• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.157-157
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• 2003

TiAl 금속간화합물은 저밀도, 고용융점 및 우수한 고온강도 둥의 여러 장점을 지녀 고온의 열악한 부식성 분위기에 노출되는 가스터빈, 자동차 엔진부품 등에 사용하기 위해 최근 활발한 연구가 진행되고 있다. 그러나 이 합금의 실용화에 장애가 되는 가장 큰 문제점은 나쁜 저온인성, 고온가공의 어려움 및 고온에서의 나쁜 내산화성이다. 일반적으로 V는 상온연성을 증진시키지만 내산화성을 감소시키고, Nb는 상온연성과 내산화성을 증진시키는 원소이다. 또한 Mo는 강도와 연성을 증진시킨다. 이들 첨가원소의 산화특성을 비교분석하기 위하여 고온산화실험을 실시하고, 산화막의 구조, 산화막의 종류 및 형성과정을 SEM/EDS, EPMA 및 XRD을 이용하여 조사하였다.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.9 s.174
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• pp.188-193
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• 2005

To provide the various machining materials with excellent quality and dimensional accuracy, high -speed machining is very useful tool as one of the most effective rapid manufacturing processes. However, high-speed machining is not suitable for microscale thin-walled structures because of the lack of the structure stiffness to resist the cutting force. A new method which is able to make a very thin-walled structure rapidly will be proposed in this paper. This method is composed two processes, high-speed machining and filling process. Strong workholding force comes out of the solidification of filling materials. Low-melting point metal alloys are used in order to minimize the thermal effect during phase change and to hold arbitrary shape thin-walled structures quickly during high-speed machining. To verify the usefulness of this method, we will show some applications, for examples thin -wall cylinders and hemispherical shells, and compare the experimental results to analyze the dimensional accuracy of typical parts of the structures.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.97-103
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• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.