• Composites Research
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• v.31 no.3
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• pp.99-103
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• 2018

This paper visualizes the full-field permittivity distribution at the standard specimens having known electromagnetic characteristics using a scanning free space measurement (SFSM) system. First, in the two Teflon specimens with different thicknesses, the real and loss tangent of permittivity could be measured and the results agreed to the theoretical and other measurement values. Then the system has been applied to Glass/epoxy and visualized different permittivity distribution depending on the material kind. Therefore, this approach will overcome the point measurement limitation of FSM and can be used for even sub-structural full-field electromagnetic evaluation of stealth and radome structures.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.2
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• pp.177-181
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• 2001

Nondestructive testing(NDT) is one of the fundamental tools to improve the quality of commercial and industrial products. NDT is potentially a major application of interferometry. Interferometry(ESPI, Shearography, ect) has successfully been applied in various industrial environments such as high performance aircraft, home appliance, automotive, and laminates on engine structures, etc. Today's industry demands high performance components with toughest mechanical features and ultimate safety standards. Especially in automotive and aircraft industry the development process focuses on tailor-made design and solutions to meet customer specifications. To reconcile economy, ligh-weight construction has become a key issue. Many companies are looking for new advanced NDT techniques to archive cost efficiency over the limitations of classical methods. ESPI and shearography allow a rapid, full field and 3D-measurement without contact. In this paper recent applications of ESPI and shearography for NDT are described. Advanced features of classical techniques are specified and new applications in material and component testing are presented.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.88-93
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• 2023

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.