• Journal of Adhesion and Interface
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• v.7 no.3
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• pp.16-25
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• 2006

Water vapour permeable and water resistant film was laminated to made footwear woven fabric and non-woven fabrics by screen type with thermosetting reactive hot melt adhesive. Optimum conditions of each process were investigated, and the properties of film laminated fabric with optimum conditions are evaluated. The results are as follows. Thermosetting reactive polyurethane hot melt is retain proper heat resistance differently thermoplastic hot melt. Optimum melting adhesive process conditions are as follows ; drum temperature $95^{\circ}C$, hose temperature $97^{\circ}C$, feeding pipe temperature $100^{\circ}C$, screen temperature $105^{\circ}C$, pressure of opposite roller $1kgf/cm^2$, pressure of laminating roller $3kgf/cm^2$, finishing speed 15 m/min, melting temperature $120^{\circ}C$, cooling time 20 s, pressing temperature $130^{\circ}C$, pressing time 30 s. As the thickness of film was increased, the water vapour permeability was decreased but water resistance was increased, and the effect of film is dominant over all the others in the air permeability.

• Composites Research
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• v.35 no.2
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• pp.86-92
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• 2022

This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.

• Journal of Adhesion and Interface
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• v.14 no.3
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• pp.146-159
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• 2013

In the present study, stabilized rayon fabrics were prepared from fast isothermal stabilization processes, which were carried out within four minutes at $350^{\circ}C$. The effects of ultrasonic cleaning and chemical pre-treatment on the chemical composition, physical characteristics, X-ray diffraction pattern, thermal stability and shape of the stabilized rayon fabrics were investigated extensively. In order to reduce the weight loss and thermal shrinkage of rayon fabrics occurring during the stabilization process, ultrasonic cleaning was first conducted and then chemical pre-treatments using $NH_4Cl$, $Na_3PO_4$, $H_3PO_4$, and $ZnCl_2$ were performed, respectively. The results indicated that both ultrasonic cleaning and chemical pre-treatment influenced the weight loss, thermal shrinkage, microstructure, carbon content, thermal stability and fabric shape of stabilized rayon fabrics. Also the results depended on the fast-stabilization time and the type of chemical pre-treatment agents used.

• Journal of Adhesion and Interface
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• v.24 no.2
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• pp.41-53
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• 2023

The deformable devices refer to the devices that can maintain their initial performance even when stretched or bent. Among the materials used as conductor in deformable devices, Ga-based liquid metal is one of the most promising materials because it can provide not only high conductivity and deformability but also low toxicity. In this paper, we introduce Ga-based liquid metals and then discuss the recent research trend in deformable devices composed of Ga-based liquid metal.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.74-80
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• 2021

This study investigated the process quality level of a K5 gas mask, which recently acquired its operational capability, through statistical process analysis for the mass production stages and their lots. The tensile adhesion strength was the only operating requirement in the manufacturing process of the K5 gas mask. For this purpose, the results of tensile adhesion strength between the lens and facial rubber during the initial and second mass production stages were analyzed using conventional statistical and statistical process analysis methods. The conventional statistical results indicated that the second mass production stage was better than the initial mass production stage. In cases of a control chart and process capability of tensile adhesion strength, the process quality level was also improved by following the mass production stages. The improvement was caused by process stabilization and work skill elevation. These results and methods are expected to be conducted and utilized in the third mass production stage. Moreover, quality improvement of K5 gas mask mass production can be achieved using the Lean 6 sigma procedure, MDAIC (Define, Measure, Analyze, Improve, Control).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.100-103
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• 2001

In this study, the adhesion and thermal property of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu/TaN/Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature far the multilayered Cu/TaN/Si specimen which was annealed at Ar gas. The adhesion property of Cu 171ms was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than those of sputtered Cu film and evaporated Cu film.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.31-37
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• 2015

Recently, mobile phones have become necessary tools for everyday life. In this study, a device that can serve as a separation between a touch panel and an LCD module in a mobile phone was devised for mass repair processes at a smaill business. We used a wire cutting method to separate the bonding plate area between the modules. The device is composed of DC motors and stepping motors that can deliver a precise cutting motion. The motor control system is connected by individual control modules to a CAN network. The developed device showed excellent performance at high temperature conditions.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1997.04a
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• pp.223-231
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• 1997

내열성복합재료와 Steel 구조물 사이의 좁고 긴 원통형 공간을 내열성 폴리우레탄 재료로 충전하는 연구를 수행하였다. 충전재료를 결정하기 위하여 3종의 폴리우레탄과 에폭시수지를 선정, 시험하여 내열성, 흐름성, 접착성, 경도측정 등을 통하여 최종 결정하였으며 선정된 폴리우레탄을 충전하기 위하여 Resin Transfer Molding(RTM) 방법을 사용하였다. 충전 공정의 적용여부를 판단하기 위하여 아크릴을 이용한 RTM치구를 설계, 제작하여 시험하였다. 충전된 조립체는 비파괴 검사를 통하여 접착, 기공 등을 검사하였으며 지상연소시험을 통하여 내열성능을 평가하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.210-210
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• 2003

ECR(Electron Cyclotron Resonance)은 전자기장에 의한 회전주파수와 전원으로 가해지는 마이크로웨이브(microwave)의 주파수가 일치할 때 발생하는 공진(resonance)현상이다. ECR에 의해 형성된 고밀도, 고에너지의 플라즈마가 상온하에서도 표면에너지가 낮은 고분자수지상에 접착력과 내구성 및 성능이 우수한 금속박막을 형성시킬 수 있는 특징을 지니고 있다. [1] 이러한 고분자수지 표면에 제조되는 금속박막소재는 반도체산업을 비롯하여, 박막전지, 전자파 차폐 등의 다양한 용도로 개발되고 있다. 그러나, 고분자수지와 금속박막계면간의 접착성의 저하로 후처리 공정에서 외부의 응력을 받게되면 막이 쉽게 탈리되는 문제점이 대두되었고, 이에 대한 개선이 요구되고 있다. 따라서, 본 연구에서는 공업적으로 많이 사용되는 표면 전처리방법을 통하여 구리 박막의 접착력을 향상시키고자 하였다. 상온화학증착 방법에 의해 고분자수지표면에 구리금속박막을 제조하고 여러 가지 표준방법을 사용하여 고분자수지와 구리박막간의 접착특성을 조사하였다.