• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2004.05b
• /
• pp.691-694
• /
• 2004

물리적 힘에 의한 초전도 분말의 균일한 표면 확보 및 고밀도화 가 필요하다. 그러나 전기영동전착법의 특성상 물리적 힘에 의한 고밀도화에 어려움이 따르고 전착후막의 기공과 크랙현상을 발생시키는 단점으로 인하여 전기영동전착법에 의한 입자의 고밀도화를 위해서는 전착과정에서 현탁분말입자의 치밀성 및 일정한 방향성을 위한 공정기술이 요구된다. 전기영동법에 의한 초전도 후막의 특성을 향상시키기 위한 방법으로 DC전계인가 와 AC보조전계 인가방식에 공정이 있으며 이들 두 공정에 의해 제작된 후막의 특성을 비교 분석하고 두 공정기술에 따른 최적화 방안을 연구 하였다. YBCO 초전도 후막의 균일한 표면과 초전도특성 향상을 위한 공정개선방법으로는 수직방향 교류전계 인가 방식을 적용한 공정기술을 전기영동전착 공정에 적용하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2004.05b
• /
• pp.315-318
• /
• 2004

초전도후막의 제작방법으로 전기영동전착법을 균일하고 치밀한 전착후막을 얻을 수 있는 공정기술로 2층 구조 또는 다층구조의 후막제조기술과 2중 전착기술을 개발 적용하였다. 전기영동전착법을 통한 YBCO초전도 후막제작공정에서 전착 시 발생되는 균열현상과 기공의 발생을 2중 전착을 통하여 최소화 시킬 수 있었으며 Ag보호막을 통한 외부의 물리적 변화에 따른 안정성을 확보하였다. 전기영동전착후막 표면안정화 기술 개선과 확보를 통하여 초전도 후막의 전기적 특성을 향상시킬 수 있을 것으로 판단되며 초전도 후막의 특성을 향상시킬 수 있는 여러 파라메터 중 후막표면의 미세균열현상과 기공현상을 억제할 수 있는 기술로 2중 전착 및 다층구조의 공정기술을 적용하여 기존의 공정에 비하여 매우 향상된 후막을 얻을 수 있었다.

• Journal of Welding and Joining
• /
• v.23 no.5
• /
• pp.49-54
• /
• 2005

The effective charge number and the critical current density of electromigration in eutetic SnPb and Pb Free $(SnAg_{3.8}Cu_{0.7)$ flip chip solder bumps are studied. The effective charge number of electromigration in eutectic SnPb solder is obtained as 34 and the critical current density is $j=0.169{\times}({\delta}_{\sigma}/{\delta}_x})\;A/cm^2,\;where\;({\delta}_{\sigma}/{\delta}_x})$ is the electromigration-induced compressive stress gradient along the length of the line. While the effect of electromigration in Pb free solder is much smaller than that in eutectic SnPb, the product of diffusivity and effective charge number $DZ^{\ast}$ has been assumed as $6.62{\times}10^{-11}$. The critical length for electromigration are also discussed.

• Electrical & Electronic Materials
• /
• v.8 no.4
• /
• pp.478-486
• /
• 1995

Cu/NbTi multilayer thin films and superconducting wires were fabricated and heat treated with conventional annealing and analyzed by differential scanning calorimetry (DSC) as a basic study for the enhancement of Jc. Interfacial reactions of Cu/NbTi multilayer thin films and superconducting wires were investigated with optical microscope, SEM, and XRD. According to the effective heat of formation (EHF) model, CU$\_$3/Ti was predicted as a first phase. However, considering the crystalline structure and thermodynamics, CuTi was predicted as a first phase. According to the results of DSC and XRD, CU$\_$2/Ti was found to be the first phase, followed by the formation Of CU$\_$4/Ti. The difference in first crystalline phase between the experimental result and the predicted one was discussed. In case of Cu/NbTi superconducting wires, the compounds formed at the Cu/NbTi interface grew with annealing time and the amount of compounds formed in Nb-47wt%Ti alloy was larger than that in Nb-50wt%Ti alloy. It seemed that the incubation time for the formation of compounds in Nb-50wt%Ti alloy was longer than that formed in Nb-47wt%Ti alloy. Also, the diffusion was the rate controlling step for the growth of compounds in all specimens. These compounds were formed at 500-600.deg. C for I hour annealing and, thus, the drawing time below I hour must be required to minimize the growth of compounds for the enhancement of Jc.

• Korean Journal of Materials Research
• /
• v.2 no.3
• /
• pp.197-201
• /
• 1992

The temperature dependence of the magentic moment was determined for the system of high $T_{c}$ superconductor $Y_{1-X}Sm_{x}Ba_2Cu_3O_{7-y}$ with x=0, 0.2, 0.4, 0, 6, 0.8 and 1.0. Also the magnetic susceptibility and the magnetic critical current density were measured from the magnetic hysterisis loops obtained at 30 K. From the results of the magnetic susceptibility measurements, the high $T_{c}$ phase were ranged from 14.7 to 49.1%. The values of the magnetic critical current densities were in the range of $10^3~10^4A/cm^2$. The penetration depth was approximately ninety times larger than the coherence length.

