• Journal of Ocean Engineering and Technology
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• v.8 no.2
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• pp.157-165
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• 1994

Effect of an accelerated iso-thermal aging (375 degree C x 66days, 375 degree C x 200days) on elastic-plastic fracture resistance curve were examined in SA533B low alloy steel. Fracture toughness test are conducted by unloading compliance method at room temperature. But the apparent negative crack growth phenomenon, usually arise in partial unloading compliance test. The phenomenon of negative crack growth may be eliminated by the offset technique. There is no effect of aging on J sub(IC) and dJ/da in iso-thermal aged (375 degree C x 66 days) specimen, but there is very little effect in iso-thermal aged (375 degree C x 200 days) specimen.

• Proceeding of EDISON Challenge
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• 2013.04a
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• pp.387-392
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• 2013

본 연구에서는 천음속 전투기 무장창 내부의 압력 진동을 제어하기 위해 F-111의 무장창을 2차원 공동(Cavity)으로 모델링하고, EDISON_전산열유체 시스템을 활용하여 공동의 형상 변화에 따라 발생하는 유동 특성을 분석하였다. 최근의 전투기들은 항력 감소와 스텔스 기능을 위해 무기를 기체 안에 내장하는데, 덮개를 열 때 발생하는 공동 형상에 의해 강한 압력 진동이 유발된다. 이러한 진동은 무장창과 주변 기계 장치에 구조적 진동을 일으키고 고장 또는 파괴를 유발하므로, 근본적인 해결책이 필요한 중요한 문제이다. 본 연구에서는 진동의 원인이 되는 전단층(Shear layer) 불안정성을 해결하기 위해 기존에 연구된 형상(Leading edge extension 및 Ramp)과 본 연구에서 새로 제안한 Ramp extension을 적용해 보았다. 그 결과 압력 진동의 원인이 되는 유동 특성이 줄어들고 압력 진동 역시 감소했음을 관찰할 수 있었다.

• Journal of the Korean earth science society
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• v.25 no.7
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• pp.629-636
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• 2004

In order to study developments of the marine atmosphere boundary layer in cloud incoming, important parameters like heat advection, surface layer heat flux, and radiation energy were estimated using the rawinsonde, AWS data, satellite images, and buoy data which was installed at the East Sea. We explained the variation and the development of mixed layer in terms of surface layer heat flux and long wave radiation under the cloudy sky. The heat flux was obtained by means of the bulk method. Conservation of heat was analysed by heat budget equation, which was consist of buoy data in the East sea, and sounding data at Ulleungdo and at Pohang. During the inflow of cloud, radiative cooling at the surface after was suppressed and long wave radiation from cloud played a role of warming. The surface layer temperature was also remained warm by influence of warm advection from south-easterly direction. The air temperature in night was increased, as a result, mixed layer was not destroyed and The nocturnal boundary layer was composed of the mixed layer and the residual layer.

• Journal of Energy Engineering
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• v.22 no.4
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• pp.333-337
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• 2013

본 논문에서는 태양전지의 Ribbon 두께(A-type:0.2mm, B-type:0.25mm)에 따라 3가지 온도조건 ($-40{\sim}65^{\circ}C$, $-40{\sim}85^{\circ}C$, $-40{\sim}105^{\circ}C$)으로 열충격 시험을 수행하였다. 그 결과, A, B type 별 초기 평균효율은 15.2%로 같았다. 하지만, 열충격 시험(600 Cycle) 후 Condition 1에서 A-type 7.5%, B-type 7.7%, Condition 2에서는 8.6%, 13.2%를 나타내었다. Condition 3에서는 각각 11.6%, 19.9%의 감소율을 나타내었다. 열충격 시험 후 A-type보다 Ribbon두께가 두꺼운 B-type의 효율이 크게 감소하였다. 이는 A, B type 모두 이종재료 접합부의 금속간화합물(IMC)층이 형성되어 전기적 저항이 증대된 것으로 판단된다. 또한, B-type의 I-V 특성 곡선 및 EL을 분석한 결과, p-n층이 파괴되고, 병렬저항이 감소하여, 장기적 신뢰성에서 A-type 보다 더 취약한 것으로 나타났다. 향후 태양전지 Ribbon 형상에 따른 장기 신뢰성 특성에 대해 수치해석 및 시뮬레이션 분석이 수반되어야 할 것이다.

