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Kim Dong-Ryun;Chung Sang-Ki;Lee Sang-Woo
- Proceedings of the Korean Society of Propulsion Engineers Conference
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- 2006.05a
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- pp.11-16
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- 2006
The object of this study is to develop new examination techniques for detecting the debonds in adhesive interface of different kinds of the material. Ultrasonic signal was modeled by theoretically analyzing ultrasonic propagation phenomenon of the adhesive interface and debonding interface. The test method using the phase reversal of the debonding interface applied to the FRP/Rubber test block. Aluminum/Rubber test block with the flat bottom hole was manufactured to quantitatively evaluate the minimum detection ability of the defects. The pulse echo reflection method and the phase reversal method were mutually compared and it was estimated that the phase reversal method could detect the debonds on the basis of the theoretically predicted ultrasonic signal and ultrasonic test data.
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Kim, Dong-Ryun;Lim, Soo-Yong;Chung, Sang-Ki
- Journal of the Korean Society of Propulsion Engineers
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- v.13 no.2
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- pp.9-16
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- 2009
The object of this study is to develop new examination technique for detecting debond in adhesive interface of different kinds of materials. Ultrasonic signal was modeled by theoretically analyzing ultrasonic propagation phenomenon of the adhesive interface and debonding interface. The test method using the phase reversal of the debonding interface applied to the FRP/Rubber test block. Aluminum/Rubber test block with the flat bottom hole was manufactured to evaluate quantitatively the minimum detection ability of defects. The pulse echo reflection method and the phase reversal method were mutually compared and it was estimated that the phase reversal method could detect the debond on the basis of the theoretically predicted ultrasonic signal and ultrasonic test data.
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정연호;강두환;강호종
- Polymer(Korea)
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- v.24 no.1
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- pp.23-28
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- 2000
Autoadhesion strength of PS/PS Interfaces in solvent welding was determined as a function of processing conditions by butt joint test. It was verified that the chain mobility and surface roughness at PS/PS interface were enhanced by the applied solvent having a similar solubility parameter as PS and resulted in the dramatic improvement of autoadhesion strength at PS/PS interface. It was found that the mechanism of solvent welding is dependent upon the chain mobility due to the diffusion of solvent to PS interface and the contact area at interface. When the welding temperature is lower than the boiling point of applied solvent, the effect of chain mobility on autoadhesion strength was dominated, while contact area took more important role when welding temperature is above the boiling point of solvent. Autoadhesion strength increased with increasing contact time and contact temperature but :he effect of solvent on autoadhesion strength became smaller.
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Kim, Hyeon-Jae;Kaang, Shin-Young;Nah, Chang-Woon
- Elastomers and Composites
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- v.34 no.1
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- pp.31-44
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- 1999
Interfacial adhesive strength between the fully-crosslinked and partially-crosslinked rubber layers were Investigated at the temperature range of $30{\sim}120^{\circ}C$ for four different rubbers(NR, SBR, EPDM, BIMS). The surfaces of interfacial failure were also investigated using a scanning electron microscopy(SEM). The physical interlinking played a major role in the adhesive strength between the fully-crosslinked rubber layers. When a partially-crosslinked rubber layer was bonded to the fully-crosslinked one, the chemical as well as the physical interlinking affected the adhesive strength. NR showed a "interfacial knotty tearing" pattern, while EPDM showed a typical "cross-hatched" one when the adhesive strength approached to the cohesive tear strength of each material.
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