• Title/Summary/Keyword: 임피던스정합

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Microwave Absorbing Properties of Silver-coated Ni-Zn Ferrite Spheres Prepared by Electroless Plating (무전해 도금법에 의해 제조된 은 피복 Ni-Zn Ferrite Sphere의 전파흡수특성)

  • Kim, Jong-Hyuk;Kim, Jae-Woong;Kim, Sung-Soo
    • Journal of the Korean Magnetics Society
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    • v.15 no.3
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    • pp.202-206
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    • 2005
  • The present investigation provides an electromagnetic radiation absorptive composition which comprises silver-coated ferrite microspheres dispersed in silicon rubber matrix for the aim of thin microwave absorber in GHz frequencies. Ni-Zn ferrite spheres with $50{\mu}m$ size in average were prepared by spray-drying and sintering at $1130^{\circ}C$. Conductive silver layer was plated on ferrite spheres by electroless plating. Conductive Ni-Zn ferrite sphere with uniform silver layer were obtained in the concentration of 10 g/L $AgNO_3$ per 20 g ferrite spheres. For this powder, electrical resistance is reduced as low as $10^{-2}\~10^{-3}\;\Omega$. The most sensitive material parameters with silver plating is real and imaginary parts of complex permittivity. The conductive Ni-Zn ferrite spheres have large values of dielectric constant. Due to this high dielectric constant of microspheres, matching thickness is reduced to as low as 2 mm at the frequency of 7 GHz, which is much thinner than conventional ferrite absorbers.

Stacked Pad Area Away Package Modules for a Radio Frequency Transceiver Circuit (RF 송수신 회로의 적층형 PAA 패키지 모듈)

  • Jee, Yong;Nam, Sang-Woo;Hong, Seok-Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.10
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    • pp.687-698
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    • 2001
  • This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

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Design of 2nd-harmonic Quadrature Mixer for Ultra Wideband(UWB) Systems (2차 고조파를 이용한 UWB 시스템용 쿼드러쳐 혼합기 설계)

  • Jung, Goo-Young;Lim, Jong-Hyuk;Choi, Byung-Hyun;Yun, Tae-Yeoul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.12 s.115
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    • pp.1156-1163
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    • 2006
  • This paper presents an ultra wideband(UWB) direct conversion mixer for IEEE 802.15.3a applications with simulation and measurement results. Since the direct conversion mixing causes dc-offset and even-order distortion, the proposed mixer adopts an anti-parallel diode pairs(APDPs) to solve these problems. The proposed mixer consists of an in-phase wilkinson power divider over $3.1{\sim}4.8GHz$, a wideband $45^{\circ}$ power divider over $1.5{\sim}2.4GHz$, and miniatured band pass filters(BPFs) for RF-LO isolations. The conversion loss is optimized with impedance matchings between APDPs and wideband components. The measured mixer shows the conversion loss of 13.5 dB, input third-order intercept-point($IIP_3$) of 7 dBm, and 1-dB gam compression point($P_{1dB}$) of -4 dBm. Quadrature(I/Q) outputs have the magnitude difference of about 1 dB and phase difference of ${\pm}3^{\circ}$.

Compact Half Bow-tie-type Quasi-Yagi Antenna for Terrestrial DTV Reception (지상파 디지털 방송 수신용 소형 반 보우 타이 형 준-야기 안테나)

  • Lee, Jong-Ig;Yeo, Junho;Park, Jin-Taek
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.4
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    • pp.1908-1914
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    • 2013
  • In this paper, we introduce a design method for a broadband planar quasi-Yagi antenna (QYA) for terrestrial digital television (DTV) reception. The coplanar strip line which feeds the driver dipole is connected to a microstrip line and is terminated by short circuit. By appending a wide strip-type rectangular director at a location close to the driver dipole, broadband impedance matching and gain enhancement in a high frequency region are obtained. The gain characteristics in a low frequency region are improved by adding a reflector formed by a truncated ground plane. To reduce the antenna size, the strip-type dipole and reflector are modified to half bow-tie (V)-shaped elements. The effects of various parameters on the antenna characteristics are examined. An antenna, as a design example for the proposed antenna, is designed for the operation in the frequency band of 470-806 MHz for terrestrial DTV. The optimized antenna is fabricated on an FR4 substrate and the experimental results show that the antenna has a good performance such as a frequency band of 450-848 MHz for a VSWR < 2, gain > 4.1 dBi, and front-to-back ratio > 10.4 dB.

