• Journal of the Korean Magnetics Society
• /
• v.4 no.3
• /
• pp.263-271
• /
• 1994

We have produced $Co_{1-x}Pt_{x}(X\;=\;0.53\;and\;0.75)$ alloy films by DC magnetron sputtering at various substrate temperatures and sputtering pressures. Sputter-deposited Co-Pt alloy films showed a strong (111) texture, and the degree of (111) texture of the as-deposited film was found to depend on the substrate temperature and Ar pressure. However, we observed that the degree of (111) texture did not affect the magnetic properties. In addition, we have investigated the effect of heat-treatment on magnetic properties of these films. While the magnetic properties of the $Co_{0.25}Pt_{0.75}$ alloy films showed no noticeable changes, the coercivities and the squarenesses of the $Co_{0.47}Pt_{0.53}$ alloy films were drastically increased by annealing. Structural analysis using transmission electron microscopy(TEM) and x-ray diffractornetry(XRD) revealed that $CoPt(L1_{0})$ and $CoPt_3(L1_{2})$ ordered phases, respectively, were formed, each with a strong (111) texture. By comparing the magnetic properties between $CoPt(L1_{0})$ and $CoPt_3(L1_{2})$ ordered phases in relation to the atomic arrangements in a unit cell, we conclude that the magnetic anisotropy in the Co-Pt alloy system depends mainly on the atomic arrangements of Co and Pt.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.65-74
• /
• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Computational Structural Engineering
• /
• v.8 no.4
• /
• pp.87-97
• /
• 1995

For the same configuration of two-dimensional finite element models, 6-node element exhibits stiffer bending stiffness than 8-node element. This is true in the relation between 16-node element and 20-node element for three-dimensional model. This stiffening phenomenon comes from the elimination of several mid nodes from full-node elements. Therefore, this may be called 'relative stiffness stiffening phenomenon'. It seems that there are a couple of ways to correct the stiffening effect, however, we could find only one effective method-the method of modification of Gauss sampling points-which passes the patch test and does not alter other kinds of stiffness, such as extensional stiffness. The quantity of modification is a function of Poisson's ratios of the constituent materials. We could obtain two modification equations, one for plane stress case and the other for plane strain case. This method can be extended to 3-dimensional solid elements. Except the exact plane strain cases, most 3-dimensional plates could be modeled successfully with 16-node element modified by the equation for the plane stress case. The effectiveness of the modification method is checked by applying it to several examples with excellent improvements. In numerical examples, beams with various boundary conditions are subjected to static and time-dependent loads. Free and forced motion analyses of beams and plates are also tested. The beam and plate may be composed of isotropic multilayers as well as a single layer.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.3
• /
• pp.37-43
• /
• 1999

Co-firing incompatibility between the low temperature sinterable Glass/ceramic and Ag-thick film was studied. The dielectric material, which has been developed for microwave frequency applications, consists of $SiO_2-TiO_2-Bi_2O_3$-$Bi_2O_3$-RO system(RO:BaO -CaO-SrO) crystallizable glass and $Al_2O_3$as a ceramic filler. The large camber in the sintered specimen and cracks at the Ag-film under the influence of the camber occurred due to the difference of densification rate between the ceramic sheet and the Ag-film $B_2O_3$addition to the Glass/ceramic mixture reduced the severe camber. The cambers decreased with increasing the $B_2O_3$ content, and completely disappeared with 14 vol% $B_2O_3$addition. With additions of $B_2O_3$, $\varepsilon_{r}$ decreased abruptly, Q$\times$f value increased largely and the $\tau_f$ value of the material quickly shifted to positive one.

• Journal of the Korean Society of Food Science and Nutrition
• /
• v.38 no.9
• /
• pp.1284-1288
• /
• 2009

Identification of various inorganic compound crystals contained in solar salts, which are produced from 12 areas of Jeonnam, was firstly made by the X-ray diffraction (XRD) technique. The analysis of the XRD spectra was carried out on the basis of Joint Committee on Powder Diffraction Standards (JCPDS) data and the results of Energy Dispersive X-ray Spectrometer (EDX) measurements. In particular, the analysis of the XRD spectra supported that each solar salt contains $Na_2S$ (Shinan Jeungdo and Sinui), $KMgCl_3$ (Shinan Bigeum), $Ca(ClO_3)_2$ (Shinan Docho), $CaAl_4O_7$ (Haenam Songji), $CaSiO_3$ and $CaCl_2$ (Goheung) as inorganic compound crystals, which have not been reported for the solar salts. Also, the XRD results indicated that the solar salts maintain a cubic NaCl crystal structure without any change of lattice parameters etc. However, it was shown in the Field Emission Scanning Electron Microscope (FE-SEM) images that an external form of the solar salts has a lamination layer shape of a cubic structure, which is different from a simple cubic form for the purified salts and the reagent NaCl.

