing a resistance temperature detector sensor board in the terminal block. The experimental results showed that the terminal block model with a low-rated current exhibited a higher heating temperature, thus, confirming the need to select the terminal block capacity based on load currents. Additionally, the higher the rated current of the terminal block with a high-rated current and the higher the degree of loosening, the faster the carbonization point. Such heating temperature monitoring enabled real-time thermal temperature measurement and a step-by-step risk level setting through thermal analysis. The results of the measurement and analysis of carbonization risks can provide a theoretical basis for further research regarding the risk of fire due to carbonization. Furthermore, the deterioration measurement method using the temperature sensor board developed in this study is widely applicable to prevent fires caused by poor electrical contact as well as risk-level management.

• Journal of Sensor Science and Technology
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• v.8 no.3
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• pp.239-246
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• 1999

A highly sensitive photovoltaic infrared photodiode was fabricated for detecting infrared light in $3{\sim}5\;{\mu}m$ wavelength range on InSb wafer with p-i-n structure grown by MOCVD. Silicon dioxide($SiO_2$) insulating films for the junction interface and surface of photodiode were prepared using RPCVD because InSb has low melting point and evaporation temperature. After formation of In ohmic contacts by thermal evaporation, the electrical properties of the photodiode were characterized in dark state at 77K. A product of zero-bias resistance and area($R_0A$) showed $1.56{\times}10^6\;{\Omega}{\cdot}cm^2$ that satisfied BLIP(background limited infrared photodetector) condition. When the photodiode was tested under infrared light, the normalized detectivity of about $10^{11}\;cm{\cdot}Hz^{1/2}{\cdot}W^{-1}$ was obtained. we successfully fabricated a unit cell with InSb IR array with good quantum efficiency and high detectivity.

• Journal of Sensor Science and Technology
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• v.6 no.5
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• pp.407-413
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• 1997

The crystallized CuPc(copper phthalocyanine) film on a p-type <100> Si substrate is prepared at the substrate temperature of $300^{\circ}C$ by thermal evaporation. X -ray diffraction analysis showed the CuPc film to have a-axis oriented structure. For the measurement of photovoltaic characteristics of the CuPc/Si film and the Si substrate, a transverse current-voltage (I-V) curve is observed. In the dark, the Au/Si junction is shown to be ohmic contact. However, under illumination, a photovoltaic effect is not observed. The I-V curve in the dark indicates that the CuPc film on Si may form an ohmic contact. Since the CuPc film is a p-type semiconductor, the CuPc/p-Si junction has no barrier at the interface. Under illumination, the CuPc/Si junction shows a large photocurrent comparing with that of the wafer. The result indicates that the CuPc layer plays an important role in the photocarrier generation under red illumination (600 nm). The CuPc/Si film shows the photo voltaic characteristics with a short-circuit photocurrent ($J_{sc}$) of $4.29\;mA/cm^{2}$ and an open-circuit voltage ($V_{oc}$) of 12 mA.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.1023-1026
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• 2006

There are some cases in trouble with monitoring emergency patient by existing electrode sensor in measuring instrument in home and hospital etc. And there are problem to measure because of coming down electrode in emergency car or vessel of shaking and fat, humidity of patient. In this study, it has designed band-type for patient to put on the breast easily and go around anywhere freely putting band electrode on his body. Gold has used as electrode material in this electrocardiogram because of its excellent electronic resistance peculiarity and no trouble with skin. And it is able to monitor multi-body-signal by additional design of periphery temperature. There are good results of body signal transmission in the breast or the rib, and get a little body signal in abdomen. We get a result it is better case of gold than usual electrode on signal detection, and know usual electrode was disposable, but we have more correct result from gold electrode sensor, being semi-permanent ana. great contact ability even if movement.

• Smart Media Journal
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• v.13 no.6
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• pp.54-61
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• 2024

Recently, due to the increase in domestic and international online e-commerce platforms and the increase in container traffic at domestic ports, the operating ratio of large trucks has increased, and the number of truck fires is continuously increasing. In particular, spontaneous combustion is the most common cause of truck fires. Various academic approaches have been attempted to prevent truck fires, but due to the lack of research on the spontaneous tire ignition phenomenon that occurs during braking, this research directly designed and manufactured an experimental device to establish an environment similar to the braking system of a truck. A non-contact temperature sensor was installed on the brake device of the experimental device to collect temperature data generated from the brake device. Based on the data collected from the temperature sensor of the brake device and the temperature sensor on the tire surface, the ARIMA model among the time series prediction models was used to Appropriate parameters were selected to suit the temperature change trend, and as a result of comparing and analyzing the measured and predicted data, an accuracy of over 90% was obtained. Based on this, a plan was proposed to reduce the rate of fires in trucks by providing real-time warnings and support for truck drivers to respond to overheating phenomena occurring in the braking system.