Three Dimensional Implementation of Intelligent Transportation System Radio Frequency Module Packages with Pad Area Array (PAA(Pad Area Array)을 이용한 ITS RF 모듈의 3차원적 패키지 구현)

  • Jee, Yong;Park, Sung-Joo;Kim, Dong-Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.1
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    • pp.13-22
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    • 2001
  • This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9% reduction in volume and 4.8cm, 28.4% in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

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A Study on 8 × 4 Dual-Polarized Array Antenna for X-Band Using LTCC-Based ME Dipole Antenna Structure (LTCC 기반 ME Dipole 안테나 구조를 활용한 X-Band 용 8 × 4 이중편파 배열안테나에 관한 연구)

  • Jung, Jae-Woong;Seo, Deokjin;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.25-32
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    • 2021
  • In this paper, the Magneto-Electric(ME) dipole array antenna with dual-polarization in the X-Band is proposed and it is implemented and measured. The proposed array antenna is composed of 32 single ME dipole antenna and a Teflon PCB. 1 × 1 ME dipole antenna is implemented dual-polarization by radiating vertical polarization and horizontal polarization from two pairs of radiators. 2-port feeding structures are realized by lamination process using LTCC. And, each port independently feeds the radiator through a Γ-shaped feeding strip with isolation between ports. The Teflon PCB used in the antenna array has a 4-layer structure, and 2-port is fed through the top and bottom layers. The λg/4 transformer is applied to the transmission line of the Teflon PCB for impedance matching of the arrayed antenna and the Teflon PCB, and the optimal parameters are obtained through simulation. The measured maximum antenna gains of port 1 was 18.2 dBi, Cross-pol was 1.0 dBi. And the measured maximum antenna gains of port 1 was 18.1 dBi, Cross-pol was 3.2 dBi.

A Study on the New Impedance Matching method by using Non-Symmetrical coupled Lines for MIC and MMIC (MIC와 MMIC를 위한 비대칭 결합 선로에 의한 새로운 임피던스 정합 방법에 관한 연구)

  • 강희창;진연강
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.13 no.6
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    • pp.521-528
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    • 1988
  • Into the telecommunications industry, which had been monopolistic, a few advanced countries introduced competition through 70's and 80's. And this trend is going on worldwide. The introduction of competition into the industry is made mainly in the long distance, international and enhanced market. This liberalisation results from the fundamental change of the cost function. Suggesting that the cost comprises of that of the facility sector and that of the operation sector there exists the economies of scale in the facility sector in general. The major ground for the monopolistic industrial structure in the past was the natural monopoly depending on the economies of scale. But the rapid advance of the technology by a large margin. This decrease has resulted in the change of the cost function. That is while there exists the economies of scale in the smaller production scale, the average cost increases beyond a certain scale. This means that the natural monopoly collapsed, and that the competitive structure is more efficient than the monopolistic structure. But, because there exists economies of scale in the smaller scale, the desirable number of players, which could result in efficient industry structure depends on the market size. Such correlation between technological level market size and the degree of regulation is found in the case of U.S.A., Japan and U.K., where deregulation policy of the telecommunications market has already been carried out. In U.S.A., which has the largest market and the highest technological level the degree of regulation is lowest. Also in the order of Japan and U.K. the regulation is severer. Japan and U.K. are likely to liberalize still more, as the technology advances and the market grows. This article is just the beginning of the research, and this hypothesis requires more detailed research.

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