• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.57-65
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• 2015

Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.220-223
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• 1997

Moire topography method is a well-known non-contacting 3-D measuement method. Recently, the automatic 3-D measurement by moire topography has been required since the method was frequently applied to the engineering and medical fields. 3-D measurement using projection moire topography is very attractive because of it's high measuring speed and high sensitivity. In this paper, using two-wavelength method of projection moire topography tested to measuring object with the 2x-ambiguity problem. Experimental results prove that the proposed scheme is capable of finding absolute fringe orders, so that the 2x-ambiguity problem can be effectively overcome so as to treat large step discontinuities in measured objects.