• Journal of the Korean Society of Propulsion Engineers
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• v.10 no.2
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• pp.110-114
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• 2006

The study has been performed on the improvement of bonding process and bond strength of HTPB propellant and liner using a polymeric curative. In case of liner using polymeric curative prepared from reaction of HTPB and TDI, migration of curative was decreased at bond interface. So EPDM insulation sanding and Desmodur RE coating process could be omitted in motor case preparation and bond strengths between the HTPB propellant and liner were increased. Also deterioration phenomena of bond strength could not be observed in accelerated aging test.

• Journal of Yeungnam Medical Science
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• v.8 no.1
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• pp.127-135
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• 1991

Successful middle ear surgery requires the availability of al safe, effective bonding material. Side effect caused by synthetic materials have led to the use of biologic adhesive. However, they carry the risk of transmission of infectious diseases if they are prepared from pooled human blood. The adhesive strength of ammonium sulfate fibrin adhesive produce an adhesive strength that is half that of the homologous commercial product. It is, however, good enough for use in several otolaryngological operations, tympanoplasty, facial nerve repair, reconstruction of ossicles, reconstruction of posterior wall of ear canal and obliteration of frontal sinus and mastoid antrum using bone dust.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.386-386
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• 2010

최근 널리 보급되고 있는 치과용 임플란트는 티타늄(Ti) 또는 티타늄 합금(Ti-6Al-4V) 보철과 크라운을 연결하여 사용하고 있다. 티타늄은 생체 친화성이 우수하나, 생체 활성도가 없어 치유기간이 긴 단점이 있다. 이를 보완하기 위해 인체 경조직과 유사한 수산화아파타이트(hydroxyapatite, $Ca_{10}(PO_4)_6(OH)_2)$를 티타늄 임플란트 표면에 코팅하는 방법이 연구되고 있으나 수산화아파타이트 코팅은 티타늄과의 접착성이 나쁘기 때문에 시술 및 사용과정에서 코팅층이 임플란트로부터 박리되는 문제점이 있다. 본 연구에서는 티타늄과 수산화아파타이트 사이에서 접착력을 향상시키는 buffer layer로서 지르코니아(8YSZ, 8mol% Yttria-stabilized zirconia)를 연구하였다. 지르코니아는 고온에서 안정하며, 티타늄 합금과 수산화아파타이트 사이의 반응을 방지하며, 박막밀도와 기계적 강도가 좋은 생체세라믹스이다. 지르코니아 박막을 펄스 레이저 증착법을 이용하여 증착 온도 $600^{\circ}C$, 레이저 fluence $2\;J/cm^2$에서 산소($O_2$) 분압을 바꿔 가며 증착하였다. 그 위에 수산화아파타이트 박막을 역시 펄스 레이저 증착법으로 증착하였다. Scratch test와 Pull-off test를 통해 접착력을 평가한 결과 지르코니아 buffer layer 삽입에 의해 티타늄 합금과 수산화아파타이트 사이의 접착력이 향상되었음을 확인하였다. 또한 산소분압이 박막의 특성 및 접착력에 미치는 영향을 고찰하였다.

• Journal of the Korea Computer Graphics Society
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• v.25 no.1
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• pp.1-11
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• 2019

More force must be applied when dragging a wet compared with a dry cloth lying on the table. Increased force is needed because the fluid between the cloth and the surface of the table produces an adhesion force. In this paper, we study the adhesion force between a wet cloth and the surface of an object. To compute the adhesion force, we used the adhesion force model used in textile research based on real-world experiments and also considered the effect of wrinkles, which, to our knowledge, has not been investigated in previous work. Furthermore, we studied the phenomenon in which a wet cloth adheres to the surface of an object and that in which a wet cloth adheres to itself when undergoing self-collision.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.168-169
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• 2015

