• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.34-41
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• 2004

A new method to fabricate the fine magnetic abrasives by using mechanical alloying is proposed. The mechanical alloying process is a solid powder process where the powder particles are subjected to high energetic impact by the balls in a vial. As the powder particles in the vial are continuously impacted by the balls, cold welding between particles and fracturing of the particles take place repeatedly during the ball milling process using a planetary mill. After the manufacturing process, fine magnetic abrasives which the guest abrasive particles c lung to the base metal matrix without bonding material can be obtained. The shape of the newly fabricated fine magnetic abrasives was investigated using SEM and its polishing performance was verified by experiment. It is very helpful to finishing the injection mold steel in final polishing stage. The areal ms surface roughness of the workpiece after several polishing processes has decreased to a few nanometer scales.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.168-173
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• 2001

The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.557-557
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• 2007

최근 Ruthenium (Ru)은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 캐패시터의 하부전극으로 각광받고 있다. 이렇게 형성된 Ru 하부전극은 각 캐패시터간의 분리와 평탄화를 위해 CMP 공정이 도입되게 되었다. 이러한 CMP 공정후에는 화학적 또는 물리적 상호작용에 의해 웨이퍼 표면에 오염물이 발생할 수 있다. CMP 공정중에 공급되는 슬러리에는 부식액, pH 적정제, 연마입자등이 첨가되는데 이때 사용된 연마입자는 CMP 공정후 입자오염을 유발할 수 있다. 그러므로, CMP 공정후에는 이러한 오염으로 인해 cleaning 공정이 반드시 필요하게 되었다. 하지만, Post Ru CMP cleaning에 대한 연구는 아직 미비한 상태이다. 그리하여 본 연구에서는 post Ru CMP cleaning에 대한 연구와 cleaning solution 그리고 첨가제에 따른 영향을 살펴보았다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.3
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• pp.313-318
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• 2013

Magnetic abrasive polishing is an advanced deburring process for nonmagnetic materials and micropattern products that have non-machinability characteristics. Despite these advantages, there are some problems with using MAP for deburring. MAP has introduced geometric errors into microgrooves because of an over-cutting force caused by uncontrolled magnetic abrasives in the MAP tool. Thus, in this study, to solve this problem, an EP (electrolyte polishing)-MAP hybrid polishing process was developed for deburring microgrooves in an STS316 material. In addition, an evaluation of EP-MAP for the deburring of microgrooves was carried out by profiling the burrs. The results of the experiment showed geometric errors after the deburring process using MAP. However, in the case of EP-MAP, no geometric error was observed after the process because of the lower material removal rate in EP-MAP.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1643-1648
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• 2010

It is very difficult to polish non-magnetic materials by the magnetic abrasive polishing (MAP) process because magnetic force is required for MAP, but the magnetic force for non.magnetic materials is low. In this study, we aimed to develop a magnetic array table and control the magnetic polarity such that the magnetic force can be increased for the MAP of non-magnetic materials. The newly designed magnetic array table has 32 electro magnets, and the magnetic polarity of each electro-magnet can be easily controlled by changing the electric polarity. It was analytically verified that the magnetic flux density of non-magnetic materials can be varied by varying the applied magnetic polarity.

• The Journal of Korean Academy of Prosthodontics
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• v.62 no.2
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• pp.95-103
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• 2024

Purpose. With the advancement of digital technology, 3D printing is being utilized in the fabrication of denture base. Nevertheless, increasing microbial adhesion to the surface of denture base has been reported as the disadvantage of 3D-printed denture base. The purpose of this study is to investigate the antifungal properties and flexural strength of 3D-printed denture base resin according to the different contents of titanium dioxide nanoparticles. Materials and methods. Titanium dioxide nanoparticles were mixed with the 3D printing resin at the ratios of 0.5, 1, 1.5, and 2 wt%. Twenty specimens per each group were printed in the form of cylindrical shape (diameter: 20 mm, height: 3 mm) to evaluate antifungal properties. Ten specimens from each group underwent polishing using autogrinder, while the remaining ten specimens did not. Candida albicans in hyphae form was inoculated onto each specimen, optical density and colony-forming unit were analyzed. The surface of the specimen was observed using scanning electron microscopy. To evaluate the flexural strength, twenty specimens per each group were 3D printed in the form of rectangular prism shape (length: 64 mm, height: 10 mm, width: 3 mm) and three-point bending tests were conducted using universal testing machine according to ISO 20795-1. Results. Colony-forming unit of C.albicans and optical density of culture medium showed no difference between non-polished groups, but decreased in the polished groups at concentration of 1, 1.5, 2 wt% titanium dioxide nanoparticles. Flexural strength increased with titanium dioxide nanoparticle at concentration of 0.5, 1, 1.5 wt%, but decreased at 2 wt% compared to 1.5 wt%. Conclusion. When 1.5 wt% of titanium dioxide nanoparticles were added to the 3D-printed denture base resin with polishing, antifungal properties were increased.

• Tunnel and Underground Space
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• v.8 no.3
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• pp.249-256
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• 1998

Pocheon, Keochang and Sangju granite samples of different granularity and mineralogical composition were thermally treated at pre-determined temperature of $600^{\circ}C$. Thermally-induced microcracks were characterized using an optical microscopy and their effects on the deformation behavior of thermally cycled samples were studied performing compressive mechanical tests. Optical observations shows that by $600^{\circ}C$ nearlly all crystal boundaries open and the new intracrystalline cracks form in the more grains. The intracrystalline cracks are most pronounced at thermally treated Pocheon and Keochang granite samples. Results from mechanical tests represents negative lateral strains, which give negative Poisson's ratios. It is the most probable that negative lateral strains are produced by residual stresses induced during cooling.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.6
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• pp.74-80
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• 2022

The surface status of a workpiece determines its functionality, product quality, and manufacturing costs. Thus, several finishing technologies have been widely investigated and applied to improve surface characteristics. In this study, rotational electro-magnetic abrasive finishing (REMAF) was suggested as a non-contact finishing process to achieve high geometric precision. To verify the effects of the REMAF process on burr removal on the surface of Al6061, experiments were conducted using the Taguchi method. Based on the experimental results analyzed by the S/N ratio and ANOVA, the optimal conditions were defined as A₃B₂C₃D₃ that corresponded to 1,800 rpm of rotational speed, 1.5 kg of abrasive particle weight, 0.7 mm of abrasive diameter, and 15 min of working time. In addition, the particle weight was a key attribute for deburring, whereas the working time was less effective.

• Tribology and Lubricants
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• v.32 no.2
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• pp.44-49
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• 2016

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.