• Polymer(Korea)
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• v.24 no.2
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• pp.201-210
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• 2000

To determine the effect of chain length of linear amine curing agents on the thermal and mechanical properties, standard epoxy resin, diglycidyl ether of bisphenol A (DGEBA) was cured with diethylenetriamine (DETA), triethylenetetraamine (TETA) and tetraethylenepentaamine (TEPA) in a stoichiometrically equivalent ratio. From this work, the effect of linear amine curing agents on the thermal and mechanical properties was significantly influenced by chain length of curing agents. In contrast, the results showed that the DGEBA/DETA system had higher values than the DGEBA/TETA and DGEBA/TEPA system in the density, shrinkage (%), thermal expansion coefficient, tensile modulus, and flexural strength. Whereas the DGEBA/DETA cure system had lower values than the DGEBA/TETA and DGEBA/TEPA cure system in the maximum exothermic temperature, conversion (%), and T$_{g}$. These findings imply that the differences in the maximum conversion about the chain length of curing agents affect the thermal and mechanical properties.s.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.6
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• pp.651-659
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• 2011

With the increase in the thermal power output of recently developed nuclear power plants, the applied forces and moments are increased in some piping systems, so that the leak-before-break (LBB) application criteria would not be satisfied in those pipes. In this paper, we present a method for obtaining the additive LBB margin in the pipes by considering the nonlinearity of the crack and material properties. Finite element analysis and the moment-rotation equation of beam theory were used to calculate the nonlinearity of the crack and material properties. Moreover crack stability analysis was performed using the method proposed in this study. The LBB margin was increased effectively through consideration of the nonlinearity of the crack and material properties in the pipe.

• Tunnel and Underground Space
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• v.30 no.5
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• pp.446-461
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• 2020

Numerical simulations of CIEMAT column test in Spain are performed to investigate the coupled thermo-hydro-mechanical (THM) behavior of MX80 bentonite pellets using TOUGH2-FLAC3D. The heater power and injection pressure of water in the numerical simulations are identical to those in the laboratory test. To investigate the applicability of the thermo-hydraulic (TH) model used in TOUGH2 code to prediction of the coupled TH behavior, the simulation results are compared with the observations of temperature and relative humidity with time. The tendencies of the coupled behavior observed in the test are well represented by the numerical models and the simulator in terms of temperature and relative humidity evolutions. Moreover, the performance of the models for the reproduction and prediction of the coupled TH behavior is globally satisfactory compared with the observations. However, the calculated stress change is relatively small and slow due to the limitations of the simple elastic and swelling pressure model used in numerical simulations. It seems that the two models are insufficient to realistically reproduce the complex coupled THM behavior in the bentonite pellets.

• Journal of the Korea Concrete Institute
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• v.20 no.3
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• pp.357-367
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• 2008

Parametric study of beams with reinforced with FRP rebar is conducted in this study. Using ABAQUS program, the finite element analysis model is set and calibrated with the experimental results which have been conducted by the authors. The employed design parameters are reinforcement ratio, elastic modulus of rebar, and concrete strength. The obtained results from FE analysis are investigated in terms of normalized beam stiffness. In particular, the effect of reinforcement ratio on the flexural stiffness is investigated with comparing with the model code specified on ACI 440. From the analysis results, the reinforcement ratio in beam is the first parameter affecting on the beam stiffness. In addition, its effect could be increased with higher concrete strength.

• Elastomers and Composites
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• v.43 no.1
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• pp.18-24
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• 2008

An oligomeric diol was utilized as a modifier for the reaction rate and mechanical properties of a RT-castable polyurethane elastomer. Both the reaction rate and the tensile strength of the blend samples, in which the modifier and the base resins were mixed with one-shot method, showed an exponential decrease as the increase of modifier concentration. Thermal analysis method of Kissinger was also effectively applied in the present study, showing good linearity in the plot of ln $(q/T^2_p)$ vs. $(1/T_p)$ and activation energy $E_a$ of 44.80 kJ/mol, which is similar to the general castable polyurethane. In the mechanical properties, remarkable decrease of strength was found by the addition of modifier concentration range up to about 20 phr, while characteristic elongation property of the elastomer, high elongation at lower strength, was observed over 20 phr of the modifier. Exponential decrease of the break strength of the blend sample exhibited that the mechanical properties of the blend might be considerably sensitive to the modifier concentration.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.566-566
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• 2012

