• Korean Journal of Food Science and Technology
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• v.20 no.2
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• pp.148-156
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• 1988

A method for the measurement of viscoelastic properties of heat denatured gluten network was developed in order to evaluate the noodle making quality of wheat flour. The stress relaxation of elongated heat denatured gluten network could be expressed by 6-element generallized Maxwell model. The tensile force of heat denatured gluten network increased by the heating time. The elastcity and viscosity of the first exponential term which covers 70-74% of the total relaxation increased as cooking time was extended up to 1q min. The addition of gluten network strengthening agent, potassium bromate, at 1000ppm level reduced the elasticity and viscosity, while weakening agent, L-cystein, increased them. The relaxation time decreased after 11 min of cooking in both cases. The elasticity and viscosity of heat denatured gluten were affected differently by the concentration of added urea.

• Korean Journal of Food Science and Technology
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• v.30 no.5
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• pp.1085-1091
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• 1998

The purpose of this study was to investigate the rheological properties of surimi gels and imitation crab-leg products by stress-relaxation test and to examine the correlations between stress-relaxation parameters and T.P.A. parameters. The linear viscoelasticity of surimi gels and imitation crab-leg products was observed in the range of the strain of $5{\sim}20%$ at cross-head speed 2.4 mm/sec. The average tensile forces of surimi gels and imitation crab-leg products were similar, 370.4 g and 436.4 g, respectively, but surimi gels showed higher relaxation time and viscous component (17256.1 sec, $1.357{\times}10^{10}$ poise) than those of imitation crab-leg products (6110 sec, $0.519^{\ast}10^{10}$ poise). Estimated tensile force of each exponential term in relaxation test was highly related with hardness, gumminess and chewiness of T.P.A (r=0.93, 0.93, 0.95, p<0.01), the relaxation time of each exponential term was rrelated with cohesiveness (r=0.89, p<0.01) of T.P,A. and the elastic component of exponential term with gumminess, chewiness and hardness (r=0.92, 0.94, 0.93. p<0.01) of T.P.A.. The viscous component of exponential term was related with cohesiveness (r=0.83, p<0.05) of T.P.A.. The degree of texturization was negatively related with the relaxation time and viscous component (r=-0.92, -0.96, p<0.01).

• Journal of the Korean Society of Visualization
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• v.21 no.1
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• pp.110-118
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• 2023

Characterizing the extensional rheological properties of non-Newtonian fluids is crucial in many industrial processes, such as inkjet printing, injection molding, and fiber engineering. However, educational institutions and research laboratories with budget constraints have limited access to an expensive commercial extensional rheometer. In this study, we developed a custom-made extensional rheometer using a CO₂ laser cutting machine and 3D printer. Furthermore, we utilized a smartphone with a low-cost microscopic lens for achieving a high spatial resolution of images. The aqueous polyethylene-oxide (PEO) solutions and a Boger fluid were prepared to characterize their extensional properties. A transition from a visco-capillary to an elasto-capillary regime was observed clearly through the developed rheometer. The extensional relaxation time and viscosity of the aqueous PEO solutions with a zero-shear viscosity of over 300 mPa·s could be quantified in the elasto-capillary regime. The extensional properties of the solutions with relatively small zero shear viscosity could be calculated using a smartphone's slow-motion feature with increasing temporal resolution of the images.

• Rubber Technology
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• v.11 no.1
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• pp.12-26
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• 2010

