• Polymer(Korea)
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• v.30 no.2
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• pp.140-145
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• 2006

The mort commonly available substrate material is glass in the display fibrication process. However, glass is not desirable due to its heaviness and fragility. Recently, plastics such polysulfone (PSF), polyethesulfone (PES), polycarbonate (PC), polyethylene terephthalate (PET) and cyclic olefin polymers (COP) have been investigated to replace glass as a substrate material for display fibrication. Plastic substrates are advantageous in that they are lightweight, huh impart resistance, flexibility, and ability for roll to roll manufacturing process. But many plastics have poor chemical resistance in organic solvent. The chemica resistance is also lequired because they are exposed to solvents for various chemical treatments din the manufacturing process. So, we have an interest in the chemical modification of PSF to improve chemical resistance. We introduced crosslinkable imide moieties using chloromethylation method for the modification of PSF which could be overcome above shortcomings for display substrate based on plastic film. We prepared the cross-linked polysulfone films which were represented chemical resistance in HeOH, THF, DMSO and NMP. The thermal properties were measured by TGA, DSC and TMA. As the results, we have confirmed to enhance of the thermal property. They had low coefficient of thermal expansion (CTE) which decreased to 15% and had increased $T_g\;from\;180^{\circ}C\;to\;252^{\circ}C$. Cross-linked polysulfone films with imide side-chain had good optical properties and chemical resistance so that they could be used as flexible display substrate.

• Journal of Conservation Science
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• v.30 no.3
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• pp.249-261
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• 2014

This study aims to examine production technique of white wares from the Guyre-2ri 1st and 2nd kiln sites, Wonju, Gangwon Province and characteristics of the used materials, and to find a correlation among materials of the excavated white wares. X-ray fluorescence sequential spectroscopy(XRF), X-ray diffraction(XRD), Dilatometer and Inductively coupled plasma mass spectrometry(ICP-MS), Inductively coupled plasma automic emission spectrometer(ICP-AES) were applied to determine the chemical composition, crystalline phase of samples, firing temperatures, trace elements and rare earth elements. White wares from the Guyre-2ri kiln sites contained high contents of coloring oxides and fluxes. Though firing temperature of each sample was different, they were mostly fired at a temperature below $1200^{\circ}C$ and some of them experienced a low temperature of $1000^{\circ}C{\pm}20^{\circ}C$ and a high temperature above $1200^{\circ}C$. When analyzing body crystalline phases of the white wares using the XRD method, quartz and mullite were extracted from all the samples, and the proportions were similar to each other. When analyzing the excavated white wares using the Seger formula, also, all the samples showed similar clay sources and production techniques. Moreover, the white wares were made of host rocks of the same geological origin, according to the result of rare earth elements analysis.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.317-317
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• 2012

사파이어는 우수한 광학적, 물리적, 화학적 특성을 가지고 있는 물질 중의 하나이며, 청색 발광특성을 나타내는 GaN와 격자상수, 열팽창 계수가 가장 유사할 뿐만 아니라 가격도 상대적으로 저렴하여 GaN 성장을 위한 기판으로 사용된다. 실제로 사파이어는 프로젝터와 전자파장치, 군사용 장비 등 다양한 분야에 응용되고 있으며, 발광 다이오드(LED)를 위한 기판으로 활용됨으로써 그 수요가 급격히 증가하고 있다. 그러나 사파이어 결정의 성장 중에 생길 수 있는 전위(dislocation)와 적층결함(stacking fault) 등의 결정 결함들은 결정 내에 존재하여 역학적, 전기적 성질에 큰 영향을 미칠 수 있다. 특히 사파이어가 청색 발광소자의 기판으로 사용되는 경우, 사파이어 기판 내부의 결정 결함은 증착되는 박막 특성에 영향을 미치게 된다. 따라서 사파이어의 보다 나은 응용을 위해서는 결함의 형성 메커니즘과 결정 결함의 평가기술 등에 대한 이해가 필요하고, 특히 결함의 정량적 평가 기술의 개발은 사파이어의 상용화에 중요한 핵심요소 중 하나이다. 결정 내 결함이 위치하는 부분은 분자나 원자간의 결합이 약하거나 높은 에너지 상태이므로, 결정의 표면을 적절한 산이나 염기 등을 이용하여 에칭하면 에칭반응은 결정의 전위 위치에 해당하는 부분부터 일어나 결정의 표면에 에치핏을 형성한다. 따라서 결정 표면에 나타나는 에치핏의 개수를 관찰하면 결정의 전위 밀도 파악이 비교적 간단하고, 에칭반응의 이러한 특징은 전위의 정량적 평가에 이용이 가능하다. 본 연구는 4인치 사파이어 조각기판을 수산화칼륨(KOH)으로 습식에칭 후 표면에 나타나는 에치핏의 형성거동과 이의 시간 및 온도 의존성에 관한 연구를 진행하였다. 또한 단결정의 전위밀도를 예측하기 위해 사파이어 조각시편의 단위면적당 에치핏의 개수를 파악하여 에치핏밀도(EPD, etch pid density)를 계산하였고, 값의 불확도(uncertainty)를 계산하여 전위밀도의 신뢰도를 평가하였다. 그 결과, 사파이어 조각시편의 에치핏밀도는 단위면적($cm^2$)당 약 ${\sim}10^2$개로 확인되었고, 이 값은 약 2%의 상대불확도를 가지는 것으로 나타났다.

