• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.15-21
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• 2006

This work deals with the electrical conductivity of dielectric on output parameters such as metal removal rate and surface roughness value of a carbon steel(SM25C) and sintered carbides cut by wire electrical discharge machining (WEDM). Dielectric has several functions like insulation, ionization, cooling, the removal of waste metal particles. The presence of minute metal particles(debris) in spark gap contaminates and lowers the breakdown strength of dielectric. And it is considered that too much debris in spark gap is generally believed to be the cause of arcing. Experimental results show that increases of cobalt amount in carbides affects the metal removal rate and worsens the surface quality as a greater quantity of solidified metal deposits on the eroded surface. Lower electrical conductivity of the dielectric results in a lower metal removal rate because the gap between wire electrode and workpiece reduced. Especially, the surface characteristics of rough-cut workpiece and wire electrode were analyzed too. Debris were analyzed also through scanning electron microscopy(SEM) and surface roughness tester. Micro cracks and some of electrode material are found on the workpiece surface by energy dispersive spectrometer(EDS).

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.175-183
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• 2022

With the expansion of the automobile market, the demand for Nd as an essential rare earth material for automobile motors is rapidly increasing. Research on the calcio-thermic reduction process between Nd₂O₃ and calcium-based alloys has been extensively studied in order to manufacture Nd. In this study, Ca-Cu, as a reducing for Nd₂O₃, was prepared by electrolysis in CaCl₂ molten salt. Cu wire and graphite were employed as a working electrode and a counter electrode for electrolysis reaction, respectively. The reference electrode was manufactured by putting Ag wire in a mixture of AgCl and CaCl₂ at a ratio of 1:99 mol%. The cyclic voltammetry results showed that the deposition of Ca²⁺ on the surface of working electrode was observed from a potential of -1.8 V, and the reduction potential of Ca²⁺ decreased as the reaction temperature increased. The diffusion coefficient of Ca²⁺ calculated by the chronoamperometry experiment was found to be 5.4(±6.8)×10^-6 cm²/s. In addition, Ca-Cu liquid alloy was prepared by applying a constant potential to Cu electrodes. The element ratio of Ca-Cu alloy formed by applying a potential of -2.0 V was found to Ca:Cu=1:4.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.8
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• pp.673-680
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• 2015

A roll-to-roll (R2R) continuous manufacturing system for a carbon-nanotube (CNT)-/silver-nanowire (AgNW)- based large-area transparent conductive film was introduced in this study. The systemic guidelines of the R2R slot-die coating process including roll eccentricity, wrap angle, pump accuracy, and blower influence were discussed. To simulate the coating phenomenon, we investigated the governing parameters of the coating process by incorporating the estimated relative thickness that was defined by combining the viscocapillary model and volume model. By using experimental and mathematical approaches, an excellent transparent conductive layer with a $40{\Omega}/{\Box}$ sheet resistance and 88 % transmittance was obtained; moreover, a dimensionless number identifies the correlation between the transparent conductive film and the anti-reflection film.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.875-878
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• 1997

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though it is very hard material and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.37-41
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• 2019

Sheet resistance reduction in the Ag nanowire (NW) coated films is accomplished with slight improvement of optical properties for the application of transparent conducting electrodes by using $O_2$ plasma treatment. The sheet resistance was optimized after 30 seconds $O_2$ plasma treatment, showing the 27 % of maximum decrease of sheet resistance. It is found that the $O_2$ plasma treatment get rid of the residual organic materials at the junction of Ag NWs. However, the Ag NWs may be also snapped by the excessive $O_2$ plasma treatment can showing the collapses of Ag NWs networks. Furthermore, the optical properties such as optical transmittance and haze were monotonically improved with the $O_2$ plasma treatment time until 90 seconds.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1640-1642
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• 2001

본 연구에서는 금속와이어를 자동으로 공급할 수 있는 피딩장치와 금속와이어가 전극에 일정거리 도달하면 자발방전에 의하여 나노분말이 제조될 수 있는 챔버, 그리고 충전기 등의 장비 일체를 제작하여 연속적인 전기폭발 실험을 행하였으며, 이렇게 제조된 분말입도와 공정 중에 나타나는 펄스방전 특성과의 상호연관성을 조사하였다. 그 결과, 진동이 없는 전류 파형을 갖는 경우에 나노분말을 제조하기가 가장 적합함을 확인할 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.953-956
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• 1997

Micro drilling characteristics by EDM method was investigated. In detail, Micro tool electrode for EDM drilling was machined by use of WEDG method and micro hole was drilled using the machined tool electrode in SUS plate. The machining accuracy and time was compared in a different dielectric fluid. As a result, it was convinced that this method could be utilized as a fabrication technology of micro mold or micro 3 dimensional parts.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.28-35
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• 2013

Micro electrical discharge machining (EDM) as a non-contact machining process is very effective for micromachining with a thin electrode because of its low machining reaction force. The micro-electrode machining device has the advantage of maintaining high precision through the whole processes and uses a feeding wire in the thin electrode tool manufacturing process. This study describes the design and evaluation of a micro-electrode machining device using optical photo-interrupter. The electrode was fabricated by reverse electrical discharge machining. The performance of designed system was evaluated to measure tension force according to feed speed of wire. This system for micro electrode fabrication proves the feasibility in the micro-EDM process of the micro holes and parts for industrial applications.

• Journal of IKEEE
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• v.13 no.2
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• pp.126-131
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• 2009

To overcome short channel effects, wrap-around field effect transistors have drawn a great deal of attention for their superior electrostatic coupling between the channel and the surrounding gate electrode. In this paper, we introduce a bottom-up technique to fabricate a wrap-around field effect transistor using silicon nanowires as the conduction channel. Device fabrication was consisted mainly of electron-beam lithography, dielectrophoresis to accurately align the nanowires, and the formation of gate electrode using electrochemical deposition. The electrolyte for electrochemical deposition was made up of non-toxic organic-based solution and liquid nitrogen was used as a method of maintaining the shape of polymethyl methacrylate(PMMA) during the process of electrochemical deposition. Patterned PMMA can be used as a nano-template to produce wrap-around gate nano-structures.