각종 산업제품의 주요 부품으로 사용되고 있는 고무재료는 사용 중 온도변화에 의해 체적 또는 길이 변화를 수반할 수 있어 결과적으로 고무제품의 성능이나 효율이 영향을 받게 된다. 특히 고온에서 고무제품의 치수변화를 제한하거나 일정치수를 강제할 경우 열수축이나 열팽창에 의해 응력이 발생하게 된다. 따라서 온도 변화에 따른 열응력의 측정은 고무제품의 정밀성과 성능을 평가하는 중요한 수단을 제공한다. 본 연구에서는 고무소재의 열응력 측정을 위한 새로운 측정방법을 개발하였고 이와 관련 새로운 시험장치를 설계, 제작하였다. 고무시편에 일정 변형의 인장을 준 상태에서 가열하면 열응력이 발생한다. 이 때의 열응력은 고무분자 사슬들의 운동성에 기인하며 배향된 고무분자 사슬들이 열역학적으로 랜덤 사슬형태로 돌아가려는 엔트로피적 힘이다. 따라서 온도가 높을수록 그 수축력은 증가하게 된다. 또한 고무분자 사슬의 사전 변형이 증가하면 그 열응력은 증가한다. 이때 열응력은 측정시간이 지남에 따라 최대치에 도달한 후 완화되며 그 완화속도는 설정온도에 의해 영향을 받는다. 여기서는 온도변화에 따른 고무시편의 열응력 측정결과를 소개하고, 고무분자 사슬의 엔트로피 변화와 점탄성적 흐름, 그리고 가열에 따른 고무 시편의 팽창 또는 수축이 열응력에 미치는 영향 등을 논의하였다. 특히 천연고무와 SBR 고무시편의 열응력 차이를 분자사슬의 운동과 연관하여 검토하였고, 가교밀도와 가교시스템이 각각 다른 고무시편에 대해 열응력 발생과에 따른 상관관계를 고찰하였다. 또한 시편의 형태와 두께가 열응력 발생에 미치는 영향도 검토하였다. 충전 배합고무의 경우 열응력에 영향을 미치는 인자로 고무분자 사슬의 운동성과 가교밀도 외에 고무재료와 충전제 사이의 물리 화학적 상호작용도 매우 중요한 요소가 된다. 배합고무에서 충전제의 영향을 검토하기 위해 실리카와 카본블랙을 선택하였고 배합고무의 열응력을 각각 측정하여 이들의 보강효과가 열응력에 미치는 영향에 대해 논하였다.

• Journal of the Korean Geotechnical Society
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• v.29 no.12
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• pp.95-104
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• 2013

Recently, application of CSG is increasing in various design construction projects. At the initial stage of cementation CSG materials show the same mechanical characteristics as soil, however, as the cementation process develops, CSG materials gradually reveal material characteristics of concrete. The hardened CSG manifests elastic behavior such as maximum strength at small strain range and rapid brittle failure. In this research, PVA fiber stiffeners were used in order to: (1) reduce such brittle behavioral characteristics; (2) improve the relatively weak tension performance of CSG materials. The binding strength between the bed materials and fiber prevents rapid brittle failure and increases tensional strength of fiber reinforced CSG materials.Test results show that fiber reinforcement alone could induce the stress-strain characteristics of CSG materials from brittle failure to ductile failure and also increase the residual strength.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.192-192
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• 2011

Mo 박막은 열적 안전성과 전기 전도성이 우수한 소재로 CIGS 태양전지의 배면전극으로 사용되고 있다. 스퍼터링법에 의한 Mo 박막의 전도성은 공정압력에 민감하여 높은 압력과 낮은 압력에서 이중박막으로 제조되고 있다. 연구에서는 압력에 크게 영향을 받지 않으면서 전도성이 $10{\mu}{\Omega}-cm$ 이하로 우수한 Mo 박막을 얻을 수 있는 아크 이온플레이팅법으로 Mo 박막을 제조하였다. 그러나 Mo 박막 증착시에 나타나는 높은 압축응력은 기재(Soda lime Glass; SLG)와의 밀착성을 떨어뜨렸다. 기재(SLG)와의 밀착성을 확보하기 위해 Ti 중간층($0.3{\mu}m$, $0.9{\mu}m$)을 증착하고 그 위에 Mo 박막을 증착하여 전도성이 우수한 박막을 제조하였으나 여전히 압축잔류응력의 문제점을 보였다. 압축응력의 완화를 위해 CIGS 박막이 제조되는 $550^{\circ}C$의 온도에서 열처리를 1시간 수행하였다. 열처리를 통해 열처리 전과 후에 나타나는 전도성과 잔류응력의 변화를 공정압력(5 mTorr~30 mTorr)별로 알아보았다. 사용된 시험편은 Si wafer, SLG, SUS계 소재를 이용하였으며 공정압력별로 아크 타겟에 인가되는 전류는 100 A로 고정하였고, 바이어스 전압은 0V, -50V를 인가하였다. 열처리 전과 후에 전도성은 크게 변화가 관찰되지 않았으나 잔류응력에는 많은 변화가 관찰 되었다. 잔류응력은 공정압력(5mTorr~30mTorr)별로 응력 완화가 일어났으며, 바이어스 전압이 0V에서 공정압력이 5 mTorr일 때 열처리 전에 측정된 1346 MPa 압축응력이 열처리 후에는 188 MPa의 인장응력을 나타내었다. 이러한 응력 변화에 대해 XRD와 SEM으로 구조분석을 통해 Mo 박막의 결정성과 전도성 및 잔류응력의 상관관계에 대해 알아보았다.

