• Title/Summary/Keyword: 인프로세스 계측

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A Study on the In-process measurement of Burrs (Burr의 In-process 계측에 관한 연구)

  • 박동삼
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.242-246
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    • 1996
  • Accurate measurements of burr profile and burr size are very important for the automation of deburring. In this paper, a new burr measurement system using capacitance sensor is proposed. Ultra precision milling machine was used as a sensor positioning system. The possibility and limitation of employing a capacitance sensor to defect burrs are also investigated. The proposed system is proven to be relatively accurate, easy to setup and lower cost. This system will be applicable to a fully automated deburring system with minor modifications.

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Development of a New Probe to Realize Nano/Micro Mechanical Machining and In-Process Profile Measurement (나노인프로세스 형상계측 및 미세가공용 프로브의 개발)

  • Kweon, Hyun-Kyu;Choi, Seong-Dae
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.2 no.1
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    • pp.75-84
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    • 2003
  • In this paper, a new nano/micro-mechanical processing test machine was developed. This new test machine, which is based on the principle of the scanning force controlled probe microscope, can realize nano/micro-mechanical machining and in-process profile measurement. Experimental results of nano/micro indentation and scratching show that the controllable cutting depth of the test machine can be controlled by PZT actuator. Profile measurement of the machined surface has also been performed by using the test machine and a conventional AFM(Atomic Force Microscopy). A good agreement of the two measurement results have been achieved.

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In-process Measurement of Surface Profile using CCD (CCD를 이용한 인프로세스 표면형상의 계측)

  • 이기용;강명창;김정석;조인순
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.255-258
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    • 1995
  • Surface profile is an important paramerer to evaluate accuracy of machined worpiece. It is necessary to acquire this data by in-process measurement. Recent researchers have introduced Machine Vision technique to achieve it. But it is difficult to apply it to industry field yet. In this study, in-process measuring system of surface profile is developed using CCD camera. The effect of illuminance according to incident angle is investigated and surface profile from surface tester and illuminance graph are compared experimentally.

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In-Process Diagnosis of Servovalve Wear using Leakage Flow Measurement (누설 유량 계측에 의한 서보밸브 마멸의 인-프로세스 진단)

  • Kim K.H.;Han G.S.;Lee J.C.;Ham Y.B.;Kim S.D.
    • Transactions of The Korea Fluid Power Systems Society
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    • v.1 no.2
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    • pp.1-7
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    • 2004
  • In-process diagnosis is essential to achieve predictive maintenance in industrial plants. An in- process diagnosis method was proposed for hydraulic servo systems, which was based upon leakage flow measurement. Leakage due to servovalve wear was analysed and modeled mathematically far computer simulation work. The key idea of diagnosis algorithm is that when monitoring signals, such as servovalve input and load displacement are in steady states, the return-line flow of hydraulic servo systems can be regarded as null-leakage of servovalve. Virtual experiments were performed to ensure effectiveness of the proposed diagnosis method.

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Development of an AFM-Based System for Nano In-Process Measurement of Defects on Machined Surfaces (가공면미세결함의 나노 인프로세스 측정을 위한 AFM시스템의 개발)

  • Gwon, Hyeon-Gyu;Choe, Seong-Dae;Park, Mu-Hun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.3
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    • pp.537-543
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    • 2002
  • This paper examines a new in-process measurement system for the measurement of micro-defects on the surfaces of brittle materials by using the AFM (Atomic Force Microscopy). A new AFM scanning stage that can also perform nano-scale bending of the sample was developed by adding a bending unit to a commercially available AFM scanner. The bending unit consists of a PZT actuator and sample holder, and can perform static and cyclic three-point bending. The true bending displacement of the bending unit is approximately 1.8mm when 80 volts are applied to the PZT actuator. The frequency response of the bending unit and the stress on the sample were also analyzed, both theoretically and experimentally. Potential surface defects of the sample were successfully detected by this measurement system. It was confirmed that the number of micro-defects on a scratched surface increases when the surface is subjected to a cyclic bending load.

In-Process Measurement of Insulating Layer in ELID-Grinding (ELID 연삭에서 부도체 피막의 실시간 계측)

  • Kim, Hwa-Young;Ahn, Jung-Hwan;Seo, Young-Ho
    • Proceedings of the KSME Conference
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    • 2001.06c
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    • pp.71-76
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    • 2001
  • In general, it is known that the wear rate of the abrasive and the removal rate of the metal bond of the grinding wheel should be balanced to maintain the depth of the insulating surface layer to an appropriate level. In order to accomplish, the high quality ELID grinding, therefore, it is necessary to measure the depth of the insulating layer in real-time and then to control the electrolytic conditions to keep the depth to a certain level. In this study, an in-process measurement system of the insulated layer using two gap sensors - a capacitor type and an eddy current type - developed and the change of the status of the insulated layer during ELID grinding is detected. And from the experimental data, we have chosen the best mathematical model to predict the depth of the insulating layer.