• Journal of Power System Engineering
• /
• v.13 no.3
• /
• pp.33-39
• /
• 2009

The aim of this study is to analyze the welds characteristics of the 205 stainless steel pipe for application of street pole material. The welds corrosion behavior of STS 205 pipe in 0.1 N sulphuric acid solution and 5% NaCl solution at room temperature was studied using both salt spray test and potentiodynamic polarization experiment. The morphology and components of corrosion products on surface of STS 205 pipe welds were investigated using SEM/EDX. The tensile strength and yield strength values of STS 205 plate were 715 MPa and 369 MPa respectively. The microvickers hardness values of STS 205 pipe welds were slightly increased than that of STS 304 pipe welds. Corrosion current density($I_{corr.}$) and critical current density($I_{crit.}$) values of STS 205 pipe welds in 3.5% NaCl solution were $1.89{\times}10^{-6}$ $A/cm^2$ and $15.8{\times}10 ^{-6}$ $A/cm^2$. The corrosion resistance of SIS 205 pipe welds was similar to its STS 304 pipe welds. The STS 205 and 304 pipe welds passive films were chromium oxide. Especially, the STS 205 pipe welds showed good corrosion resistance in 0.1 N sulphuric acid. This is attributed to the forming of protective chromium oxide on the surface of STS 205 pipe welds.

• Applied Chemistry for Engineering
• /
• v.8 no.5
• /
• pp.811-815
• /
• 1997

The present work describes the effect of dry grinding of a mixture composed of $Y_2O_3$, $BaCO_3$ and CuO powders with a planetary ball mill before heat treatment on crystal structure and superconductivity in the $YBa_2Cu_3O_{7-y}$. The specific surface area of the ground product of mixture decreased with an increase in the grinding time, after showing an upward trend up to 60 minutes of grinding. The critical current density, which was influenced by the grinding time of mixture, indicates the maximum value of about $150A/cm^2$ in the case of 60 minutes grinding, while the critical temperature, which were around 90K, for the sintered bodies were almost independent of the grinding time.

• Electrical & Electronic Materials
• /
• v.9 no.6
• /
• pp.578-583
• /
• 1996

The magnetic properties have been investigated for the system of $Y_{1-x}$Yb$_{x}$Ba$_{2}$Cu$_{3}$F$_{y}$O$_{y}$ with x=0.0, 0.1, 0.2, 0.3, 0.4 and 0.5. In the magnetic hysteresis measurements, the values of the magnetic critical current densities are in the range of 10$^{4}$-10$^{5}$ A/cm$^{2}$ at the maximum external field 1.4 T. The upper critical field is over 100 T. The critical current density is estimated by the magnetization width .DELTA.M through the Bean critical state model. As the field strength is increased, the .DELTA.M diminishes slowly. The .DELTA.M for the fluorinated sample also decreases slowly with increasing field. It is considered that the large J, value results from this type is due to enhanced pinning center in grain boundary.y.ary.y.

• Electrical & Electronic Materials
• /
• v.7 no.4
• /
• pp.306-311
• /
• 1994

In this study, the influence of the powder sintering, the 2nd sinteiing and the grinding time on the Superconducting properties in the Bi(Pb)SiCaCuO Superconductor has been studied. From the analysis of SEM and XRD patterns, it was known that the sample prepared by the process of powder sintering has a porous microstructure with the critical temperature(Tc) below 77K, while the sample prepared by the 2nd sintering has a highly oriented microstructure with the Tc above 100K. The Critical Current Density(Jc) of the sample prepared by the 2nd sintering was better than the sample prepared by the process of powder sinteiing, but it's Jc, was low in practical use. Also, the effect of grinding time from 0[min] to 120[min] was investigated. As the grinding time is increased, the samples degraded from high-Tc phase to low-Tc phase and nonsuperconducting phases.

• Korean Journal of Materials Research
• /
• v.4 no.1
• /
• pp.37-43
• /
• 1994

Y-Ra-Cu-0 oxide superconductors were fabricated by the sinter-forging method to make the critical current density improve through controlling of microstructure and crystal texture. The grain alignment of oxide superconductor was formed by the sinter-forging process and it's c-axis orientation was parallel to the press direction.The orientation factor of texture increased with sinking temperature and pressure, and also grain alignment was improved by the addition of Ag. As for the sinterforged Y-Ba-Cu-O/Ag sample, the $T_c$(on-set) was not almost varied with the sinter-forging temperature, but $T_c\;^{zero}$ decreased more or less at high sinter-forging temperatures. In addition, it was observed that added-Ag was mainly distributed along the grain boundar~es in the (123) matrix, resulting in the densification of microstructure. From these results, i t was thought that the improvement of $J_c$ over 2000A/$\textrm{cm}^2$ was attributed to the texture, densification of microstructure, and (123) grain growth due to the Ag addition.