• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.61-66
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• 2018

This research scrutinizes the self-annealing characteristics of copper used to metal interconnection for application of DRAM fabrication process. As the time goes after the copper deposited, the grain of copper is growing. It is called self-annealing. We use the electroplating method for copper deposition and estimate two kinds of electroplating chemicals having different organic additives. As the time of self-annealing is elapsed, sheet resistance decreases with logarithmic dependence of time and is finally saturated. The improvement of sheet resistance is approximately 20%. The saturation time of experimental sample is shorter than that of reference sample. We can find that self-annealing is highly efficient in grain growth of copper through the measurement of TEM analysis. The structure of copper grain is similar to the bamboo type useful for current flow. The results of thermal excursion characteristics show that the reliability of self-annealed sample is better than that of sample annealed at higher temperature. The self-annealed sample is not contained in hillock. The self-annealed samples grow until $2{\mu}m$ and develop in [100] direction more favorable for reliability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.385-388
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• 2004

염료감응형 태양전지는 다공질 $TiO_2$ 전극막, 광감응형 염료, 전해질, 상대전극으로 구성된, 전기화학적 원리를 응용한 신형태양전지이다. 본 연구에서는 백금 상대전극의 제조 방법에 따른 태양전지의 효율 및 특성을 비교하였다. 본 연구에 사용된 백금 상대전극막의 제조 방법은 스퍼터링(sputtering)법 과 전기도금(electroplating)법이다. 두 상대전극의 전기화학적 특성은 cyclic voltammetry와 Imepedance spectroscopy 측정을 통하여 비교하였다. 두 전극이 태양전지의 효율 및 특성에 미치는 영향은 단위 셀 태양전지를 제조하여 단파장 하에서 $350nm{\sim}700nm$의 파장별 효율을 측정함으로써 조사하였다.

• Applied Chemistry for Engineering
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• v.3 no.1
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• pp.88-99
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• 1992

For the development of semiconducting photoelectrode to be more stable and efficient in the process of photoelectrolysis of the water, pure titanium rods were oxidized by anodic oxidation, furance oxidation and flame oxidation and used as electrodes. The Indium islands were formed by electrodeposition of "In" thin film on $TiO_2$ and Ti by electrodeposition. Also $A1_2O_3$ and NiO islands were coated on Ti by the electron-beam evaporation technique. The maximum photoelectrochemical conversion efficiency(${\eta}$) was 0.98% for flame oxidized electrode($1200^{\circ}C$ for 2min in air). Anodically oxidized electrodes have photoelectrochemical conversion efficiency of 0.14%. Furnace oxidized electrode($800^{\circ}C$ for 10min in air) has 0.57% of photoelectrochemical efficiency and shows a band-gap energy of about 2.9eV. The $In_2O_3$ coated $TiO_2$ exhibits 0.8% of photoelectrochemical efficiency but much higher value of ${\eta}$ was obtained with the Increase of applied blas voltage. However, $Al_2O_3$ or NiO coated $TiO_2$ shows much low value of ${\eta}$. The efficiency was dependent on the presence of the metallic interstitial compound $TiO_{0+x}$(x<0.33) at the metal-semiconductor interface and the thickness of the suboxide layer and the external rutile scale.

• Polymer(Korea)
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• v.30 no.6
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• pp.471-477
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• 2006

Ion exchange metal composite(IPMC) has toughness equivalent to the range of human's muscle, transformation-actuation force by relatively low voltage and the fast response time. Thus, as a new method for preparing thicker IPMC, the solution casting method to make the films of various thicknesses out of liquid nation was attempted in this study. To reduce the surface resistance of electrode, the first plated electrode prepared by Oguro method was replated with Au and Ir using ion beam assisted deposition(IBAD). The microstructures of electrode surfaces before and after IBAD plating were investigated using SEM. The change of water and ion-conductivity in IPMC were measured under applied voltage. The displacement and driving force of IPMCs with various thicknesses were measured to evaluate the driving properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.165-165
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• 2009

현재 반도체나 이동통신 분야는 사용자의 요구에 따라 PCB의 회로선폭이 갈수록 좁아지고 있다. 이러한 정밀 부품을 제조하기 위한 제조공정에서 각광받기 시작한 기술 중 하나가 대기압 플라즈마 기술이다. 본 연구에서는 미세패턴 형성이 가능한 에폭시 본딩 필름위에 무전해 도금공정을 통한 패턴 도금법을 이용하여 패턴을 형성하였고, 형성된 패턴에 대기압 플라즈마 처리 횟수에 따른 접촉각(Contact Angle)과 Peel Strength의 변화를 분석하였다. 또한 에폭시 본딩 필름을 이용한 Build-up공정을 거쳐 Micro Via를 형성하여 대기압 플라즈마 처리 횟수에 따른 Via 표면을 분석하였다. 대기압 플라즈마 기술은 진공식에 비해 소규모 장비를 이용한 전처리가 가능하고, 초기 설비비용을 절감하는데 탁월한 효과가 있어 널리 사용하는 기술 중 하나이다. 이 연구를 통하여 대기압 플라즈마 처리 횟수에 따른 표면에너지의 변화로 인한 접촉각이 좋아지는 것을 알 수 있으며, 대기압 플라즈마 처리를 한 패턴표면이 친수성으로 변하면서 현상된 드라이 필름 사이로 도금액이 원활히 공급되어서 미세패턴 모양이 우수하게 구현되었음을 알 수 있었다. 또한 Via Filling에도 뛰어난 효과가 있었음을 확인할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.417.1-417.1
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• 2014

