• Title/Summary/Keyword: 열싱크

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Analyzing the Characteristics of Thermal transient on MOSFET depending on a Heat sink (히트싱크에 의한 MOSFET의 열전달 특성변화 분석)

  • Kim, Ki-Hyun;Seo, Kil-Soo;Kim, Hyoung-Woo;Kim, Sang-Choel;Kim, Nam-Kyun;Kim, Eun-Dong
    • Proceedings of the KIEE Conference
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    • 2005.07c
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    • pp.1980-1982
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    • 2005
  • Power MOSFET의 구동시에는 많은 열이 발생하게 된다. 이때 발생하는 열은 소자의 특성이나 수명에 영향을 주어 오동작을 하게되는 원인이 되기도 한다. 일반적으로 열이 많이 발생하는 chip이나 개별소자의 경우 히트싱크를 부착하여 사용하게 된다. 본 논문에서는 열을 방출시키기 위해 사용되는 히트싱크에 의한 열 전달(Thermal Transient) 특성의 변화 및 히트싱크의 부착에 이용되는 히트싱크 컴파운드(heat sink compound)에 의한 열 전달 특성에 미치는 영향 등을 실험을 통하여 분석하였고, 이를 기술하였다.

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Numerically-Investigated Thermal Performances of Hybrid Fin Heat Sinks for Lightweight Thermal Management of LED Modules Under Natural Convection (자연대류상의 LED 모듈의 경량열관리를 위한 하이브리드 휜 히트싱크의 수치적으로 조사된 열성능)

  • Kim, Kyoung Joon
    • Journal of Advanced Marine Engineering and Technology
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    • v.39 no.6
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    • pp.586-591
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    • 2015
  • This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.

A Study on Cooling Performance of Aluminium Heat Sink with Pulsating Heat Pipe (PHP를 결합한 알루미늄 히트싱크의 냉각성능에 관한 연구)

  • Kim, Jong-Soo;Ha, Soo-Jung;Kwon, Yong-Ha
    • Journal of Advanced Marine Engineering and Technology
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    • v.35 no.8
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    • pp.1016-1021
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    • 2011
  • The enhancement for cooling performance of heat sink is surely necessary to guarantee the performance of electronic products. So in this paper, the cooling performances of the aluminum heat sink with pulsating heat pipe(PHP) were investigated experimentally and numerically. The pulsating heat pipe was used as a heat spreader. Working fluid of PHP was R-22. Heat inputs were 30W, 60W, 80W and 100W, respectively. Heat sink was tested for forced convection conditions with air velocity of 1 ~ 4m/s. And CFD simulations were conducted for two different heat sinks. The results showed that the cooling performance of heat sink with pulsating heat pipe was higher than that of conventional heat sink. Therefore, the pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

Fabrication of Micro-Heatsink using Nanotemplate (나노 템플레이트를 이용한 마이크로 히트 싱크)

  • 함은주;손원일;홍재민
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.7-11
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    • 2003
  • The semiconductor chips or electronic components generate heat, which causes malfunction of the parts when it was not cooled properly. Bulky heat sink and cooling fan are used to get rid of the heat. However, with this bulky system, it is hard to integrate the electronics system in a small scale. The cooling efficiency of the system depends on the surface area of the heat sink, thermal conductivity of the material and the method of integration. In order to develop a novel cooling system, a micro-heatsink with a large surface area while retaining small volume was fabricated by electroless deposition of gold/copper inside a Track-etched membrane. The structure of the micro-heatsink was investigated using SEM or optical microscope. It was also found that the micro-heatsink is more efficient than a flat copper plate.

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Fabrication of Micro-Heatsink using Nanotemplate (나노 템플레이트를 이용한 마이크로 히트 싱크의 제조)

  • 함은주;손원일;홍재민
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.81-85
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    • 2002
  • 전기 전자 제품에 사용되는 반도체 칩이나 부품들은 작동시 발열을 하게 되며 이러한 열은 적절히 제거되지 않은 경우 전기 전자 제품의 오작동을 유발시키는 요인이 된다. 발열부품이 작동할 때 발생되는 열을 제거하기 위해서 히트싱크나 냉각팬과 같은 구조를 발열 부품 장착시 같이 설치하는 방법이 일반적으로 사용되는 냉각구조 형태지만 이와 같은 냉각 구조는 최근의 전기 전가 제품의 소형화 추세에 부응하는데는 한계가 있다. 따라서 이러한 냉각 구조의 한계를 보완하기 위한 방안으로써 소형화한 히트싱크, 즉 두께와 방열의 중요 요인이 되는 히트싱크의 방열핀의 크기를 나노미터 단위에서 밀리미터 단위로 제조한 마이크로 히트 싱크를 제조하여 그 효용성에 대해 연구하고자 하였다. 마이크로 히트싱크의 제조는 균일한 포어를 포함한 폴리머 멤브레인에 열전도성이 뛰어난 금속을 무전해 도금하는 방법으로 제조하였으며 주사현미경으로써 관찰하였다.

