• Title/Summary/Keyword: 에폭시화

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Surface modification of plastic substrates mediated by silane coupling agents and its application for plastic assembly (use poster) (실란 화합물 기반 플라스틱 기판의 표면 개질화 및 저온 저압 접합 공정)

  • Lee, Nae-Yun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.107-108
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    • 2013
  • 플라스틱 기판 표면을 플라즈마 처리시 형성되는 수산화기에 실란화합물을 반응시키면 상온에서도 플라스틱 표면에 다양한 유기기를 도입할 수 있다. 아민기와 에폭시기가 상온에서도 강력한 화학결합을 이루는 원리를 이용하여, 유기기로써 아미노기와 에폭시기를 갖는 두 실란화합물을 선정, 두 고분자 기판에 각각 도입 후 접합시킨 결과, 저온 및 대기압 조건에서도 강력한 본딩을 이루는 것을 확인할 수 있었다.

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The characteristics of thermal expansion and electrity on the epoxy hardening of $Sb_{2}O_{3}$ filler to use for electric lastallation (전기설비용 $Sb_{2}O_{3}$충전 에폭시 경화제의 열팽창 및 전기적 특성)

  • 이보호;박동화;송경화;황명환
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.5 no.2
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    • pp.58-66
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    • 1991
  • This paper measured the characteristic of the thermal expansion, dielectric and conductivity to use $Sb_2O_3$ Filler in epoxy resin.The results are summarized as follow : 1 ) In the [$155^{\circ}C$] 1, The coefficient of thermal expansion increasing temperature obtained 8.19 in the case of pure epoxy resin and $4.5{\times}10^{-5}$ in the case of the mixing 7[%].2) The peak point of $\varepsilon\iota, \varepsilon\rho$ increasing $Sb_2O_3$ mixing ratio moved on the part of the high temperature. 3) The conductivity value increasing temperature shows the corner on the part of the Tg and it's Value became low the sample material with mixing I[%] than in case of pure epoxy resin.

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An Experimental Study on Corrosion Resistance of Epoxy Coated Reinforcements (에폭시 도포철근의 내 부식성능에 관한 실험적 연구)

  • 오병환;엄주용;권지훈
    • Magazine of the Korea Concrete Institute
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    • v.4 no.4
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    • pp.161-170
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    • 1992
  • 근래 들어 철근 콘크리트에 있어서의 철근부식이 관심의 대상이 되고 있는데 그이유는 이 현상이 실제 구조물에서 광범위하게 발생함이 확인되었고 이로 인한 보수비용이 급증하였기 때문이다. 철근의 부식이 처음 거론된 것은 해양구조물과 내화학성 구조물에서였고 최근 들어서는 교량상판, 주차공간등 염기에 노출되어 철근 부식이 우려되는 각 종의 구조물에 광범위하게 그 대책이 연구되기에 이르렀다. 이와같은 철근부식이 제어방법으로는 첫째로 콘크리트의 수밀화를 들 수 있고 다음으로 콘크리트의 표면을 처리하거나 피복두께를 늘이는 방법이 있다. 마지막으로 철근자체에 방청성능을 직접 부여하여 방법에 속하는 에폭시 도포 철근의 기본적인 방청성능을 고찰하기 위해 수행되었다. 연구결과 에폭시 도포철근의 방청성능은 매우 우수함을 발견하였고 앞으로 활용이 기대되고 있다.

Long-term Strength Improvement of Epoxy-Modified Mortars with Steam Curing (증기양생에 의한 에폭시수지 혼입 PMM의 장기강도 발현)

  • Lee, Jae-Hwa;Kim, Wan-Ki
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2012.05a
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    • pp.263-264
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    • 2012
  • The purpose of present study is to examine the long-term strength improvement of hardener-free epoxy-modified mortars with steam curing. As a result, strength improvement of hardener-free epoxy-modified mortars is markedly improved with increasing of air-dry curing period. This is improved by markedly increase the degree of hardening of the hardener-free epoxy resin in the epoxy-modified mortars with additional air-dry curing period.