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Research md Development of Inprocess Measuring Magnetic sensor for Tolerance Control (공차제어를 위한 인프로세스 계측 자기센서의 개발 연구)

  • 신용진;소대화;김현욱;이광배;강재덕
    • Journal of the Korea Safety Management & Science
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    • v.2 no.1
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    • pp.89-97
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    • 2000
  • This paper shows the study for development inprocess measuring magnetic sensor for tolerance control, First, we fabricated and annealed sample amorphous ribbons which were made of ($CO_{0.94}$$Fe_{0.06}$)$_{79}$$Si_{2}$$b_{19}$ having near zero magnetostrictive. It had 12[$\mu\textrm{m}$] of thickness, 10[mm] of length, and 2.5[mm] of width. Then, we measured the magnetic characteristics such as frequency dependency over impedance variation rate and position change over impedance variation. As the results of the evaluation, we found that the sample ribbons had excellent sensor characteristics. Then, we made sensors by using the sample ribbons, As the results of the measurements, it proved that the ribbon could be used as excellent magnetic sensor for which it was possible to control inprocess measurement within the tolerance range(~$\mu\textrm{m}$ ).

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Real-time Multi-sensing System for In-process monitoring of Chatter Vibration(l) (채터진동의 인프로세스 감시를 위한 실시간 복합계측 시스템(1))

  • Kim, Jeong-Suk;Kang, Myeong-Chang;Park, Cheol
    • Journal of the Korean Society for Precision Engineering
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    • v.12 no.10
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    • pp.50-56
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    • 1995
  • Chatter Vibration is an unwanted phenomenon in metal cutting and it always affects surface finish, tool life, machine life and the productivity of machining process. The real-time detection of the chatter vibration is is necessarily required to automation system. In this study, we constructed the multi-sensing system using Tool Dynamometer, Accelermeter and AE sensor. Especially, Acoustic Emission(AE) generated during turning was investigated the possibility for real-time detection of chatter vibration. Turning experiments were performed using carbide insert tip under realistic cutting conditions and tapered workpiece of SM45C. Consquently, the real-time detection using multi-sensing system can be used for Inprocess monitoring of chatter vibration.

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Development of microscopic surface profile estimation algorithm through reflected laser beam analysis (레이저 반사광 분석을 통한 미세 표면 프로파일 추정 알고리즘의 개발)

  • Seo Young-Ho;Ahn Jung-Hwan;Kim Hwa-Young;Kim Sun-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.11 s.176
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    • pp.64-71
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    • 2005
  • In order to measure surface roughness profile, stylus type equipments are commonly used, but the stylus keeps contact with surface and damages specimens by its tip pressure. Therefore, optics based measurement systems are developed, and light phase interferometer, which is based on light interference phenomenon, is the most noticeable research. However, light interference based measurements require translation mechanisms of nano-meter order in order to generate phase differences or multiple focusing, thus the systems cannot satisfy the industrial need of on-the-machine and in-process measurement to achieve factory automation and productive enhancement. In this research, we focused light reflectance phenomenon rather than the light interference, because reflectance based method do not need translation mechanisms. However, the method cannot direct]y measure surface roughness profile, because reflected light consists of several components and thus it cannot supply surface height information with its original form. In order to overcome the demerit, we newly proposed an image processing based algorithm, which can separate reflected light components and conduct parameterization and reconstruction process with respect to surface height information, and then confirmed the reliability of proposed algorithm by experiment.

Development of SFM System for Nano In-Process Profile Measurement (나노인프로세스 표면형상계측을 위한 SFM시스템의 개발)

  • Kweon, Hyun-Kyu;Choi, Seong-Dae;Hong, Sung-Wook
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.3 no.2
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    • pp.53-59
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    • 2004
  • In this paper, we propose a new multi-purpose Scanning Force Microscope (SFM) system. The system can be used for nano/micro-scratching, in-process profile measurement, and observation of potential surface defects which occur during the scratching in air or liquid. Experimental results of nano/micro-scratching show that the smallest scratching depth can be controlled to be 10nm, which corresponds to the stability of the SFM system. Profile measurements of nano/micro-scratching surfaces have also been performed by the method of on-machine measurement and in-process measurement. Two measurement results were in good agreement with each other. The maximum difference was approximately 10 nm, which was mainly caused by the sampling repeatability error that influences the measurement accuracy Also, micro-defects on the micro-scratching surface were successfully detected by the SFM system. It was confirmed that the number of micro-defects increases when the surface is subjected to a cyclic bending load. The maximum depth was less than 100nm.

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