• Applied Chemistry for Engineering
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• v.10 no.5
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• pp.701-706
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• 1999

The effect of siloxane oligomer content on thermal stability and internal stress of DGEBA epoxy resin was investigated. Siloxane-epoxy polymers having terminal epoxy group were prepared by reaction of siloxane-DDM prepolymer with DGEBA epoxy resin. Thermal stability was studied in terms of the initial decomposition temperature(IDT), temperature of maximum rate of weight loss($T_{max}$), integral procedural decomposition temperature(IPDT), and decomposition activation energy($E_t$) using TGA data. The thermal stability increased with increasing the siloxane oligomer content and showed a maximum value in the case of 5 wt% siloxane oligomer content in the blend system. While, the coefficient of thermal expansion(${\alpha}_r$) and the flexural modulus($E_r$) allowed us to study internal stress of the blend system. As the content of siloxane oligomer increases, the internal stress systematically decreases as decreasing both ${\alpha}_r$ and $E_r$.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.6
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• pp.39-44
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• 2005

Due to mismatch of thermal expansion coefficients between aluminum sheet and glass/epoxy sheet, thermal residual stresses generally appear in the FML. These stresses will affect the yield and fatigue strength of the FML. The numerically determined residual stresses in the Fiber-Metal-Laminates(FML) have been compared to the residual stresses measured from the curvature and tensile test methods. These two experimental methods have been developed for assessing the influence of residual stress in FML. Post-stretching process has been applied to remove the thermal residual stress and reverse the stress distribution. After post-stretching process, the residual stress has been measured from experiments. The results obtained show that analytical and experimental data are well agreed. The thermal residual stress can be removed by post-stretching process and it will increase the yield strength of FML.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.10
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• pp.45-50
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• 1999

We report a solder-clad fiber Bragg grating(FBG) temperature sensor in order to obtain better Bragg wavelength sensitivity to temperature than a bare FBG sensor. The solder-clad FBG sensor shows a wavelength sensitivity improvement by a factor of four compared to the case of a bare FBG sensor at temperatures below $110^{\circ}C$. However, it has a sensitivity of 0.01 $nm/^{\circ}C$ at temperatures over $110^{\circ}C$, which is identical to that of a bare FBG sensor. Bragg wavelength of the sensor shows a blue-shift below $110^{\circ}C$ because the sensor is fabricated above melting temperature of solder. The thermal stress at the FBG-solder interface has been relieved by annealing, which results in a stable operation.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.411-412
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• 2012

