• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1655-1662
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• 2011

We have conducted a study on stainless steel laser-welding materials by using a laser beam for the evaluation. Stainless steel used in a rust and excellent thermal deformation has a variety of application. In this study, to improve the mechanical properties of stainless steel, a 50 W laser thermal source is used and magnetic fields are applied, on the basis of suggestions. The mechanical properties and performance are evaluated by performing a numerical analysis, tensile test, and shape, microstructure, and hardness test. The results show that the mechanical properties of improve increased speed the melting pool, tensile strength of 16 kPa rise, run into the melting zone and hardness 7 Hv.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.596-599
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• 1997

In this study, the flow control system with shape memory alloy in jet engine inlet was suggested to adjust the shock boundary layer interact~on for supersonic flight system. It consisted of the flap with shape memory alloy, spar with steel, and fixing device with aluminum alloy. The advantages of itself are a simple configuration, a passive air circulation by using the flap deflection due to pressure difference, and no need to be required the auxiliary devices. Finite element analysis was conducted to predict the thenno-mechanical behavlor of the flap system with shape memory alloy. The user-defined subroutine UMAT was implemented with ABAQUS to accon~modate the thermo-mechanical constitutive relation of shape memory alloy.

• Composites Research
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• v.28 no.5
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• pp.260-264
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• 2015

In this paper, molecular dynamics (MD) simulation was carried to predict thermo-mechanical behaviors for carbon nanotube (CNT) reinforced epoxy composites and to analyze the trends. Total of six models having the volume fractions of CNT from 0 to 25% in epoxy were constructed. To predict thermal behaviors, temperature was increased constantly from 300 to 600 K, and the glass transition temperature ($T_g$) and coefficient of thermal expansion (CTE) analyzed using the relationship between temperature and specific volume. The elastic moduli that represented to the mechanical behaviors were also predicted by constant strain. Additionally, the effects of functionalization of CNT on mechanical behaviors of composite were analyzed. Models were constructed to represent CNTs functionalized by nitrogen doping and COOH groops, and interfacial behaviors and elastic moduli were analyzed. Results showed that the agglomerations of CNTs in epoxy cause by perturbations of thermo-mechanical behaviors, and the functionalization of CNTs improved the interfacial response as well as mechanical properties.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.4
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• pp.1-7
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• 2003

습공기에 포함된 수증기가 상(Phase)변화를 일으킬 때 잠열이 발생하고 이 잠열은 익형 주위의 압축성 유동 상태량들을 변화시키므로, 이러한 열 증가가 유동에 끼치는 영향에 대하여 수치해석을 통하여 연구 수행하였다. 수치해석은 Rusak 과 Lee [1]가 최근에 연구 수행한 미교란 방법(small-disturbance approach)에 근거하여 이루어졌다. 고전적 핵 생성 모델과 작은 물방울 성장(droplet growth)모델을 이용한 이 방법에서는 비평형 균질 응축과정에서 일어나는 열 방출을 묘사한다. 응축에 의한 열전달, 압축성 유동의 운동에너지, 그리고 유동의 열적 상태량들 사이에서 일어나는 비선형 상호영향을 조사하고, 또한 주어진 문제를 지배가호 있는 상사 파라미터들을 제시하였다. 계산 결과들은 Euler 방정식을 사용하여 얻은 선행 수치계산들과 비교하여 잘 일치됨을 보였다. 상사법칙은 유동 동역학과 응축 상태량들이 상당히 비슷하게 거동하는 다양한 유동 형태들을 제안한다. 압축성 습공기 유동은 유체기계에 사용되는 익형들의 공력 성능을 증가시키는데 응용될 수 있다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.7
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• pp.857-864
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• 2013

A laser machining process has been applied in many manufacturing fields and it provides an excellent energy control for treating materials. However, a heat effect during laser machining can deteriorate material properties. Specifically, a thermally induced stress can be a problem in laser-machined structures on a metal surface. In this study, temperature and stress on cold-rolled carbon steel sheet machined with laser hole drilling were explored in an experimental approach and a numerical method. Stresses by temperature gradients inside the materials were generated in fast cooling. The stresses were measured by using a hole-drilling method and the material properties of carbon steel (SCP1-S) were obtained in the experiment. It was found that the stress predicted from the numerical analysis was in agreement with the stresses measured by using the hole-drilling method. The analysis can be applied for evaluating structure characteristics machined with a laser.

• 전기의세계
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• v.39 no.9
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• pp.46-53
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• 1990

대용량 고속기의 경우는 기계적인 강성, 냉각, 열적해석, BALANCING(진동), 소음, 축의 위험속도 처리등의 이론적 해석과 이것의 응용 및 이론을 근거로한 체계화된 제조기술의 KNOW HOW에 따라 성공여부가 결정된다고 할 수 있겠다. 금번 패사의 대용량 고속기의 제작으로 국내적으로는 지금까지 수입에만 의존해온던 화력, 열병합 발전소, 제철, 제강, 시멘트 등의 대용량 부하가 요구되는 산업장의 대용량 및 고속전동기의 국산화가 가능하게 되었으며 국외적으로는 일본 및 구미지역으로도 수출할 수 있는 길을 열었다고 보아진다. 그러나 국내 각 산업장의 대용량, 고속기의 국산화에 있어서는 사용자의 국산화로의 전향적인 자세와 MAKER의 기술력이 부합될 때에만 가능하다고 할 수 있으며 이것이 향후 국내 중전기 업계의 기술 발전의 향방을 가름한다고 할 수 있겠다. 또 고장력 규소강판, 축재, ENDRING소재, ROTOR BAR, BEARING등 중요자재의 국내 구입시 많은 어려움을 겪었으며 납기, 가격에 관계없이 국내 제작 자체가 불가능한 품목도 있었다. 앞으로 중전기기 업계는 이러한 어려움을 공감하고 소재 및 부품(완제품) MAKER의 공동 개발 및 육성으로 대처해 나가야 할 것이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05c
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• pp.168-173
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• 2001

배전용 애자는 전기적, 열적, 기계적 스트레스 등 내 외부 서지에 의한 균열이 서서히 발생되며 장시간 사용시 절연파괴에 의한 지락사고로 진전되는 경우가 많다. 이러한 사고로 인하여 순간정전이나 장시간 정전에 의한 피해를 최소화하기 위해 열화된 애자를 조기에 검출함으로써 전력공급의 신뢰성 향상을 기하고자 한다. 이를 위해 열화된 애자에서 나타나는 물리적 현상에 의해 변화되는 주파수 스펙트럼 분포 해석을 통해 방전 전자파가 갖는 주기성 파형(120Hz)을 검출하여 열화된 애자를 탐지 추적하는 장치를 개발하고자 한다.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.4
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• pp.285-291
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• 2017

In this study, a case analysis for thermal design of electronic equipment using a phase change material(PCM) was performed numerically using ANSYS Fluent. Experiments were conducted to find the temperature increase(${\Delta}T_m$), melting temperature($T_m$), and volume expansion of the PCM under the melting process. To verify the accuracy of the Fluent solver model, $T_m$, ${\Delta}T_m$, and the melting time were compared with experimental results. To simulate the temperature stagnation phenomenon under the melting process, the equivalent specific heat method was applied to calculate the thermal properties of the PCM in the solver model. To determine the thermal stability of electronic equipment, we paid special attention to finding a thermal design for the PCM using fins. Further, an additional numerical analysis is currently underway to find an optimum design.

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.