• Title/Summary/Keyword: 잡적(雜炙)

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A Literature Review on the Hwayangjeok in the Royal Cuisine of Joseon Dynasty (조선왕조 궁중음식(宮中飮食) 중 화양적(花陽炙)의 문헌적 고찰)

  • Oh, Soonduk
    • The Journal of the Convergence on Culture Technology
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    • v.1 no.3
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    • pp.1-21
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    • 2015
  • This study examined the prevalence of the assorted vegetables with beef on skewers called Hwayangjeok recorded in 16 Joseon dynasty (1392-1909) royal palace studies. The ingredients used in Hwayangjeok during the Joseon dynasty were categorized into 35.2% Hwangjeok(黃炙) & Jabjeok(雜炙), 16.7% Hwangjeokhwayangjeok(黃炙花陽炙), each 11.1% Saengboghwayangjeok(生鰒花陽炙) & Lagjehwayangjeok(絡蹄花陽炙), 9.3% Eohwayangjeok(魚花陽炙), 5.6% Donggwahwayangjeok(冬苽花陽炙), each 3.7% Cheonyeobhwayangjeok((千葉花陽炙) & Yanghwayangjeok1, each 1.8% Gyelan-eoeumjeok (鷄卵於音炙) & Ablanhwayangjeok(鴨卵花陽炙). Through this study, through new lighting and menu development for Hwayangjeok used as a basis for hope to contribute to the globalization of Korean food.

A Study on the Copper Metallizing Method of $Al_2$O$_3$ Ceramic Surface (알루미나(Al$_2$O$_3$) 세라믹 표면의 강메탈라이징법에 관한 연구)

  • ;;Choi, Y. G.;Kim, Y. S.
    • Journal of Welding and Joining
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    • v.13 no.3
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    • pp.55-64
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    • 1995
  • Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

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