• Proceedings of the Korea Water Resources Association Conference
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• 2009.05a
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• pp.2033-2037
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• 2009

호소내의 흐름은 중력의 영향을 받는 하천의 흐름과는 달리 열수지에 의한 밀도류 및 바람 등에 영향을 크게 받아 특유의 유동특성을 나타낸다. 본 연구에서는 EFDC(Environmental fluid Dynamics Code, 미국 버지니아 해양연구소 개발) 모델을 이용하여 호소 내 수치모의를 실시하였다. 복잡한 지형을 형성하고 있는 호수 내의 유동특성의 정밀도를 향상시키기 위해서는, 흐름특성을 고려한 grid작성이 중요하다. 본 연구에서는 1:3000, 1:5000 축척의 수치지도를 이용하여 장흥호의 하상단면 값을 추정하였으며, GIS를 이용하여 (${\Delta}x$, ${\Delta}y$)=100m로 DEM을 생성하였다. 그리고 구성된 DEM값을 이용하여 정밀도가 높은 최종 Cartesian grid(active cell=706)를 구축하였다. EFDC를 이용한 장흥호의 수치모의 결과 호수내의 흐름은 수면을 통한 열 교환에 의한 수온 밀도류를 형성하고 있으며, 수온성층의 형성과 파괴가 호수 흐름을 형성하는 큰 인자로 작용한다는 것을 확인할 수 있었다. 그리고, 호에 유입되는 하천부분에서는 유입되는 수온에 따라 흐름특성이 변하며, 유입수온에 따라 호수 내 관입위치가 변하여 표면흐름, 내부흐름, 저부흐름 등의 흐름특성을 보인다 이상과 같이, 호수내의 흐름특성을 열수지, 외력에 의해서 크게 변동하며 해석대상역의 지역특성을 반영한 수리현상의 정확한 재현 없이는, 이 유동해석결과를 입력치로 하는 수질모델링 결과는 신뢰도에 심각한 문제를 발생시킨다고 할 수 있다.

• Polymer(Korea)
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• v.26 no.3
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• pp.344-352
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• 2002

In this work, two thermal cationic latent catalysts, i.e., triphenyl benzyl phosphonium hexafluoroantimonate (TBPH) and benzyl 2-methylpyrazinium hexafluoroantimonate (BMPH) were newly synthesized. And the thermal and mechanical properties of difunctional epoxy (diglycidylether of bisphenol h, DGEBA) resins initiated by 1 phr of either TBPH or BMPH catalyst were investigated. As experimental results, the epoxy/TBPH system showed higher curing temperature and critical stress intensity factor ($K_{IC}$) than those of epoxy/BMPH. This could be interpreted in terms of slow thermal diffusion rate and bulk structure of four phenyl groups in TBPH. However, the decomposed activation energy determined from Coats-Redfern method was lower in the case of epoxy/TBPH. This result was probably due to the fact that broken short chain structure was developed by steric hindrance of TBPH.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.6
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• pp.593-600
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• 2012

The exergy characteristics for R245fa and water working fluids have been analyzed for an electric generation system utilizing the Rankine cycle to recover heat from the wasted exhaust gas from a diesel engine used for the propulsion of a large ship. The theoretical calculation results showed that the efficiencies of exergy and system exergy improved as the turbine inlet pressure increased for R245fa at a fixed mass flow rate. Furthermore, the exergy destruction rates of the condenser and evaporator were relatively larger than those in other components. The exergy efficiency of the system increased with increasing mass flow rate. For a water working fluid, although the exergy destruction rate of the evaporator was similar to that for R245fa, the exergy loss rate varied significantly in response to variations in the pressure and mass flow rates at the turbine inlet.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.45-52
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• 2011

It is known that test methods to evaluate solder joint reliability are die shock test, die shear test, 3points bending test, and thermal shock test. The present study investigated the effects of failure mode on 3 types (as-reflowed, $85^{\circ}C$/85%RH treatment, and $150^{\circ}C$/10hr aging) of solder joints for flip-chip BGA package by using various test methods. The test methods and configurations are reported in detail, i.e. die shock, die shear, 3points bending, and thermal shock test. We focus on the failure mode of solder joints under various tests. The test results indicate that die shock and die shear test method can reveal brittle fracture in flip-chip ball grid array (FCBGA) packages with higher sensitivity.

• Journal of the Korean Geotechnical Society
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• v.32 no.1
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• pp.5-18
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• 2016

In this study, we grasped the resistance state of the back ground which had a notable influence on computing the lateral resistance of the laterally loaded pile group in the homogeneous ground by the model test. Resistance state was grasped as the depth of rotation-point, wedge failure angle, and wedge wing angle. The model experiment is performed by varying the width, spacing and number of piles and the relative density of sand in this study. According to the observation of the rear ground surface deformation of the piles in lateral load, rotation point ratio, wedge failure angle, and wedge wing angle of the front row were similar to those of the middle row; however, those of the back row were relatively smaller. The rotation point ratio, wedge failure angle and wedge wing angle of the piles in parallel were the same as those of a single pile. Based on the model test results, equations for estimation of the rotation-point, wedge failure angle, and wedge wing angle are proposed.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.19-26
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• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.