• The Optical Journal
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• s.99
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• pp.64-68
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• 2005

유리나 파인 세라믹 등의 경취 재료를 연삭한 뒤의 특징은 지립의 최대 절입 깊이가 충분히 작은 경우, 바꿔말하면 파괴 단위가 극히 작은 경우에는 연성 모드적 연삭이 되고, 또 반대로 큰 경우에는 취성 모드적 연삭이 된다는 것이다. 보통 연성 모드적 연삭은 다듬질 연삭에, 그리고 취성 모드적 연삭은 조연삭에 적용되는 경우가 많다. 따라서 여기서는 치수·형상 정밀도를 유지하고 동시에 여분의 가공 공차를 매우 능률적으로 제거하는 것을 목적으로 한 경취 재료의 조면 연삭 기초에 대해 소개한다.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.10
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• pp.13-18
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• 2007

• The Optical Journal
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• s.101
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• pp.57-63
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• 2006

지금까지 재현성이나 안정성이 문제가 되어온 경면 연삭이나 연성 모드 연삭도 ELID 연삭법의 개발에 따라 실용화되기 시작하고 있다. 부드러운 지석으로 피삭재 표면을 문지르듯이 가공한 기존의 다듬질 연삭은 예리하게 돌출된 미세한 지립에 의해 삭둑삭둑 잘리며 능률적으로 경면화되고 초정밀화 될 수 있는 신가공 기술로 변해 왔다. 또 절삭 가공의 이미지로 난가공재를 깎는 고능률 연삭도 실용 단계로 들어섰다. ELID 법의 본격적인 보급을 위해 관련된 제조업체의 협력으로 주변 기술의 정비가 진행되고 있지만 ELID 연삭 조건을 최적화하려면 작업 목적의 설정과 구성 요소의 선정을 좀더 명확하게 한 다음 적용할 기계 정밀도·성능, 기능과의 적합성을 검토할 필요가 있다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.10
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• pp.182-186
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• 1999

Structural ceramics such as $Al_2O_3$, SIC, and $Si_3N_4$ are difficult to grind materials because of their high hardness and brittleness. They are normally ground in brittle mode, but it is possible to be ground in ductile mode depending upon the grinding conditions. In this paper an experimental investigation has been carried out to see the relationship between the grinding energy and grinding mode. It has been found that the ductile mode grinding consumes more grinding energy than the brittle mode grinding. Thus, the grinding conditions of the higher specific grinding energy leads to the plastic deformation in the ground surface of workpiece and results in the better surface finish.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.40-45
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• 2003

Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.85-89
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• 2012

Conventional grinding of BK7 glass will normally result in brittle fracture at the surface, generating severe sub-surface damage and poor surface finish. The precision grinding of BK7 glass in parallel grinding modes has been investigated. Grinding process, maximum chip thickness, ductile/brittle regime, surface roughness and sub-surface damage have been addressed. Special attention has been given to the condition for generating a ductile mode response on the ground surface. Experiments reveal that the level of surface roughness and depth of sub-surface damage vary differently for different condition. This study gives an indication of the strategy to follow to achieve high quality ground surfaces on brittle materials.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.2
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• pp.48-58
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• 1995

A micro positioning system using piezoelectric actuators have very wide application region such as ultra-precision machine tool, optical device, measurement systen. In order ro keep a high precision displacement resolution, they use a position sensor and feedback the error. From the practical point of view, a high-resolution displacement sensor system are very expensive and difficult to guarantee such sensitive sensors work properly in the hard opera- tion environment of industry. In this study, a micro-positioning grinding table which does not require position sensor but uses piezoelectric voltage feedback, has been developed. It is driven by hystersis-considering reference input voltage which calculated from computer and then uses actuator/sensor characteristics of piezoelectric materials. From the result of experiments we proved a fast and stable response of micro-positioning system and suggested efficient technique to control the piezoelectric actuator. And through grinding experiments, it is revealed that a characteristics of ground surfaces transient to plastic deformation as extremely small depth of grinding.