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Study on the Natural Convection Heat-Transfer Enhancement in Radial Heat Sink Using the Perforation and Flow Guide (천공과 유동 가이드를 활용한 방사형 히트싱크의 자연대류 열전달 향상에 관한 연구)

  • Jeon, Sora;Li, Bin;Byon, Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.5
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    • pp.339-345
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    • 2016
  • In this study, we numerically investigate the thermal performance of an enhanced radial heat sink with a perforation and chimney structure. We estimate the thermal performance of the enhanced radial heat sink, and compared it with that of a conventional radial heat sink. The results show that the radial heat sink with perforation has a higher thermal performance when either of the diameter and the number of perforations is high. With regards to the radial heat sink with a chimney structure, we investigate primarily the effect of the fin number, and the spacing between the chimney and the base plate on the thermal performance. The results show that there are optimal values for the fin number and the spacing between chimney and base plate. In addition, the enhanced radial heat sinks have maximum thermal performance when facing upward ($0^{\circ}$), while it has worst performance when facing sideward ($90^{\circ}$). The perforation and chimney are shown to cause thermal performance enhancements of 17% and 20%, respectively, compared with a conventional radial heat sink. The proposed method is useful for starting business, and is useful in terms of venture and entrepreneurship.

Thermal Characteristics of a Heat Sink with Helical Fin Structure for an LED Lighting Fixture (헬리컬 핀 구조를 가진 LED 조명용 히트싱크의 열 특성)

  • Kim, Young-Hoon;Yim, Hae-Dong;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.25 no.6
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    • pp.311-314
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    • 2014
  • In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.

Computational Investigation of the Thermal Performances of Polymer Heat Sinks Passively-Cooled by Seawater for Thermoelectric Waste Heat Recovery (열전폐열회수를 위해 수동적으로 해수냉각되는 폴리머 히트싱크 열성능의 수치적 연구)

  • Kim, Kyoung Joon
    • Journal of Advanced Marine Engineering and Technology
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    • v.39 no.4
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    • pp.432-436
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    • 2015
  • This study computationally explored the thermal performance of passively-cooled polymer heat sinks utilizing seawater. Polymer heat sinks are proposed as cooling modules of the cold sides of thermoelectric generators for waste heat recovery. 3-D Computational Fluid Dynamics (CFD) modelling was conducted for a detailed numerical study. Polyphenylene sulfide (PPS) and pyrolytic graphite (PG) were selected for the base materials of polymer heat sinks. The computational study evaluated the performance of the PPS and PG heat sinks at various fin numbers and fin thicknesses. Their performances were compared with those of aluminum (Al) and titanium (Ti) heat sinks. The study results showed that the thermal performance of the PG heat sink was 3~4 times better than that of the Ti heat sink. This might be due mainly to the better heat spreading of the PG heat sink than the Ti heat sink. The effect of the number of fins on the performance of the PG heat sink was dissimilar to the cases of the PPS and Ti heat sinks. This result can be explained by the interrelationships among heat spreading, surface area enhancement, and fluidic resistance incorporating with an increase in the number of fins.

Thermal Analysis of the Heat Sink Performance using FEM (유한 요소법을 이용한 히트싱크의 성능평가를 위한 열해석 연구)

  • Lee, Bong-Gu;Lee, Min
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.9
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    • pp.5467-5473
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    • 2014
  • This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.

Thermal Optimization of a Straight Fin Heat Sink with Bypass Flow (바이패스가 있는 히트 싱크의 열성능 최적화)

  • Kim, Jin-Wook;Kim, Sang-Hoon;Kim, Joong-Nyon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.2
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    • pp.179-184
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    • 2010
  • This experimental study investigated the effect of tip clearance and bypass flow on the cooling performance of a straight fin heat sink. Both the horizontal and vertical directions of the bypass flow were studied by using a mass flow controller and test sections. The thermal resistance of a heat sink was obtained to elucidate the response of the cooling performance to tip clearance and bypass flow. The thermal resistance of a straight fin heat sink gradually increases with increasing tip clearance. A flow guide unit was employed to reduce the bypass flow. An optimal distance from the leading edge of the heat sink to the flow guide unit was found for the fixed volume flow rate. The contribution of the flow guide unit to the thermal performance of a heat sink increases with increasing volume flow rate.