• Composites Research
• /
• v.32 no.6
• /
• pp.395-402
• /
• 2019

The RFI process is an OoA process that fiber mats and resin films are laminated and cured in a vacuum bag. In case that resin film is insufficient to fill empty space in fibers, it makes void defect in composites and this void decrease mechanical properties of the composites. For this reason, non-destructive testing is usually used to evaluate void of manufactured composites. So, in this study, a manufacturing method of standard void specimens, which are able to be used as references in non-destructive testing, was proposed by controlling resin film thickness in the RFI process. Also, a fiber compaction test was proposed as a method to set the resin film thicknesses depending on target voids of manufacturing panels. The target void panels of 0%, 2%, and 4% were made by the proposed methods, and signal attenuation depending on void was measured by non-destructive testing and image analysis. In addition, voids of specimens for tensile, in-plane, short beam and compressive tests were estimated by signal attenuation, and mechanical properties were evaluated depending on the voids.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.35 no.5
• /
• pp.332-340
• /
• 2015

Acoustic emission (AE) is an effective nondestructive test that uses transient elastic wave generated by the rapid release of energy within a material to detect any further growth or expansion of existing defects. Over the past decades, because of environmental issues, the use of compressed natural gas (CNG) as an alternative fuel for vehicles is increasing because of environmental issues. For this reason, the importance and necessity of detecting defects on a CNG fuel tank has also come to the fore. The conventional AE method used for source location is highly affected by the wave speed on the structure, and this creates problems in inspecting a composite CNG fuel tank. Because the speed and dispersion characteristics of the wave are different according to direction of structure and laminated layers. In this study, both the conventional AE method and the energy based contour map method were used for source location. This new method based on pre-acquired D/B was used for overcoming the limitation of damage localization in a composite CNG fuel tank specimen which consists of a steel liner cylinder overwrapped by GFRP. From the experimental results, it is observed that the damage localization is determined with a small error at all tested points by using the energy based contour map method, while there were a number of mis-locations or large errors at many tested points by using the conventional AE method. Therefore, the energy based contour map method used in this work is more suitable technology for inspecting composite structures.

• Journal of the Korean Society of Propulsion Engineers
• /
• v.9 no.4
• /
• pp.23-30
• /
• 2005

The Hygrothermal aging of the laminates of $Avimid^(R)$ K3B/IM7 in $80^{\circ}C$ water was studied as a function of immersion time prior to forming microcracks. The factors causing the $80^{\circ}C$ water to degradation of the laminates could be the degradation of the matrix toughness, the change in residual stresses or the interfacial damage between the fiber and the matrix. The times to saturation in $80^{\circ}C$ water for the laminates and for the neat resin were 100 hours and 500 hours. After 500 hours aging of the neat resin, the glass transition temperature was changed less than 1% by DSC test, and the weight gain was 1.55% increase with the diffusion coefficient $7\times10^{-6}m/s^2$ and the fracture toughness was decreased about 41%. After 100 hours fully saturated aging of the ${[+45/0/-45/90]}_s$ K3B/IM7 laminates in $80^{\circ}C$ water, the weight gain was 0.41% increase with the diffusion coefficient $1\times10^{-6}m/s^2$. In 100 hours, the loss of the fracture toughness of the laminates was 43.8% of the original toughness by the microcracking fracture toughness criterion. Therefore, the main factor to degrade the microcracking toughness of the laminates could be the degradation of the matrix fracture toughness.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.37 no.6
• /
• pp.34-42
• /
• 2000

Recently, there is a growing need to develope small-size RF chip inductors operating to GHz to realize high-performance, micro-fabricated wireless communication products. For the development of high-performance RF chip inductors, however, the ferrite-based chip inductors can not be used above 300MHz due to the limitation of the permeability of this material. In this work, small-size, high-performance RF chip inductors utilizing amorphous $Al_2O_3$ core material were investigated. Copper (Cu) with 40${\mu}m$ diameter was used as the coils and the chip inductor size fabricated in this work is $2.1mm{\times}1.5mm{\times}1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on the bottom edges of a core material. The composition of core materials was measured using a EDX. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The developed inductors have the self-resonant frequency (SRF) of 1 to 3.5 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

• Journal of Adhesion and Interface
• /
• v.21 no.3
• /
• pp.93-100
• /
• 2020

3D printing technology enables proper objects to be made through an additive manufacturing method, but resulting in dimension deviation of the product due to contraction phenomenon as cooling melted filament resin injected from high-temperature use environment. In this research, we studied on acrylic adhesives for 3D printer build sheet in order to fabricate high-quality products with a precise shape and to well-mount without distortion. The solvent-free UV-curable acrylic adhesive formulation was designed by adding 4-acryloylmorpholine (ACMO) with high adhesion, toughness, glass transition temperature so that adhesion properties are stable at high temperature and products are easily mounted/detached from the adhesives. The designed formulation was polymerized through two-steps using post-addition of monomers. Using this, the acrylic adhesive was coated to make a film and then analyzed using various experimental techniques. As a result, the fabricated adhesive exhibited high glass transition temperature and there was little gap in peel strength before and after thermal treatment. Moreover, it was confirmed by rheological analysis that this adhesive can provide great bonding/debonding ability without distortion. We demonstrated the fabrication of a rectangular product using a 3D printing method using our acrylic adhesive as a build sheet. Mounting ability and workability were satisfactory and dimension deviation of the product was tiny. Because the product is easily detachable from the acrylic adhesive developed here than conventional build sheets, it is expected that this will provide work convenience to users who use the 3D printer.