• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.8-14
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• 2003

The characteristics of grinding and wear behavior of diamond wheel for grinding ceramic materials was investigated in this study. In case of $Si_3N_4$, the wear of wheel was large, the finding force was relatively stable and the fluctuation of surface roughness n small. On the other hand in case of $Al_2O_3$ and $ZrO_2$, the wear of wheel and surface roughness were decreasing, the grinding force was increasing. During grinding with vitrified bond wheel, $Si_3N_4$ shows renewal of cutting edge while $Al_2O_3$ and $ZrO_2$ show glazing phenomenon of cutting grains. We have found that it possible to observe the behavior of grinding wheel by grinding ratio, grinding resistance, surface roughness and cutting edge ratio. Through the grinding experiments, it was found that grinding life of diamond wheel is 20 times for $Si_3N_4$, and 40 times fir $Al_2O_3$ and $ZrO_2$.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.75-81
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous finding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ratio did not change.