• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.1-7
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• 2006

In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

• International Journal of Highway Engineering
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• v.11 no.4
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• pp.59-68
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• 2009

Torsional behavior of concrete pavement slabs due to temperature and moisture effects is constrained by self weight and friction etc, and causes stress as the result. The stress due to humidity variation in the slab is difficult to calculate while that due to temperature variation can easily be calculated by a commercial structural analysis program. Thus, the slab behavior can be predicted more accurately if the humidity effect is converted to equivalent temperature and is used as an input of structural analysis. In this study, a concrete pavement slab was constructed and strains of the slab due to environmental loadings were measured for long-term period. Thermal strains were subtracted from the measured strains by using thermal expansion coefficient of the concrete measured in a laboratory. Shrinkage strains, the remained strains, was supposed as additional thermal strains to calculate imaginary temperature with equivalent effect of the shrinkage by dividing the shrinkage with the thermal expansion coefficient. An existing shrinkage model was modified by considering the self weight and friction to be used in another model which can convert differential shrinkage between top and bottom of the slab to equivalent temperature difference. Addition research efforts on tensile stress reduction according to steady increase in the compressive strains are warranted for more accurate stress calculation.

• International Journal of Highway Engineering
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• v.11 no.2
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• pp.185-194
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• 2009

The autogenous shrinkage of high-performance concrete, including very-early strength latex-modified concrete(VES-LMC), is generally bigger than that of normal strength concrete because of the low water/cement ratio, high binder contents, and usage of superplasticizer. Mix. proportion of VES-LMC has low water/cement ratio(0.38), high cement content(390kg/m$^3$), and aid of latex(15% of cement weight). Thus, these factors of VES-LMC, rapid water self-dissipation and evaporation within 3 hours of concrete placement would increase the autogenous shrinkage. The purpose of this study was to evaluate the early-age shrinkage, thermal deformation and autogenous shrinkages of VES-LMC with retarder contents(retarder solids-cement ratio, by weight) using to secure working time in field. The experimental results showed that retarder contents do not affect of the maximum hydration temperature. Early-age expansion of VES-LMC was mostly caused by thermal expansion and partly by autogenous expansion. The autogenous shrinkage is decreased by increasing the retarder contents within this study. On the other hand, the usage of retarder should be decided carefully considering the field conditions because an excessive usage of retarder can cause handful early-age expansion.

• Nuclear Engineering and Technology
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• v.19 no.1
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• pp.22-33
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• 1987

The confirmed integrity of nuclear fuel cladding materials is an important object during steady state and transient operations at nuclear power plant. In this context, the clad material yielding behavior is especially important because of pellet-clad gap expansion. During the steep power excursion, the in-pile irradiation behavior differences between uranium-dioxide fuel pellet and zircaloy clad induce the contact pressure between them. If this pressure reaches the zircaloy clad yield pressure, the zircaloy clad will be plastically deformed. After the reactor power resumed to normal state, this plastic permanent expansion of clad tube give rise to the pellet-clad gap expansion. In this paper, the simple mandrel expansion test method which utilizes thermal expansion difference between copper mandrel and zircaloy tube was adopted to simulate this phenomenon. That is, copper mandrel which has approximately three times of thermal expansion coefficient of zircaloy-4 (PWR fuel cladding material) were used in this experiment at the temperature range from 400C to 700C. The measured plastic expansion of zircaloy outer radius and derived mathematical relations give the yield pressure, yield stress of zircaloy-4 clad at the various clad wall temperatures, the activation energy of zircaloy tube yielding, and pellet-clad gap expansion. The obtained results are in good agreement with previous experimental results. The mathematical analysis and simple test method prove to be a reliable and simple technique to assess the yielding behavior and gap expansion measurement between zircaloy-4 tube and uranium-dioxide fuel pellet under biaxial stress conditions.

