• 한국신재생에너지학회:학술대회논문집
• /
• 2007.11a
• /
• pp.231-231
• /
• 2007

• Journal of the Korean Applied Science and Technology
• /
• v.36 no.2
• /
• pp.541-550
• /
• 2019

This study is aimed to find out the effect of PAPS-D on physical fitness of developmental disabled students who participated of Inline skate program. The subject of this study was 10 middle and high school students diagnosed as developmental disability. The subject attended a total of 32 classes twice a week for 16 weeks and the class was 1 hour each time. Improvement of physical fitness was assessed based on PAPS-D program developed by the Department of Education science in 2016 except for obesity measurement; cardio pulmonary function (walking in 6 minutes), flexibility (seated forward bend, clasped hand behind the back), muscle function (sit-up) and agility (standing long jump). To find out the interaction between control group and experimental group, two-way repeated measure ANOVA was used. As a result, there was a statistically significant relation in cardio pulmonary function and agility but not in flexibility and muscle function. 3 variables (cardio pulmonary function, flexibility and muscle function) among 4 variables showed positive effect of Inline skate program on physical fitness while one variable which was agility showed decreased result in post-test. Based on the results of three variables that were found to have improved in the pre post-examination, the result of this study indicates positive effect of Inline skating program on physical fitness of developmentally disabled students.

• The Optical Journal
• /
• s.177
• /
• pp.46-53
• /
• 2020

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.5
• /
• pp.2113-2120
• /
• 2013

In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

• Journal of the Korean Society for Industrial and Applied Mathematics
• /
• v.10 no.1
• /
• pp.31-45
• /
• 2006

Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.22 no.6
• /
• pp.694-699
• /
• 2012

In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

• Journal of Korea Multimedia Society
• /
• v.13 no.2
• /
• pp.196-204
• /
• 2010

In this paper, we develope a defect inspection method for each buttons of keypad of cellular phones before they are assembled. The proposed algorithm consists of the similar color checking and its classification, font error detection, and scratch detection based on the segmentation of keypad area and font, translation and rotation processing sequentially. Especially, the proposed segmentation method approximate the pad region as B-spline function to deal with illumination change due to the shape of key button with the slant and curved surface followed by simple thresholding. And also, the rotational information is obtained by using eigen value and eigen vector very fast and effectively. The experimental results show that the performance of the proposed algorithm is good when it is applied to in-line process.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.23 no.4
• /
• pp.286-291
• /
• 2013

In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

• Journal of Korean Society for Quality Management
• /
• v.23 no.3
• /
• pp.33-44
• /
• 1995

This paper presents an automated visual inspection system for the electronic parts manufacturing process. In this system, a statistical process control (SPC) method is integrated into the automated inspection method on a real time base. It shows how the collected data can be analyzed with the SPC to provide process information. Also presented are studies of subpixel image processing technology to improve the accuracy of parts measurements, and the cumulative-sum (CUSUM) control chart for fraction defectives. An application of the developed system to connector manufacturing process as a part of computer integrated manufacturing (CIM) is presented.

• Proceedings of the Korean Information Science Society Conference
• /
• 2007.06d
• /
• pp.489-494
• /
• 2007

침입방지 시스템(IPS, Intrusion Prevention System)은 인라인모드(in-line mode)로 네트워크에 설치되어, 네트워크를 지나는 패킷 또는 세션을 검사하여 만일 그 패킷에서 공격이 감지되면 해당 패킷을 폐기하거나 세션을 종료시킴으로서 외부의 침입으로부터 네트워크를 보호하는 시스템을 의미한다. 침입방지 시스템은 크게 두 가지 종류의 동작을 수행한다. 하나는 이미 알려진 공격으로부터 방어하는 시그너처 기반 필터링(signature based filtering)이고 다른 하나는 알려지지 않은 공격이나 비정상 세션으로부터 방어하는 자기 학습 기반의 변칙 탐지 및 방지(anomaly detection and prevention based on selflearning)이다. 시그너처 기반 필터링에서는 침입방지시스템을 통과하는 패킷의 페이로드와 시그너처라고 불리는 공격 패턴들과 비교하여 같으면 그 패킷을 폐기한다. 시그너처의 개수가 증가함에 따라 하나의 들어온 패킷에 대하여 요구되는 패턴 매칭 시간은 증가하게 되어 패킷지연 없이 동작하는 고성능 침입탐지시스템을 개발하는 것이 어렵게 되었다. 공개 침입방지 소프트웨어인 SNORT를 위한 여러 개의 효율적인 패턴 매칭 방식들이 제안되었는데 시그너처들의 공통된 부분에 대해 한번만 매칭을 수행하거나 한 바이트 단위 비교대신 여러 바이트 비교 동작을 수행함으로써 불필요한 매칭동작을 줄이려고 하였다. 본 논문에서는 패턴 매칭 시간을 시그너처의 개수와 무관하게 하기 위하여 시그너처 해싱 기반에 기반한 고성능 침입방지시스템을 제안한다.