• Journal of dental hygiene science
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• v.5 no.3
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• pp.113-117
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• 2005

After producing 4 kinds of hydrogel materials by mixing the composite preparation in Gardeniae Fructus extracts with ketorolac tromethamine, which is NSAIDs (nonsteroidal anti-inflammatory drugs), through the experiment of measurement in the tensile strength, in the skin permeation, and in the periodontal-pocket reduction rate, the following conclusions were obtained. 1. The tensile strength of a drug indicated the tensile strength 3.5-fold higher compared to the control group, in KGH gel B. 2. The skin-permeation volume in ketorolac tromethamine was highest with $105.62{\mu}m/cm^2$ in KGH gel B for 8 hours, and the permeation volume in geniposide was relatively high with $73.8{\mu}m/cm^2$ in KGE gel A, but the permeation volume in genipin, which is the hydrolysis, represented the highest permeation amount with $50.17{\mu}m/cm^2$ in KGH gel B. 3. In terms of the periodontal-pocket reduction rate, after 4 weeks, KGE gel A showed the falling rate of 23.85% compared to the control group, but did not indicate the significant difference, and KGH gel B represented the reduction rate of 29.46% compared to the control group, thus it indicated the significantly treatment effect.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Journal of the Korea Concrete Institute
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• v.14 no.5
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• pp.726-733
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• 2002

Shrinkage strip or separation strip is a temporary joint that is left open for a certain time during construction to allow a significant part of the shrinkage to take place without inducing stress. A shrinkage stress analysis method of shrinkage strip in concrete slab of multi-story building considering the relaxation effect of creep and construction sequence is proposed. The analysis results of 10-story example building show that the effect of shrinkage strip can be analyzed easily by the proposed method. And shrinkage strip installed in a particular floor makes the stress of that floor reduced and the stress of the other floors increased a little. The rate and amount of stress reduced with closing time mainly depends on the development of shrinkage with time of concrete model used. The amount of stress reduced is determined by the amount of shrinkage strain developed before the closing of shrinkage strip.

• Korean Journal of Materials Research
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• v.1 no.1
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• pp.46-53
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• 1991

The stress of PSG (Phosphosilicate glass), USG (Undoped-silicate grass) and SiN films, which are mainly used as passivation layers in semiconductor memory devices, deposited by CVD methods has been studied as a function of film thickness and holding time in air. The stress of the PSG film or the USG film is increased in tensile state with increasing film thickness. On the other hand the stress level of the SiN film in compressive stress does not change as film thickness changes. The stress of PSG film shows the drastic change from the tensile stress to the compressive stress after the film is left 2 days in air. FTIR spectra indicated that the stress variation was due to the penetration of water molecule. It looks possible to recover the stress of about $2.5{\times}{10^9}dyne/cm^2$ by annealing treatment at $300^{\circ}C$ for 20min. The total stress of multi-layered films having the PSG film is determined mainly by the stress variation of PSG layer with holding time. The total stress of multi-layered film appears to have a functional relationship with the stress in the thickness of each film. The resistance against stress-migration of sputtered Al line increases with increasing the tensile stress for the PSG film or the USG film.