대부분의 상용 LED는 사파이어기판에 성장된 GaN를 기반으로 사용한다. GaN는 $1,000^{\circ}C$ 이상의 높은 온도에서 성장이 이루어지는데 이 경우 GaN과 사파이어 기판과의 높은 열팽창 계수로 인하여 compressive stress를 받게 된다. 이 compressive stress로 인하여 성장된 GaN wafer에 bowing이 일어나게 되고 이는 기판의 대면적화에 커다란 문제로 작용한다. 이런 문제들을 해결하기 위해 여러 방법이 고안되고 있지만 [1,2], 근본적으로 wafer bowing 문제의 해결은 이루어지고 있지 않다. 한편, 일반적으로 박막을 성장할 때 columnar structure를 가지는 박막이 coalescence되면 박막에 tensile stress가 걸린다는 사실이 알려져 있으며 [3], GaN를 저온에서 성장할 경우 columnar structure를 갖는다는 사실이 보고되었다 [4]. 본 연구에서는 이런columnar structure를 갖는 GaN을 이용하여 wafer bowing 문제가 해결된 GaN 박막 성장을 연구하였다. 본 실험에서는, c-plane 사파이어에 유기금속화학증착법(MOCVD)을 이용하여 nano-columnar structure를 갖는 저온 GaN layer을 성장하였다. 그 후 columnar structure를 유지하면서 $1,040^{\circ}C$까지 annealing한 후 고온에서 flat 한 GaN 박막을 nano-columnar structure GaN layer위에 성장 하였다. 우선 저온 GaN layer가 nano-columnar structure를 갖고, 고온에서도 nano-columnar structure가 유지되는 것을 scanning electron microscopy (SEM)과 transmission electron microcopy (TEM)을 통해 확인하였다. 또한 이런 columnar structure 위에 고온에서 성장시킨 flat한 GaN 박막이 성장된 것을 관찰할 수 있었다. 성장된 GaN박막의 wafer bowing 정도를 측정한 결과, columnar structure를 갖고 있는 고온 GaN 박막이 일반적인 GaN에 비해 확연하게 wafer bowing이 감소된 것을 확인할 수 있었다. Columnar structure가 coalescence가 되면서 생기는 tensile stress가 GaN박막의 성장시 발생하는 compressive stress를 compensation하여 wafer bowing이 줄어든 것으로 보인다. 본 발표에서는 이 구조에 대한 구조 및 stress 효과에 대해서 논의할 예정이다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.5 no.1
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• pp.25-36
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• 1995

We have investigated the structure and the conductivity of the $Cd_{1-y}Zn_{y}$ Te films evaporated on the glass substrates (Corning 7059) by Electron Beam Evaporator (EBE) in pressure of approximately $1 {\times} 10^{-6}$ torr.The structure temperatures were held at both room temperature and $300^{\circ}C$, and the samples have annealed for an hour at $300^{\circ}C$ The survace com-position of the as-prepared films were slightly different from those of CdZn Te source material.Cd losses on the CdZnTe surface was measured about 4% of atomic ratio at room temperature substrate, whereas Zn atomic ratio was nearly constant, relatively. The strure is observed to be polycrystalline whose phase is mainly cubic phase. Thermal expansion coefficient was $6.30 {\times} 10^{-5}/^{\circ}C$ which was calculated from the variation of lattice parameter by X-ray powder pat-terns measured at $400^{\circ}C$.Diffraction peaks were slightly increased by annealing for an hour at $300^{\circ}C $, but they werey highly affected by substrate temperature during evaporation.

• Journal of the Korean Society of Propulsion Engineers
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• v.24 no.6
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• pp.101-107
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• 2020

In this paper, step-curing, which includes the change of curing temperature on the curing process, was applied to reduce curing day of HTPB/AP based propellant. This study targets the improvement of productivity of HTPB/AP based solid rocket motor. Comparison of mechanical properties of propellant resulted in the change of normal curing condition (60℃, 5 days) to step-curing condition (60℃, 1 day / 65℃, 3 days). Post-cure test was conducted to determine the impact on the shelf life of the solid rocket motor. The aging characteristics of propellants were analyzed by measuring mechanical properties and thermal expansion factor. To step-cured propellant, accelerated aging test was performed for 12 weeks, followed by tensile test. Sm(bar) and Em(%) were higher than 8 bar and 40% each, showing excellent mechanical properties.

• Journal of Adhesion and Interface
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• v.2 no.2
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• pp.1-10
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• 2001

Silica for Epoxy Molding Compound (EMC) was coated via plasma-polymerization with RF plasma (13.56 MHz) as a function of treatment time, power and pressure. 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allylmercaptan or allylalcohol were utilized for plasma polymerization coating and adhesion of coated silica was evaluated by measuring flexural strength. CTE and water absorption of EMC were also measured, and fracture surface of flexural specimen was analyzed by SEM in order to elucidate the failure mode. The plasma polymer coated silica was analyzed by FT-IR and reactivity of plasma polymer coating with epoxy resin was evaluated with DSC in order to investigate the adhesion mechanism. The EMC prepared from the silica coated with 1,3-diaminopropane or allylamine exhibited high flexural strength, low CTE, and low water absorption compared with the control sample, and also exhibited 100% cohesive failure mode. These results can be attributed to the chemical reaction between the functional groups in the plasma polymer coating and epoxy resin, and also consistent with the results from FT-IR and DSC analysis.