• Composites Research
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• v.20 no.3
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• pp.37-42
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• 2007

Tensile residual stress is occurred by difference of coefficients of thermal expansion between fiber and matrix is one of the serious problems in metal matrix composite(MMC). TiNi alloy fiber was used to solve the problem of the tensile residual stress as the reinforced material. TiNi alloy fiber improves the tensile strength of composite with occurring of compressive residual stress in the matrix by its shape memory effect. A hot press method was used to create the optimal fabrication condition for a Shape Memory Alloy(SMA) composite. The bonding effect of the matrix and the reinforcement within the SMA composite by the hot press method was strengthened by cold rolling. In addition, acoustic emission technique was used to quantify the microscopic damage behavior of cold rolled TiNi/A16061 shape memory alloy composite at low temperature. The damage degree for the specimen that underwent thermal shock cycles was also discussed.

• Journal of Korean Society of Steel Construction
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• v.16 no.1 s.68
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• pp.61-72
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• 2004

This study investigated the inelastic lateral-torsional buckling of simply supported beams under a central concentrated load and a uniformly distributed load. A line-type finite element, method was incorporated with the "so-called" simplified and polynomial patterns of residual stresses. The effect of the load height was also considered in this study. The polynomial residual stresses assumed in this study was a quartic distribution in the flange and a parabolic distribution in the web. The inelastic lateral-torsional buckling of beam was analyzed with four different I-sections manufactured in Korea. Results obtained in this study were compared with KSDM(design method in the 1995 Korean Steel Designers' Manual). The design method in KSDM was found to be generally conservative with and without a sub-beam attached to the main beam, which acted as an intermediate restraint.

• Polymer(Korea)
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• v.38 no.4
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• pp.510-517
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• 2014

A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.

• Journal of the Korean Wood Science and Technology
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• v.42 no.1
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• pp.20-26
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• 2014

This paper represented the finite element analysis to estimate structural performance of stress-laminated deck, which is determined by deflection, stress, and aging characteristics of tensioning. After loading, the deflected shape showed plate behavior because pre-stressing make frictional force between each member. Compared between initial post-tension and the results, pre-stressing forces were decreased with deck deflection. This is because deflection occurred in the deck so that pre-stressing decreased due to load reduction. However, material plasticity was not considered so that advanced researches should be performed.

• Polymer(Korea)
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• v.27 no.2
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• pp.113-119
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• 2003

The thermal properties and crystallization behaviors of poly(ethylene terephthalate) (PET) were investigated by controlling the annealing conditions of PET sample, such as relative humidity, temperature, and time. The variations of moisture content, glass transition temperature ($T_g$) and cold crystallization temperature ($T_{\propto}$) were examined after annealing the PET sample. Subsequently crystallization process was performed with the annealed PET specimen, and then the degree of crystallinity and heat distortion temperature (HDT) of variously crystallized PET specimen were examined. Residual stress relaxation in the injection molded PET sample after annealing was also observed through polarized films. Moisture content in the PET specimen increased up to 6000 ppm with increasing the relative humidity, temperature, and time of annealing. $T_g$ and $T_{\propto}$ of the annealed PET specimen decreased with increasing moisture content. The degree of crystallinity increased as increasing moisture content in the PET specimen. However for same moisture content, the degree of crystallinity varied with annealing conditions. The relaxations of residual stress in the PET sample differed from annealing conditions, and the maximum degree of crystallinity increased with decreasing residual stress in the PET sample.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.250-255
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• 2004

In this paper, we established baseline information and insight on residual stress relief mechanism associated with furnaced and local PWHT(post weld heat treatment) operation. Based on FEM analysis results, we suggested that furnaced PWHT stress relief mechanism was based on creep relaxation and local PWHT stress relief mechanism involved complicated interactions between plasticity and creep. In case of furnaced PWHT, significant stress relaxation was occurred in the early stage of PWHT. In case of local PWHT, stress relaxation magnitude was increased as PWHT time increased. Finally, We have proposed that detailed furnaced and local PWHT procedure, and qualification criteria to support current codes of practices.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.4
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• pp.47-57
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• 1994

This study investigates the crack propagation behavior to examine the effect of welding residual stress by the superposition method. Especially, as the crack propagation behavior is affected by the applied stress and the stress ratio in compressive residual stress filed, it is studied for three cases as follows; (1) $K_{min}$is smaller than l $K_{r}$l, (2) $K_{min}$ is smaller than l $K_{r}$l in the later stage, (3) $K_{min}$is lager than l $K_{r}$l. The resuslts show that the superposition method is very useful in all the three cases of compressive residual stress field, but is inappropriate in predicting the crack propagation behavior in tensile residual stress field.field.field.

• Journal of the Korean Society of Safety
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• v.5 no.1
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• pp.19-29
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• 1990

The objective of this paper is to investigate the effect of residual stresses on the $\Delta$K$\sub$th/ and fatigue crack growth behavior of butt weldments. For this purpose, transverse butt sutmerged arc welding was performed on SM50A steel plate and CT(compact tension) specimens which loading direction is perpendicular to weld bead were selected. Welding residual stresses distribution on the specimen was determined by hole drilling method. The case of crack located parallel to weld bead, the states of as weld and PWHT, $\Delta$K$\sub$th/ of specimens(HAZ, weld zone) was higher than that of the base metal probably because of the compressive residual stresses of crack tip. In low $\Delta$K region, it is estimated that the effects of residual stresses for da/dN are great. In region II, the da/dN of weldments in as weld state was lower than that of the base metal. Though da/dN of Weldments in PWHT state was similar to that of the base metal. The constant of power law, m in two states consisted with the base metal. Therefore , it is estimated that the value of m is not affected by residual stresses. Fatigue crack growth behavior of weldments consisted with the base metal considering the effective stress intensity factor range($\Delta$K$\sub$eff/) included the effect of initial residual stress(Kres). Thus, we can predict the fatigue crack growth behavior of weldment by knowing the distribution of initial residual stress at the crack tip.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• Tunnel and Underground Space
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• v.19 no.2
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• pp.86-94
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• 2009

A three dimensional rock joint element was developed considering fracture mechanics and subcritical crack growth to simulate non-linear behavior and the progressive failure of rock joints. Using this 3-D joint element, joint shear tests of rock discontinuities were simulated by a numerical method. The asperities on the joint surface began to fail at stress levels lower than the rock fracture toughness and continued progressively due to subcritical crack growth. As a result of progressive failing in each and every asperity, the joint showed non-linear stress-time behavior including stress hardening/softening and the reaching of a residual stress.