본 연구에서는 갭 사이즈가 조절된 나노갭 소자[1]에 유기영동법을 이용하여 수용액 환경 내에 있는 금속 나노입자(금 나노입자)를 검출하였다. 수백 나노미터 사이즈로 제작된 나노갭 전극에 도금법으로 금을 성장시켜 갭 사이즈를 조절하고, 이로부터 전기장의 기울기를 극대화 할 수 있는 나노갭 소자를 제작함으로써 저농도 금 나노입자 검출의 효율성을 높였다. 제작된 나노갭 소자에 교류 신호를 이용한 유기영동법을 도입하여 수용액 환경 내 입자의 움직임을 제어하였다. 본 연구의 목표인 저농도 금 나노입자의 검출을 위해서는 100 kHz의 주파수를 이용하는 것이 가장 적절함을 실험을 통해 확인하였으며, 갭 사이즈가 조절된 나노갭 소자를 이용하여 전기장의 기울기를 극대화하고 입자의 움직임을 제어함으로써 50 aM의 저농도 금 나노입자를 검출할 수 있었다. 나노갭 소자를 이용한 금속 나노입자 검출에 관연 연구는 환경오염물질 검지용 입자센서 및 바이오센서 분야에 응용이 가능할 것으로 예상된다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.9
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• pp.2197-2202
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• 2014

In this paper, we report on an investigation of highly sensitive sensing performance of a hydrogen sensor composed of palladium (Pd) nanowires. The Pd nanowires have been grown by electrodeposition into nanochannels and liberated from the anodic aluminum oxide (AAO) template by dissolving in an aqueous solution of NaOH. A combination of photo-lithography, electron beam lithography and a lift-off process has been utilized to fabricate the sensor using the Pd nanowire. The hydrogen concentrations for 2% and 0.1% were obtained from the sensitivities (${\Delta}R/R$) for 1.92% and 0.18%, respectively. The resistance of the Pd nanowires depends on absorption and desorption of hydrogen. Therefore, we expect that the Pd nanowires can be applicable for detecting highly sensitive hydrogen gas at room temperature.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.253-258
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• 2005

Characteristics of electroplated Ni films such as grain size, resistivity, solder wetting angle, and growth rate of intermetallic compound were evaluated as a function of electroplating current density. With increasing the electroplating current density from $5\;mA/cm^2 $ to $40\;mA/cm^2 $, the nodule size on the Ni film surface decreased, grain refinement occurred, and resistivity increased from $7.37\mu\Omega-cm$ to $9.13\mu\Omega-cm$. Compared with Ni film processed at $40\;mA/cm^2 $, Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ exhibited low resistivity, dense microstructure, and slow growth rate of intermetallic compound. Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ are more suitable for Ni UBM application than that fabricated at $40\;mA/cm^2 $.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.3
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• pp.456-464
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• 1997

The effect of the additives on the Zn-Ni alloy electrocrystallization from a chloride bath was investigated by means of electrochemical methodes, scanning electron microscopy and measurement of surface appearance, X-ray diffraction patterns. The additives tested were the surfactant of naphtalene-derivative, saccharin and aliphatic alcohol. The resistance of electrodeposit increased by adding the additives, whereas the effect of additives on resistance was different with current density. The nickel content of alloy deposit was increased by the addition of alcohol, while decreased by the surfactant. The surface roughness, appearance and morphology of deposit were also influenced by the type of additive. The fine, compact grains and good surface roughness could be obtained from the surfactant or alcohol -added bath, and the surfactant or saccharin improved the surface appearance.

• Analytical Science and Technology
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• v.11 no.3
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• pp.202-205
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• 1998

X-ray absorption fine structure spectroscopic studies at the Ni K-edge have been performed for the Ni-Zn alloy coating layer on steel. The Ni-Zn interatomic distances and Debye-Waller factors were determined by fitting the experimental data with the theoretical spectra in the temperature range of 80 to 300K. The average Ni-Zn interatomic distance was found to be $2.557{\AA}$ and the variation of the Ni-Zn interatomic distance with temperature in this range was insignificant. From the comparison of the Ni-Zn interatomic distance with the nearest neighbor distance of pure Zn lattice it has been suggested that there is an apparent contraction around Ni atom.