• The Academic Congress of Korean Shoulder and Elbow Society
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• 2009.03a
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• pp.203-203
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• 2009

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.89-92
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• 2007

The metallic bipolar plate in PEMFC is widely used for automotive driving because of its advantages, i) high strength, ii) high chemical stability, iii) low gas permeability and iv) applicability to mass production. Especially, the metallic bipolar plate which is manufactured with the sheet metal stamping process can be applied in automotive PEMFC with less volume and weight because of its thin thickness but the formability and springback problems arise in real manufacturing process. The assessment for formability and springback of metallic bipolar plate should be performed before making stamping die sets. In this work, the methodology for determining the allowable draft angle of flow passage is introduced by using finite element analysis. In analysis results, as the draft angle of flow passage increase, the major strain and thinning is increase with exponential function. The allowable draft angle without fracture is presented by fitting the results. Additionally, the staking results with manufactured metallic bipolar plates by stamping process is presented.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.220-223
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• 2009

Metallic bipolar plate for molten carbonate fuel cell(MCFC) is composed of the shielded slot plate and the center plate. Among these, the center plate plays an important role in gas sealing. Therefore, manufacturing of the center plate is considered one of the key issues in MCFC. The center plate is manufactured by bending process. In bending process, springback and recoiling are two main problems. By using the modified punch shape with 'step', springback and recoil are reduced. The aim of this article is to find the effect of modified punch shape. So, the bending stress along thickness direction and material direction were investigated using FEM.

• Archives of design research
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• v.17 no.4
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• pp.241-250
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• 2004

In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.