• Journal of the Korean Society for Precision Engineering
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• v.1 no.2
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• pp.10-14
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• 1984

연삭가공은 숫돌을 구성하는 하나 하나의 입자가 공작물을 절삭하는 과정이므로 연삭현상을 이해하기 위해서는 먼저 개개 절돈의 절삭현상을 알지 않으면 안된다. 연삭입자의 절삭현상을 해명함에 있어서 기초가 되는 것은 입자와 공작물과의 간섭형상이다. 종래의 연삭 이론은 이와같은 기하학적 간섭형상이 모두 chip이 되어 제거된다(연소입자와 공작물과의 간섭 과정에서는 절삭현상만이 존재한다.)는 가정하에 연삭기구를 해석하려 하였으나 최근에 이르러 상호간섭 조건을 경계조건으로 하여 많은 사람들에 의해 연소입자의 절삭현상을 연구한 결과 연삭입자의 절삭과정은 과도적 절삭임이 밝혀졌다. 이와같은 연삭현상은 새로운 연삭이론에 기초가 될 뿐만아니라 Chip 과 표면생성기구의 관점에서도 극히 중요한 것이 된다.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.128-136
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• 1998

A mathematical model for investigating the form generation mechanism in the centerless infeed grinding process is described. For 3-D modeling of form generation, contact points are assumed to be on least squares contact lines at the grinding wheel, regulating wheel, and work-rest blade. Using force and deflection analysis, the validity of this assumption is shown. Based on the 2-D simulation model developed in the previous work and the least squares contact line assumption, a 3-D model is presented. To validate this model, simulation results were compared with the experimental works. The experiments and computer simulations were carried out using three types of cylindrical workpiece shapes with varying flat length. The experimental results agree well with the simulation. It can be seen that the effect of flat end propagated to the opposite end through workpiece reorientation.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.137-144
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• 1998

A mathematical model for investigating the form generation mechanism in the centerless thrufeed grinding process is described. The length of the contact line and the magnitude of the grinding force between the grinding wheel and workpieces vary with the change of the axial location of the current workpiece during grinding. Thus, a new coordinate system and a grinding force curve of previous and/or following workpieces are introduced to treat the axial motion. Experiments and computer simulations were carried out using three types of cylindrical workpiece shapes. To validate this model. simulation results are compared with the experimental results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.846-849
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• 2000

세라믹 재료는 높은 강도 및 결도를 갖는 기계적 성질로 인하여 연삭가공에는 다이아몬드를 지립으로 하는 초지립 숫돌이 사용된다. 다이아몬드는 일반지립에 비하여 내마모성이 월등하게 높다는 사실로부터 숫돌의 트루잉 및 드레싱 작업이 극히 곤란한 것은 주지의 사실이다.(중략)

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.8
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• pp.1298-1310
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• 1997

In recent years, grinding techniques for precision machining of brittle materials used in electric, optical and magnetic parts have been improved by using superabrasive wheel and precision grinding machine. The completion of optimum dressing of superabrasive wheel makes possible the effective precision grinding of brittle materials. However, the present dressing system cannot have control of optimum dressing of the superabrasive wheel. In this study, a new system and the grinding mechanism of optimum in-process electrolytic dressing were proposed. This system can carry out optimum in-process dressing of superabrasive wheel, and give very effective control according to unstable current and gap increase. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of brittle materials.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.423-428
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• 2000

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.429-434
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• 2000

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.131-135
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• 1992

랩핑은 가공물의 치수정도와 다듬질면 정도의 향상을 위해 최종적으로 사용되는 가공법이다. 랩제(abrasive)로 서는 다이아몬드, SiC, 그리고 $Al_{2}$ $O_{3}$ 등이 사용되며 공작액과 혼합되어 가공물과 랩핑 블럭 사이에 끼이어 연삭작용을 하게 된다. 본 연구에서는 중요 가공변수등이 가공면 거칠기와 가공율에 미치는 영향을 실험측정하였고, 그 실험결과를 세라믹 랩핑가공의 기본적 연삭작용 기구인 취성파괴.현상을 기초로 하여 설명하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.42-45
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• 2002

General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.04a
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• pp.96-101
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• 1997

In recent years, grinding techniques for precision machining of brittle materials used in electric, optical and magnetic parts have been improved by using superabrasive wheel and precision grinding machine. The present dressing system cannot have controll of optimum dressing of the superabrasive wheel. In this study, a new system and the grinding mechanism of optimum in-process electrolytic dressing were proposed. This system can carry out optimum in-process dressing of superabrasive wheel, and give very effective control according to unstable current and gap increase. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of brittle materials.