• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1115-1119
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• 2005

The paper proposes the elastic modulus evaluation technique of a cantilever beam by vibration analysis based on time-average electronic speckle pattern interferometry (TA-ESPI) with non-contact and nondestructive and Euler-Bernoulli equation. General approaches for the measurement of elastic modulus of thin film are Nano indentation test, Bulge test and Micro-tensile test and so on. They each have strength and weakness in the preparation of test specimen and the analysis of experimental result. ESPI has been developed as a common measurement method for vibration mode visualization and surface displacement. Whole-field vibration mode shape (surface displacement distribution) at a resonance frequency can be visualized by ESPI. And the maximum surface displacement distribution from ESPI is a clue to find the resonance frequency at each vibration mode shape. And the elastic modules of test material can be easily estimated from the measured resonance frequency and Euler-Bernoulli equation. The TA-ESPI vibration analysis technique is able to give the elastic modulus of materials through the simple processing of preparation and analysis.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.807-813
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• 2015

In the present study, an interferometer system, which integrates the laser sensitivity control technique based on the theory of electronic speckle pattern interferometry, one of non-contact non-destructive analysis methods, was developed. This interferometry system receives an image from CCD cameras for each reference and object, and compares the photosensitivity of the object and reference images from imagification. For the purpose of this study, the photosensitivity of object and reference light is measured with power meters, and the amount of light was controlled with an ND filter with a reference light port matching photosensitivity. Using the plate specimen as the object, 0.6, 0.9, 1.2, and $1.5{\mu}m$ of out-plane deformation was made, and images were compared according to the difference in photosensitivity. After analysis, larger object deformations showed larger numbers of stripe patterns. Images became clearer and data error was reduced when the photosensitivity of object and reference light matched.