• 한국정밀공학회지
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• 제19권8호
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• pp.141-146
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramic materials in the grinding with diamond wheel by design of experiments. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the $Si_3\;N_4\;and\;ZrO_2$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the $A1_2\;O_3$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using design of experiments.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.918-921
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• 2001

In grinding process, the heat of $1200^{\circ}$~$1500^{\circ}$ on the grinding area between grinding wheel and workpiece is generated. It decreases the surface integrity of workpiece and causes the thermal damages such as the deformed layer, residual stress and grinding burn. Generally coolant is widely used for preventing the heat generation on the grinding area, but it deteriorates the working condition by polluting the atmosphere of workplace and in the end pollutes the environment. The grinding methods using the compressed cold air and mist are the cooling methods to substitute conventional coolant. They can decrease the environmental pollution through not using coolant any more or minimizing it. In this study, the cooling effects of grinding methods using the compressed cold air and mist have been investigated. The grinding system equipped with the water bathe and mist spray nozzle was developed. The energy partition to workpiece through measuring the temperature on the workpiece surface was calculated. The surface integrity of workpiece and thermal damage like the deformed layer were analyzed.

• 한국공작기계학회논문집
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• 제11권3호
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• pp.86-92
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel far ceramic materials. Normal component of grinding resistance of $Al_2$O$_3$ was less then that of $Si_3 N_4$ and $ZrO_2$. This seems to be the characteristics of ceramic tools on work pieces both of high hardness. For the case of $Si_3 N_4$ and $ZrO_2$, as the mesh number of wheel increases, the surface roughness decreases. For the case of $Al_2 O_3$, the surface roughness does not decreases. Specific binding energy decreases as the material removal rate per unit time increases. For the case of $Si_3 N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $Al_2 O_3$, grinding is carried out by grain shedding process due to brittle fracture.

• 한국산업융합학회 논문집
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• 제12권2호
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• pp.99-105
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• 2009

Among a few items with world wide competitiveness are the semiconductor and the LCD. Grinding/polishing is the most significant process in manufacturing semiconductor wafers and LCD panels, the most critical quality of which is the precision rate of the machined surfaces. It is well known that the control of the vibrations is the major factor in maintaining superb machined surfaces. In this paper the dynamic properties of a grinding machine have been investigated through the frequency analysis test and the computer simulation to deduce ideas of design modifications for improved stability. The alterations have been applied to the simulation model, which is supposed to have identical dynamic property with the original structure, to identify the effects and to finally achieve the satisfactory level of stability. The result shows that the machine can have much improved stability with relatively simple design changes, and also can improve the surface quality of the products.