Adhesion Strength of Sputter Type 2 Layer Flexible Copper Clad Laminate with Electroplating Conditions and Preferred Orientation of Plated Cu Layer (Sputtering 방식 2층 FCCL(Flexible Copper Clad Laminate)의 동도금 조건 및 동도금층 우선 방위에 따른 접착 강도)
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- Proceedings of the Korean Institute of Surface Engineering Conference
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- 2005.11a
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- pp.126-126
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- 2005