금속 박막과 폴리머 기판 사이에 접착력을 증대시키는 방법으로 금속-폴리머 계면에 나노 임프린트 구조체를 이용하는 방식을 최초로 이용하였다. 나노선 어레이 형상을 가진 몰드와 열 임프린트 방식을 이용하여 폴리머 기판 표면 위에 나노선 어레이 형상을 임프린트 하고, 열 증착 방식으로 금속 박막을 올렸다. 본 연구에서 제작된 금속-임프린트 폴리머 계면에서 높은 기계적 굽힘성 및 접착력을 가지는 것을 확인하였다.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.21-32
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• 2003

Various methods for adhesion measurement, which are related to previously published paper [J. of Soc. of Adhe. and Inter, 3,4 (2002)], are reviewed. At first, the prerequisite for the ideal adhesion strength measurement is considered, and three categories of methods for adhesion measurement, such as mechanical, non-mechanical methods and miscellaneous methods, are introduced.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.101-107
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• 2004

각종 전자기기의 소형화, 고성능화 요구에 따라 회로 또는 기판의 고집적화에 따른 대안으로 도입된 COF(Chip On Film)공정에서 PI(polyimide)/buffer layer/Cu의 접착력 개선을 목적으로 본 연구가 진행 되었다. 그리고 buffer layer로써 Cr을 증착 할 때 부착력의 개선을 목적으로 개질처리를 할 때는 RF plasma장비를 사용하였다. 실험 변수로는 peel strength에 대한 buffer layer의 종류와 증착시간, 표면 개질처리시 $O_2$/Ar비이다. Buffer layer의 종류에 따른 접착력은 Cr보다 Ni이 우수하였고 peel strength와 Cu THK는 같은 buffer layer의 증착 structure에서 비례 관계를 나타냈으며, Cr의 증착 시간과 Cu의 증착 시간을 변수로 peel strength test한 값은 Cr증착시간이 30초, Cu증착시간이 20분일때 40g/mm로 최적의 접착력이 나타났다. 증착전 PI의 개질 처리시 $O_2$/Ar 유량비에 따른 peel strength값은 $O_2$/Ar유량비가 증가 할수록 향상되었으며, 2/5에서 최고값인 58g/mm가 나타났다. 그 이상에서는 오히려 감소하였다.

• Journal of the Korean Wood Science and Technology
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• v.42 no.1
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• pp.34-40
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• 2014

The effect of neonicochid type wood preservatives on adhesive properties of resorcinol-formaldehyde resin for laminated wood manufacture was examined. By the previous studies, it was verified that the neonicochid type preservative has a high termite-proofing and anti-mold effectiveness. Commercial ACQ (ammoniacal copper quaternary compounds) and CUAZ (copper azol compounds) were used as comparison preservatives of effects on adhesive properties. The wood specimens used japanese red pine (Pinus densifrora) after application with preservatives and then bonded with resorcinol-formaldehyde resin. Adhesive properties were evaluated by shearing strength of adhesive bond and wood failure to dry condition or after accelerated aging test. Of all laminated woods, the wood specimens spread with ACQ or CUAZ showed the lowest shearing strength of adhesive bond. We estimated that the decrease of shearing strength was caused by copper in the ACQ or CUAZ preservatives. On the application of the neonicochid type preservatives, the wood specimens showed the highest shearing strength even after accelerated aging test. From these results, it is concluded that the copper-free neonicochid type preservative not affected the curing of resorcinol-formaldehyde resin.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.992-999
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1160-1169
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• 1999

In this study, the silane primers were introduced to improve the interface adhesion between copper and epoxy. Especially, the polymer types obtained by solution and emulsifier-free emulsion polymerization of vinyltriethoxysilane and the low molecular weight types of 3-aminopropyltriethoxysilane(3-APTES) and 3-glycidoxypropyltrimethoxysilane(3-GPTMS) were used to improve the adhesion strength between epoxy and copper. Also, the surface of copper was treated by 1,1,1-trichloroethane. According to the results, the interfacial adhesion strength of copper-epoxy increased about 2~5 times with the introduction of silane primer. Also, the optimum treatment time of copper surface was about 10 minutes. Additionally, the adhesion strength as a function of concentration of low molecular weight silane was maximum at about 0.5 vol.% for 3-APTES and about 0.2 vol% for 3-GPTMS.