• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.10
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• pp.2514-2522
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• 1994

The mirror surface grinding of carbon fiber reinforced plastics(CFRP) was realized by using the metal bonded super-abrasive micro grain wheel with electrolytic in-process dressing(ELID). The maximum surface roughness $R_{max}$ of CFRP which was obtained with #6,000 wheel, was 0.65 $\mu{m}$, which was rougher surface finish compared to those of hard and brittle materials with the same mesh number wheel with ELID. The grinding performance was much dependent on the grinding direction and the best surface roughness was obtained at $90^{\circ}C$ grinding with fiber direction. The spark-out effect on the surface improvement was significant when smaller mesh number grinding wheels were used. From the surface observations of CFRP with scanning electron microscope(SEM) and Auger electron spectroscopy(AES), it was found that the mirror surface grinding of CFRP was generated by the homogenization due to carbonization of the ground surface and smearing of chips composed of the carbon fiber and carbonized epoxy resin into the ground surface.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.71-76
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• 2001

In general, it is known that the wear rate of the abrasive and the removal rate of the metal bond of the grinding wheel should be balanced to maintain the depth of the insulating surface layer to an appropriate level. In order to accomplish, the high quality ELID grinding, therefore, it is necessary to measure the depth of the insulating layer in real-time and then to control the electrolytic conditions to keep the depth to a certain level. In this study, an in-process measurement system of the insulated layer using two gap sensors - a capacitor type and an eddy current type - developed and the change of the status of the insulated layer during ELID grinding is detected. And from the experimental data, we have chosen the best mathematical model to predict the depth of the insulating layer.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.5 no.2
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• pp.73-82
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• 1996

A simtered carbide roller mold for reflector which is used for coverof automobile lamp and beacon plate of highway has been developed. The geometry of sintered carbide roller mold has been determined from the analysis of reflector geometry. An acute angle diamond wheel and dressing system also has been designed and developed to manufacture the sintered carbide roller mold.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.537-542
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• 2004

Machinble Ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. Lapping used diamond slurry and lapping by in-process electrolytic dressing is developed to solve this problem. On this paper, a comparative study of processing ability of lapping used diamond slurry and lapping by in-process electrolytic dressing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.13-18
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• 2012

We investigated the cell activity of controlled titanium surface using various grinding methods including ELID (Electrolytic In-Process Dressing) grinding method. The influence of titanium surface condition by each grinding process on the cell activity was evaluated by ALP activity of MSC(Mesenchymal Stem Cells). The ALP activity of controlled surface by ELID grinding process using # 2000 wheel was higher than that of other titanium surface. The morphological, chemical properties of machined surface by grinding method was observed using various analytical method.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1897-1901
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• 2003

Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.4
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• pp.25-32
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• 2003

In this study, the grinding characteristics of CBN wheels, such as grinding force and surface roughness, have been compared and analyzed from various working conditions of spindle speed and depth of cut. To actualize high efficient grinding at ceramic and silicon nitride material, electrolytic in-process dressing (ELID) method has been applied at metal bonded diamond and CBN wheels. Super precision grinding using ductile mode at difficult-ta-cut materials could be performed.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1787-1792
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• 2003

Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.