• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.808-811
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• 2007

본 연구는 3톤/일급 이하 가스화 용융로에서 $1,400{\sim}1,500^{\cdot}C$, $7.5{\sim}8.0$ kg/$cm^2$의 안정적인 운전조건일 때, 시료로 Kideco 탄을 사용하고 이때 발생한 슬랙의 특성 및 슬랙의 재활용을 위한 벽돌제조 특성을 고찰하였다. 발생된 슬랙은 $Fe_2SiO_4$와 $SiO_2$가 결정상태로 일부 존재하거나, 중금속들이 결합되어 엉킨 구조인 비결정상태의 치밀한 형태로 이루어져 있었으며, 잔존탄소 함량이 0.06%로 미량 존재하였다. 또한 슬랙에는 중금속 농도가 Kideco탄보다 고농도로 존재하지만, 용출되는 중금속의 농도는 매우 낮아 환경적으로 안정한 물질로서 재활용이 가능한 특성을 지니고 있다. 슬랙 첨가 점토벽돌의 적합성을 평가하기위해 슬랙을 0%, 10%, 30% 첨가하여 벽돌을 제조하고 KS 산업규격에 따라 시험을 실시하였다. 분석결과 슬랙을 첨가할수록 제조한 벽돌의 흡수율이 낮아져 기존 제품에 비하여 우수한 것으로 측정되었다. 또한 압축강도와 휨강도는 기존 제품의 $80{\sim}86%$ 정도인 것으로 측정되었지만 KS 산업규격의 기준치보다 높은 수치를 나타내였고, 내산성, 내알칼리성, 열충격강도 또한 양호한 것으로 나타나, 슬랙을 이용하여 벽돌로 재활용하여 충분히 사용 가능한 것으로 확인되었다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.23-33
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• 2007

The growing environmental regulation governs the use of lead by RoHS, WEEE, and then. The electronic industry is moving to replace Pb-bearing solder with Pb-free solder. To use the Pb-free solder, microelectronic industry needs consequently the new reliability appraisal such as the packaging for high temperature process, various mechanical change caused by new solder, and the development of Pb-free sloder for long life of product. The evaluation of solder bar and mechanical properties of joint were performed compared with international standard, and new appraisal standard was established. The solderability and spread ability of Sn-0.7Cu solder material showed up to the standard. Shear test of solder joint using by the solder resulted that the shear strengths after thermal shock or after aging were not much lower than the shear strength of as-soldered and that they were also up to the standard.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.3 s.258
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• pp.295-303
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• 2007

Degradation behaviors of filament-winded composites have been evaluated under the accelerated environmental test of high temperature, water immersion and thermal impact conditions. Two kinds of laminated composites coated by an urethane resin have been used: carbon-fiber reinforced epoxy(T700/Epon-826, CFRP) and glass-fiber reinforced phenolic (E-glass/phenolic, GFRP). For tensile strength of $0^{\circ}$ composites, CFRP showed little degradation while GFRP did high reduction by 25% under the influence of high temperature and water However for water-immersed $90^{\circ}$ composites tensile strength of both CFRP and GFRP showed high reduction. Bending strength and modulus of $90^{\circ}$ composites were largely reduced in water-immersion as well as high temperature environment. Urethane coating on the composite surface improved the bending properties by 20%, however hardly showed such improvement for water-immersed $90^{\circ}$ composites. In case of shear strength and modulus, both CFRP and GFRP showed high reduction by water-Immersion test but did a slight increase by high temperature and thermal impact conditions.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.126-132
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• 2011

Fatigue cracks of the turbocharger are often observed for high performance engines under thermal shock tests. Maximum exhaust gas temperature of recently developed gasoline engines could reach approximately $950^{\circ}C$. It's very important to estimate transient temperature histories during thermal shock cycles to predict the stress and the fatigue life of the turbocharger. With these temperature profiles, temperature-dependent material properties and boundary conditions, we could identify critical locations by the application of finite element simulation technologies. In this paper, we applied the reliable analysis approach to the actual turbocharger to predict the weak locations due to the repetitions of plastic strains and compared the results with the crack locations under physical engine test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Journal of Applied Reliability
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• v.13 no.3
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Korean Journal of Materials Research
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• v.3 no.4
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• pp.372-380
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• 1993

In order to improve the oxidative resistance of carbon/carbon composites, aluminium-isopropoxide and aluminium-tri-sec-butoxide sol were coated on the surface of 2D--carbon/carbon composiles and the effects uf coating were investigated. The effects of oxidative resistance were dominant in the case of catalyst/alkoxide mole ratio, 0.07, and $H_2O$/alkoxide mole ratio, 100. Through the dynamic TGA analysis with the heating rate of 20%/min, oxidative initiation tempera~ ture was enhanced about $80^{\circ}C$. The oxidative resistance effects of alkoxide sol were improved according to the times of coating. Also the 20% weight loss time of coated samples by TGA analysis was 20% better than that of un~ coated samples. The thickness of 1^{st} coated layer was about 3${\mu}$m and that of $2^{nd}$ and $3^{nd}$ coated layers was about respectively 4~5${\mu}$m and the weight loss were increased with the increasing of thermal shock test times.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.911-917
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• 2010

In this study, we performed structural and fatigue analyses of the engine exhaust manifold that was subjected to thermo-mechanical cyclic loading. The methodologies used in this study are based on an approach in which the techniques for modeling the exhaust system, the temperature-dependent properties of the material, and thermal cyclic loading are taken into consideration and a reliable strategy is adopted for failure prediction. An application example shows that at an elevated temperature, considerable compressive plastic deformation is observed and that at a low temperature, tensile stresses remain in those parts of the test exhaust manifold where failure is observed. In order to predict fatigue life, mechanical damage is determined on the basis of the stress.strain hysteresis loops by using the classical Coffin.Manson equation and by adopting a method in which the dissipated plastic energy is taken into consideration.

• Journal of the Korean Ceramic Society
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• v.24 no.3
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• pp.243-250
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• 1987

The effects aging on some properties and thermal-shock behavior of zirconia partially stabilized with 9 mol% MgO (9MZ) were studied. 9MZ specimens were aged over $1200^{\circ}$-$1400^{\circ}C$ for 12hours subsequently, after sintering at $1650^{\circ}C$ for 4 hours. Fracture strength(both before and after thermal-shock test), linear thermal expansion, monoclinic fraction and phase transition by XRD, density, galvanic potential and microstructure were measured. Quantitative chemical analysis around the grain-boundary of the specimen aged at $1350^{\circ}C$ was also conducted by EDX. The aging of 9MZ specimen causes a thermal decomposition of cubic-$ZrO^{2}$ into the formation metastable tetragonal-$ZrO^{2}$ and MgO. The former increases the residual strength after thermal-shock test and the latter improves the thermal-shock resistance due to thermal conduction through the continuous magnesia phase and the formation of monoclinic phase content in matrix were increased with decreasing the aging temperature from $1400^{\circ}C$ to $1200^{\circ}C$. Galvanic potential of the aged specimen exhibited a proper emf characteristic.