• Economic and Environmental Geology
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• v.36 no.1
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• pp.1-8
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• 2003

This study was performed to measure expandabilities and coherent scattering domain sizes (CSDs) of bentonite samples from Campo and Yonil area, Korea, using X-ray powder diffraction (XRD), and to compare their experimental data with those of international standard bentonite samples (SAz-1, STx-1, and SWy-2). Most of Gampo and Yonil bentonite samples comprised randomly interstratified illite-smectite (R0 I-S), and their expandabilities ranged over 77-100%S$_{XRD}$ from the saddle/001 method. The interstratification deformed 001 peaks of EG-solvated samples (Mering's first principle), which prohibited us from adopting these peaks to measure CSDs using BWA (Bertaut-Warren-Averbach) method. CSDs of the bentonite samples with R0 I-S could be measured through dehydration at 30$0^{\circ}C$ after K-saturation, where the deformation originated from the interstratification could be removed effectively. Campo and Yonil bentonite samples showed that their mean CSDs ranged over 3.8-5.4 interlayers, and that their CSDs distributions were similar to those of Gonzales (STx-1) and Wyoming (SWy-2) bentonite samples.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.57-65
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• 2015

Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.

• Journal of Welding and Joining
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• v.15 no.3
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• pp.20-28
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• 1997

용접부에는 많은 취약조건들이 존재하며 파괴의 주 원인이 되고 있어 이들에 대한 많은 연구가 진행되고 있다. 따라서, 현재 용접재료, 용접 조건 및 용접방법 등 을 개선함으로써 여러 방면에서 좋은 결과를 얻고 있다. 그러나 아직도 용접시의 열소 성변형과 구속조건에 따라 분포하는 잔류응력에 의한 피로균열거동에 대한 연구는 정확한 잔류응력 측정의 어려움으로 미흡한 상태이다. 특히 잔류응력의 측정기술과 반복하중에 의한 피로균열 진전시 잔류응력의 이완 등은 이들을 해석하는데 많은 어 려움을 주고 있다. 용접시 높은 열에 의한 재료의 팽창과 냉각시의 수축변형은 용접 부재에 인장 및 압축 잔류응력을 유발시키고, 인장잔류응력은 균열 진전될 때 잔류 응력은 오히려 균열을 지연시키기도 한다. 또한 잔류응력장에서 피로 균열이 진전될 때 잔류응력은 일반적으로 작용하중의 크기와 반복 수 그리고 균열 진전 등으로 인하 여 이완되고 재분포된다. 본 해설에서는 용접재의 피로거동중에 발생하는 잔류응력의 재분포 현상을 하중의 범위, 하중 반복수, 균열 진전의 영향으로 구분하여 각각의 영향에 대해서 기술하고자 한다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.3286-3291
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• 2014

A study on the crack protection and thermal insulation properties of the expanded perlite inorganic composites was performed. Mixed expanded perlite with a water glass was stabilized for 24 hrs at room temperature in the mold and, thereafter, converted into a massive foamed body through complete drying process at $150^{\circ}C$. Aluminum phosphate and micron size mica powder were used as a reaction accelerator and a stabilizer for thermal crack, respectively. Especially, use of mica exhibited a remarkable effect on the protection of thermal crack at higher temperature over $500^{\circ}C$, and thermal conductivity of the composites was enhanced with higher perlite contents, showing ca. 0.09 W/mK for the sample of 100/200/10/1.5 water glass/perlite/mica/Al phosphate by weight. A severe dimensional deformation of the composite materials was observed over $600^{\circ}C$, however, showing a temperature limitation for a practical application. The facts were considered as the results from the glass transition temperature of the water glass, of which main component is sodium silicate.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.1
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• pp.38-43
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• 2018

Ceramic membrane has been widely used for water treatment due to its advantages of eco-friendly property and low energy consumption. However, high porosity of ceramic membrane higher than 40 % may cause a problem of strength, when it is applied to a water treatment module. In order to solve this problem, the strength of the membrane edge was improved by using the ceramic glaze. Four different glaze compositions for low temperature sintering was selected to minimize the deformation of the membrane microstructure. After coating with low temperature glaze, cracks were observed due to differences in thermal expansion coefficient between the membrane and glaze. Thus, the thermal expansion coefficient of glaze was controlled by addition of cordierite and petalite. As a results, the compressive strength of the ceramic membrane, which was coated with the optimized glaze composition, was increased from $27N/m^2$ to $117N/m^2$, indicating that the glaze coating can improve the disadvantages of the fragile ceramic membrane.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.