• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.2
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• pp.76-82
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• 2019

This study has done to search for a solution to remove risk limitedly caused by separating weapon system acquisition from operation and maintenance at the view point of Logistic Commander who's responsible for stable operation and maintenance after acquiring weapon system. At the System development stage, unverified overhaul development plan may cause additional manpower and costs after the development, and furthermore it is likely to have risk to lower reliability of the military. Thus, research and development agency should write overhaul development plan at the System development stage, and it should be verified through evaluation and verification test. Secondly, during research and development, institutional supplementation is needed to calculate human and material resources writing overhaul development plan. Thirdly, it should be able to analyze proper operation & maintenance plan and cost for overhaul plan at the pre-investigation stage. Fourthly, the base which can develop overhaul concept and overhaul factors should be included in the need and need determination document. Lastly, for the weapon system which has small amount of high power figure, project management should be performed to be able to specify at the each acquisition level of weapon system to realize Article 28, clause 3 and 4 of Defense business law.

• Journal of Korea Entertainment Industry Association
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• v.15 no.8
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• pp.107-116
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• 2021

In recent years, the research on audience satisfaction after watching programs has been carried out in various fields. However, there is no precedent for the study of simply analyzing the influencing factors of audience satisfaction with the newly established CCTV-9 channel. For CCTV-9, how to explore the strategy of industrial development based on the needs of the audience in the era of big data is a very important part. This article exploratively focuses on the influencing factors related to CCTV-9 audience satisfaction. Using questionnaires, 101 samples of the satisfaction with the channel of men and women of different ages, education backgrounds, majors, and incomes were collected to test, and 9 hypotheses were tentatively proposed as relevant influencing factors of channel satisfaction. Through empirical analysis, this research searches for the determinants. The reliability and validity of the measurement were properly analyzed, and all hypotheses were statistically tested. The empirical results show that: subject matter, program format, program scheduling, program broadcast time, channel advertising, simulcast series of documentaries, diversified communication platforms, brand image packaging and audience satisfaction are significantly positively correlated.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.