• Journal of Conservation Science
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• v.9 no.1
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• pp.33-39
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• 2000

A well-bucket excavated from Seobu-dong, Kyungju was characterized and conserved. The bucket was heavily degraded by a diverse set of microorganisms during its long-term storage in the burial site. The distribution of maximum saturated moisture content was in the range of 614-1050%. The identification of species using optical microscope showed that the species was Pinus densiflora. The dimensional stability of the bucket was examined using sucrose as a dimension-stabilizing agent. The concentration of sucrose was started at 10% level and raised to 30, 50, 70% for 8 weeks. The changes of weight increase were varied with concentration. When the concentration of sucrose reached to 30%, 50%, the bucket showed the significant increase of weight, especially. Epoxy adhesives was used for the joining and restoring. Dimensional change and crack were not observed afterward.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.172-175
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• 2001

The co-cured Joining method, which is regarded as an adhesively bonded Joining method, is an efficient joining technique because both curing and bonding processes for the composite structures can be achieved simultaneously. It requires neither surface treatment onto the composite adherend nor an additional adhesive joining process because the excess resin, which is extracted from composite materials during consolidation, accomplishes the co-cured Joining process. Since the adhesive of the co-cured joint is the same material as the resin of the composite adherend, the analysis and design of the co-cured joint for composite structures are simpler than those of an adhesively bonded joint, which uses an additional adhesive. In this paper, effects of the manufacturing parameters, namely surface roughness, stacking sequence of the composite adherend, and manufacturing pressure in the autoclave during curing process, on the tensile load bearing capacity of the co-cured single lap joint will be experimentally investigated.

• Journal of the Korean Society for Nondestructive Testing
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• v.16 no.4
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• pp.241-250
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• 1997

The velocity dispersion of surface acoustical wave(SAW) of Si layer/mesh Au/Si substrate was measured by the frequency analysis technique of backward radiation at liquid/solid interface. The difference of backward radiation patterns depending on used transducers (2, 5, 10MHz) confirmed that the backward radiation phenomenon was caused by the energy radiation from SAW generated in surface region. An ultrasonic goniometer was constructed to measure continuously the angular dependence of backscattered intensity. The angular dependences of backward radiation(5MHz) were measured for Ni layer/Al substrate specimens that were bonded by epoxy involving different content of Cu powder. It was known that the width and pattern of backward radiation had informations such as the velocity dispersion, bonding quality and structure of surface region.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.117-126
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• 1994

APAL (Aramid Patched ALuminum alloy) was manufactured, which was a material that was consisting of a A12024-T3 aluminum alloy plate bonded to single-side of it with aramid/epoxy laminates. The aramid/epoxy laminates were bonded to it in condition of 1, 2 ply and fiber orientation of .+-.45, 0.deg./90.deg. Fatigue crack propagation tests were performed at stress ratio R-0.2, 0.5 with Al 2024-T3, APAL 45-1P, APAL 0/90-1P, APAL 45-2P, APAL 0/90-2P specimens to examine behavior of retardation in fatigue crack propagation. All the APAL specimens showed superior fatigue crack resistance. Number of cycle spended for crack to propagate from $a_{M}$=37 to $a_{M}$=65 mm in case of APAL 0/90-2P specimen was half that of Al 2024-T3 specimen. Fatigue crack propagation rate of APAL 0/90 specimens were retarded more compared to APAL 45 specimens and the amounts of retardation at R=0.5 were larger than that at R=0.2. It was found that the retardation in fatigue crack propagation was caused by intact fibers in the wake of crack.ack.

• Conservation Science in Museum
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• v.16
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• pp.114-121
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• 2015

Two pieces of comb-shaped jewelry which are made of animal bones were discovered in Daeseong-dong tomb No.88 in Gimhae. Foreign material was removed from the surface of the objects using ethanol and various small instruments. Fractures or cracks were repaired using cellulose-type synthetic resin and epoxy resin. Acrylic paint was applied repaired areas to match the color and finished conservation treatment. The two comb-shaped accessories, although differing in number of teeth and thickness, were produced by using the same method. A series of fine bone pieces, shaped like comb teeth, are placed between two long bones, assuming animal ulnas, and are fastened together by tying silk thread around them several times, then by placing a coat of lacquer.

• Journal of Conservation Science
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• v.7 no.2
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• pp.45-53
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• 1998

The Kong-Chung Jung's relics made of wooden materials were pre-examined for conservation. Kong-Chung Jung was a General of the Chosun Dynasty and his weapons were made of wood. The pre-examining method was focused on the quality and species of the wooden weapons. X-ray radiation was used for the observation of wood structure, and the condition of the relics was relatively good although they contained some cracks. The examination of species using optical microscope showed that the species of each relics were Pinus densiflora of hanging scroll pole, Lozoste lancifolia of a top of flagnole, Fraxinus sp. of a flagpole, Phyllostachys sp. of arrow shafts. For the conservation of the relics, celyl alcohol as dimensional stability chemicals was used and poly(vinyl acetate) and epoxy adhesives were also used for the joining and restoring of the relics.

• Conservation Science in Museum
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• v.16
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• pp.122-137
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• 2015

White porcelain pitcher with an openwork dragon and cloud design across its surface in the collection of the National Museum of Korea (Deoksu 5531) was acquired in 1915. The restoration has been so far completed only for the mouth of the pitcher. This study discusses a new method based on 3D scanning and printing for the restoration of missing parts in the openwork dragon and cloud design. A strength test was performed on six output materials that have been already commercialized for comparison with the strength of materials used for traditional restoration such as epoxy putty (Quick Wood^®) and epoxy (Araldite AY103+HY956^®). This process confirmed that the digital technology-aided making of a restoration model requires less time and efforts than handmade work, all the while producing a more precise model. More importantly, this method being a non-contact method, it reduces risks associated with handmade work. Another advantage of this method is that digital pre-restoration images can be saved and used for future references. Notwithstanding, future research is needed on how to effectively apply digital technology for restoration of ancient objects and how to evaluate and use 3D output as well as on the method of shaping, joining and coloring the 3D output.

• Journal of Conservation Science
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• v.29 no.2
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• pp.127-138
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• 2013

Plastic, widely used as a material for contemporary art, get damaged as directly exposed to temperature, humidity, ultra violet, etc. And it is very quickly damaged in early time, once damaged, it can't recover into original state. But like this characteristics, there is a few advanced research in Korea. So this study deal with a rising value of plastic artifacts in other country, United Kingdom and France, current conservation state, identification and cleaning method. Also 5 types of cleaners(distilled water, ethanol, acetone, eraser) and adhesives(cyanoacrylate, epoxy, acrylic, chloroprene rubber) were evaluated by produced plastics(PVC, PE, PP, PS, PU). As a result of experiment, ethanol and acetone that were previous evaluated in other research performed in other country are the best cleaner. Result of degradation after adhesive, cyanoacrylate and epoxy resin showed better performance and stability. As a basic research, this study is expected that can be used in future researches.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.4
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• pp.529-535
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• 2013

A new thin sandwich panel composed of an aluminum expanded metal core adhesively jointed with stainless steel face sheets is introduced, and its mechanical behavior under three-point bending is investigated. The strength and stiffness are analyzed theoretically, and the press-formability and strength enhancement are evaluated experimentally. The specimens with the specific configurations exhibit face yielding well before face-core separation, which means that the sandwich panel can be formed by a press without failure. The measured load levels corresponding to the face yielding and the face-core separation agree fairly well with the theoretical estimations. For a given weight, the sandwich panel is superior to a solid panel in terms of strength, stiffness, and press-formability.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.