Reaction Characteristics between In-l5Pb-5Ag Solder and Au/Ni Surface Finish and Reliability Evaluation of Solder Joint (In-l5Pb-5Ag 솔더와 Au/Ni Surface Finish와의 반응 특성 및 접합 신뢰성 평가)
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- Journal of the Microelectronics and Packaging Society
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- v.9 no.4
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- pp.1-9
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- 2002