• Title/Summary/Keyword: 접착체결

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Design and Analysis on Composite Structure for Aircraft Certification (항공기 인증을 위한 복합재 구조물 설계/해석)

  • Kim, Sung-Joon;Choi, Ik-Hyeon;Ahn, Seok-Min;Yeom, Chan-Hong
    • Aerospace Engineering and Technology
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    • v.8 no.1
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    • pp.42-48
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    • 2009
  • There are a number of factors affecting the continued airworthiness of composite structure. Unlike metal structure, damages made in manufacturing processes or maintenance repair procedures need to be considered. The different levels of degradation and damage, which may occur, must be considered for structural substantiation of static strength, stiffness, flutter, and damage tolerance. This can start with an evaluation of environmental effects for the particular composite material. Matrix-dominated composite properties, such as compressive strength, are most sensitive to moisture absorption and temperatures. Static strength substantiation includes the smaller damages that will not be detected in production or maintenance inspection while damage tolerance addresses larger damages that need to be repaired once discovered. In this paper, we intend to list the airworthiness regulations and advisory circular that are deemed closely related to the certification of composite airplanes.

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Reliability assessment of RPCB and FPCB Joints bonded using Thermo-compression (열 압착으로 접합된 RPCB와 FPCB 접합부의 신뢰성 평가)

  • Jang, Jin-Kyu;Lee, Jong-Gun;Lee, Jong-Bum;Ha, Sang-Su;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.81-81
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    • 2009
  • 최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

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A Fracture Study on the Bonded DCB Specimen of the Mode III Type with Aluminum Foam (알루미늄 폼으로 된 Mode III 형의 접합된 DCB 시험편에 대한 파괴 연구)

  • Lee, Jung-Ho;Cho, Jae-Ung;Cheon, Seong-Sik
    • Composites Research
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    • v.28 no.4
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    • pp.191-196
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    • 2015
  • In this study, the static analysis and experiment were carried out on DCB specimens manufactured with aluminum foam in order to investigate the fracture toughness at the adhesive joint of the structure bonded with adhesive. In case of static analysis, all specimen models were shown to have the maximum reaction force when the forced displacement proceeded as much as 5 mm. The maximum reaction forces became 0.25 kN, 0.28 kN and 0.5 kN respectively in cases of specimen thicknesses of 35 mm, 45 mm and 55 mm. Two specimens in case of static experiment were selected to verify these analysis results. The maximum reaction forces were shown when the forced displacement proceeded as much as 5 to 6 mm. The maximum reaction forces became 0.22 kN and 0.3 kN respectively in cases of specimen thicknesses of 35 mm and 45 mm. By comparing the derived results, it could be shown that there was not much difference between the data of analyses and experiments. Therefore, It is inferred that the study data can be secured with only analysis by no extra experimental procedure. It is thought that the mechanical properties at the structure bonded of DCB with the type of mode III can be analyzed systematically.

A Study on the Black Box Design using Collective Intelligence Analysis (집단지성 분석법을 활용한 블랙박스 디자인 개발 연구)

  • Lee, Hee young;Hong, Jeong Pyo;Cho, Kwang Soo
    • Science of Emotion and Sensibility
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    • v.21 no.2
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    • pp.101-112
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    • 2018
  • This study was carried out to enhance the competitiveness of blackbox design for domestic and international companies, based on the explosive growth of the blackbox market due to development of blackbox design for vehicle accident prevention and post-treatment. In the past, the blackbox market has produced products indiscriminately to meet the ever-increasing demand of consumers. Therefore, we thought a new design method was necessary to effectively investigate the needs of rapidly changing consumers. In this study, we aimed to identify the best-selling blackbox to understand the design flow, and the optimum area for a blackbox, considering the uniqueness of associated vehicle. Based on discussion with blackbox design experts, we studied the direction of design and the problems with blackbox use, which were reflected in blackbox development. Through this research, two types of design - leading blackbox (A type) and mass production blackbox (B type) - were proposed for compatibility of the blackbox with the car. The leading type of blackbox was positioned so that it was wrapped with the room mirror hinge before the screw was fastened, in order to achieve an integrated design. Therefore, we designed an integrated form and resolved the placement problem of an adhesive blackbox. To blend, the mass production blackbox implemented material and surface processing in the same way with the car, and adopted the slide structure to automatically turn off the main body power when removing the SDcard, reflecting consumer needs. This study considers evolving consumer needs through a case study and collective intelligence and deals with implementation of the whole design process during mass production. In this study, we aimed to strengthen the competitiveness of the blackbox design based on design method and its realization.