• Proceedings of the KSR Conference
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• 2009.05a
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• pp.1598-1603
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• 2009

Recently, several wheel for freight car in running had experienced the wheel failure due to fatigue crack, overheat braking and other factors. Severe heating of the wheel during tread braking was believed to be a contributing factor of derailment. It is necessary to evaluate the residual stress in wheel tread. In the present paper, the residual stress of wheel using x-ray diffraction system is investigated. the result shows that the residual stress of wheel is depend on the running distance and wear rate of wheel.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2007.04a
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• pp.265-270
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• 2007

According to previous research, welding-induced residual stresses in steel structures can significantly affect the fatigue behaviour. Usually, high tensile residual stresses up to the yield strength are conservatively assumed at the weld toes. This conservative assumption can result in misleading fatigue assessments. Thee welding-induced residual stresses need be known in advance for a reliable fatigue assessment, which becomes possible to an increasing extent by numerical welding simulation. In this study, a fatigue Analysis technique for steel structures with welding induced residual stress is presented. First, We calculate the history of temperature according with welding process. Secondly, residual stress with a welding thermal history was evaluated by non-linear thermal stress analysis and lastly, fatigue strength is estimated with modified Goodman equation which can consider the effect of mean stress level.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.326-329
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• 2009

In order to analyze the effect of leveling conditions on residual stress evolution of hot rolled high strength steels, a numerical algorithm was developed. It was able to implement the effect of plastic fraction (intermesh) in leveling, line tension, work roll bending, and initial residual stress and curl distribution. The effect of work roll bending on residual stress and curl were studied by using the developed program. The validity of simulated results was verified from comparison with the experimentally measured residual stress and curl in a sheet.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.112-115
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• 2007

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the region with residual stress was expanded. The gradient of residual stress within plate was reduced during the leveling process. But the residual stress itself was not removed at the ranges of tested conditions. From the measured residual stress distribution within the plate, camber of plate cut to small width was predicted exactly within error range of experiment.

• Journal of Ocean Engineering and Technology
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• v.14 no.4
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• pp.79-85
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• 2000

Press-fit pin connection is the solderless interference-fit between pins and plated through holes(PTH) in the printed curcuit board(PCB). Because of not only its simple assembly and absence of problems associated with soldering, but also its good mechanical and electrical characteristics, the press-fit pin connection technology has quickly gained wide acceptance in the telecommunications and computer industries. In this paper, the contact stress characteristics of the domestic CPF pin when inserted into the friction coefficients were compared and the stress variations of the compliant part of the pin, which have an influence on the performance, were displayed with the time and arc length after complete connected. It is supposed that the results will provide useful data to improve the performance of the pin-PCB interconnection mechanism.

• Geotechnical Engineering
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• v.3 no.4
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• pp.7-20
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• 1987

This study was performed to investigate the effect of time-dependent creep on the deformation analysis of multi-dimensional consolidation using the finite element method for young Sedimentary clay. It was assumed that the creep in the clay had occured during consolidation. In the analysis, the Modified cam-clay theory originated from the critical state theory was used as the constitutive equation, in which a term equivalent to the creep was supplemnted. The results of the analysis were in good agreement with the observed values in the field.

• Journal of the Korean Society of Safety
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• v.24 no.1
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• pp.7-13
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• 2009

The objective of this study is to design a laboratory specimen for simulating residual stress of circumferential butt welding between pipes. Specimen type and method to generate residual stress were proposed based on the review of prior studies and parametric finite element analysis. To prove the proposed specimen type and loading method, the residual stress was generated using the designed specimen by applying proposed method and was measured. The measured residual stress using X-ray diffraction reasonably agreed with the results of finite element analysis considered in the specimen design. Comparison of residual strains measured at several locations on the specimen and given by finite element simulation also showed good agreement. Therefore, it is indicated that the designed specimen in this study can reasonably simulate the axial residual stress of a circumferential butt welding of pipe.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.493-496
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• 2008

The residual stress generated in the boron steel blank formed via hot press forming process was predicted by JMatPro, a material property modeler, and Abaqus. The numerical predictions were compared by the experimental measurements obtained by the instrumented indentation. Both the predicted and measured principal stresses monitored at the outer surface of central bending position were qualitatively in good agreement. It was concluded that the residual stresses generated from hot forming process is not negligible as it has been generally assumed, although the spring back deformation is quite small. This should be specially considered from the part design stage since the tensile nature of the residual stress exhibited on the surface may lead to the stress corrosion cracking.

• Journal of the Korea Concrete Institute
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• v.13 no.5
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• pp.491-498
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• 2001

The failure phenomenon of overlaid concrete structures, such as surface crack and peel-off failure in the contact zone, was investigated due to temperature shock(rainfall). To investigate this failure phenomenon, the surface tensile stress, and the shear stress, the vertical tensile stress in the contact zone were analysed using the non-linear stress-strain relationship of material such as strain-hardening- and strain-softening diagrams. Rainfall intensity, overlay thickness and overlay material were the main variables in the analyses. It is assumed that the initial temperature of overlaid concrete structures was heated up to 55$\^{C}$ by the solar heat. With a rain temperature 10$\^{C}$ and the rainfall intensity of nR=1/a, tR=10min, 60min, the stress states of overlaid concrete structures were calculated. The result shows that only fictitious cracks occurred in the overlay surface and no shear bond failure occurred in the contact zone. The vortical tensile stress increasing with overlay thickness was proved to be the cause of peel-off failure in the contact zone. The formulae for relationship between the vertical tensile stress and overlay thickness, material properties were derived. Using this formulae, it is possible to select proper material and overlay thickness to prevent failure in the contact zone due to temperature shock caused by rainfall.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.