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A study on reinforcement method of concrete structures using composite fiber panels (복합섬유 패널을 이용한 콘크리트 구조물의 보강공법에 관한 연구)

  • Kim, Woon-Hak;Hwang, Sung-Woon;Kang, Seok-Won;Kim, Jeong-Su
    • Proceedings of the Korean Society of Disaster Information Conference
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    • 2016.11a
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    • pp.198-199
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    • 2016
  • 기존 콘크리트 구조물의 내력 및 처짐에 저항하기 위하여 섬유시트를 사용한 복합섬유 패널 보강재를 셋 앵커를 이용하여 콘크리트 구조물과 일체화시키는 공법을 개발하였다.. 본 연구에서 적용된 실험 결과에 의하면 엥커+에폭시 보강 I 시험체가 기준시험체에 비하여 최대하중이 3.13배 증가, 동일 앵커갯수인 앵커보강시험체에 비하여 1.14배 증가하여으며, 에폭시보강시험체는 기준시험체에 비하여 최대하중이 3.08배 증가하였으나 계면에서 섬유박리로 인한 취성 파괴가 발생하였다.

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A Study on the Development of Electronic Lighter Epoxy Injuction Machine (전자 라이터용 에폭시 정량공급장치의 개발에 관한 연구)

  • Park, Jung-Su;Jung, Won;Chang, Seok-Jin
    • Journal of Korea Society of Industrial Information Systems
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    • v.5 no.3
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    • pp.51-55
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    • 2000
  • It is automation of manufacturing process that improve productivity, quality level and delivery times in manufacturing environment. Epoxy injection process is very critical process of manufacturing electronic lighter and then controling the quantity of epoxy fluid is another critical factor of them. As development of epoxy injection machine, the product goal is accomplished and maximize the profit of company. The object of this study is implement the mathematical equation to practical examination with this machine.

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Effect of High Filler Loading on the Reliability of Epoxy Holding Compound for Microelectronic Packaging (반도체 패키지 봉지재용 에폭시 수지 조성물의 신뢰특성에 미치는 실리카 고충전 영향)

  • 정호용;문경식;최경세
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.3
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    • pp.51-63
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    • 1999
  • The effects of high filler loading technique on the reliability of epoxy molding compound (EMC) as a microelectronic encapsulant was investigated. The method of high filler loading was established by the improvement of maximum packing fraction using the simplified packing model proposed by Ouchiyama, et al. With the maximum packing fraction of filler, the viscosity of EMC wart lowered and the flowability was improved. As the amount of filler in EMC increased, several properties such as internal stress and moisture absorption were improved. However, the adhesive strength with the alloy 42 leadframe decreased when the filler content was beyond the critical value. It was found that the appropriate content of filler was important to improve the reilability of EMC, and the optimum filler combination should be selected to obtain high reliable EMC filled with high volume fraction of filler.

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Effects of Reactive Diluents on the Curing Behavior of Epoxy Resin (에폭시 수지의 경화 거동에 미치는 반응성 희석제의 영향)

  • Kim, Wan-Young;Lee, Dai-Soo;Kim, Hyung-Soon;Kim, Jung-Gee
    • Applied Chemistry for Engineering
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    • v.5 no.6
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    • pp.1030-1035
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    • 1994
  • Curing behavior and glass transition temperatures of epoxy resins into which reactive diluents were added to control processability were investigated. Heat of cure generated of the epoxy resin was reduced with butyl glycidyl ether(BGE) and phenyl glycidyl ether(PGE) contents. $T_g$ of the resin was decreased with the amount of reactive diluents and it was attributed to increased molecular weight between crosslink points. Cure kinetics of the resins was studied employing autocatalytic reaction model and found that reaction constants decreased as the contents of reactive diluent was increased.

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