그래핀(Graphene)은 모든 탄소 동소체의 기본구성 요소로 2 차원 결정구조를 가지며, 양자홀 효과(quantum Hall effect), 뛰어난 열 전도도, 고 탄성, 광학적 투과성 등과 같은 탁월한 물리적 성질을 보이는 물질이다. 이러한 그래핀의 우수한 특성은 전계 효과 트랜지스터(field effect transistor), 화학/바이오 센서, 투명 전극(transparent electrode) 등의 다양한 전자소자를 개발하는 응용 가능하다. 그 중, 그래핀 투명전극의 제조는 가장 응용가능성이 높은 분야이다. 현재 투명전극 물질로는 인듐-주석 산화물(indium tin oxide; ITO)가 널리 이용되고 있으나, 인듐의 고갈로 인한 공급부족 문제 및 고 생산비용, 휘어지지 않는 취성 등의 단점을 지니고 있다. 따라서, 우수한 광학적 투과성과 전기전도성을 지닌 그래핀이 ITO의 대체 물질로서 각광받고 있다.[1-5] 본 연구에서는 그래핀의 투명전도필름의 응용을 위해 면저항을 낮추기 위한 방법으로 화학적 도핑(doping)을 이용하였다. 그래핀은 구리(copper; Cu) 호일을 촉매로 사용하여 열 화학증착법(Thermal Chemical Vapor Deposition)을 이용하여 합성하였다. 합성된 그래핀은 PMMA(Poly(methyl methacrylate)) 전사법을 이용하여 산화실리콘(SiO2) 기판에 전사 후, 염화은(AgCl)과 클로로벤젠(C6H5Cl)으로 만든 콜로이드(colloid) 용액에 디핑(dipping)하여 그래핀에 은 입자를 도핑 하였다. 그 결과, 은 입자 도핑 농도에 따라 면저항이 감소하는 양상을 보였다. 제작된 그래핀 투명전도성 필름의 투과도는 자외선-가시광선-근적외선 분광법(UV-Vis-NIR spectroscopy)를 이용하여 측정하였고, 라만 분광법(Raman spectroscopy)을 통해 그래핀 필름의 질적 우수성과 성장 균일도를 조사하였다.

• Journal of the Korean Society of Clothing and Textiles
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• v.29 no.12 s.148
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• pp.1619-1626
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• 2005

The durability of a stretch fabric is mainly related to the change in the dimension and mechanical properties of elastomeric fibers during wearing and washing. In this study, we examined the effects of washing temperature, presoaking time and the number of washing cycles on the change in length, tenacity, elongation at break, and permanent elongation after six repeated cycles of $100\%$ extension and relaxation of spandex yams with varying fineness and with a different rate of extension during heat-set. The spandex yarns continued to shrink as the wash temperature and the number of wash cycles increased. In addition, the finer spandex yams decreased in length more than the thicker yams. The increase in temperature and presoaking time tended to cause a slight decrease in the tenacity and elongation at break of the spandex yarns. Permanent elongation of the spandex yams also increased as the temperature, presoaking time and the number of washing cycles increased. Moreover, an extended presoaking time followed by washing at $40\%$ like repeated washing cycles showed the great increase in the permanent elongation of spandex yams. The thinner spandex yin had a better elasticity than the thicker one, since the former had a lower permanent elongation percentage than the latter. Based on the DSC thermograms, the melting points of the spandex yarns after washing were almost the same as those of the spandex yarns before washing.

• Journal of Adhesion and Interface
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• v.9 no.3
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• pp.20-26
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• 2008

It is well know that the structure of shape memory alloy (SMA) can change from martensite austenite by either temperature or stress. Due to their inherent shape recovery properties, SMA fiber can be used such as for stress or cure-monitoring sensor or actuator, during applied stress or temperature. Incomplete superelasticity was observed as the stress hysteresis at stress-strain curve under cyclic loading test and temperature change. Superelasticity behavior was observed for the single-SMA fiber/epoxy composites under cyclic mechanical loading at stress-strain curve. SMA fiber or epoxy embedded SMA fiber composite exhibited the decreased interfacial properties due to the cyclic loading and thus reduced shape memory performance. Rigid epoxy and the changed interfacial adhesion between SMA fiber and epoxy by the surface treatment on SMA fiber exhibited similar incomplete superelastic trend. Epoxy embedded single SMA fiber exhibited the incomplete recovery during cure process by remaining residual heat and thus occurring residual stress in single SMA fiber/epoxy composite.

• Journal of Korean Society of Steel Construction
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• v.26 no.1
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• pp.43-53
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• 2014

A single plate connection(SPC) consists of a plate welded to the columns and bolts connected to the beam web. The SPC is widely used for a simple shear connection of steel structure because it is easy-to-fabricated, easy-to-installed and economical. The conventional SPC is used for 2 to 12 bolts in a single vertical row. It is designed to limit the plate thickness by bolt diameter to obtain flexible and ductile connections. The design strength for eccentric shear shall be the lesser of the shear strength of bolts or bearing strength of plate and when the design strength is decided by edge distance failure, the results can be very conservative. Although the research on special solution for 'weak-plate/strong-bolt' model with 2 to 4 bolts has been conducted by L. S. Muir, and W. A. Thonton, 2004, study on generalized design procedures did not conduct. This study proposed design procedure for evaluation of the design strength of eccentric shear bolt groups on a single plate connection based on the actual edge distance and the direction of bolt reaction forces by using elastic vector method(EVM) and instantaneous center of rotation method(ICM).

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.