• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.205.1-205.1
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• 2016

핵융합로에서 고온, 고에너지 플라즈마에 장기간 노출되는 플라즈마 대면재는 고속 입자와 중성자에 의한 열화 및 침식과 높은 열부하를 견뎌야 하므로 높은 수준의 재료기술과 표면 코팅기술의 개발이 필요하다. 텅스텐은 용융점이 높고, 스퍼터링(Sputtering) 현상이 적으며, Tritium 재침적 현상이 제한되는 우수한 특성 때문에 핵융합로 대면제에 적용하기 위한 다양한 연구가 진행되고 있다. 본 연구에서는 VPS(vacuum plasma spray) 장비를 이용하여 5, 10, $25{\mu}m$ 크기의 텅스텐 분말을FM(ferritic-martenitic) steel 기판에 용사 코팅하였다. 입자 크기를 달리하여 제작한 3종의 시편은 시편 전후 두께 및 무게 변화, 현미경이미지, 비커스 경도, 3D 표면 형상, XRD를 이용하여 코팅층의 특성을 평가하였으며, $10{\mu}m$ 크기의 텅스텐 분말 시편이 가장 우수한 특성을 나타내는 것을 확인하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.211-211
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• 2009

높은 이온화율과 복잡한 형상의 모재에도 표면 도포성 및 균일성을 나타내는 아크이온플래이팅 기술과 비전도성 세라믹 타겟물질에 적용가능한 스퍼터링 기술이 결합된 하이브리드 코팅 시스템(Hybrid coating system)을 이용하였다. 그리고 Cr-Al-N과 Cr-Si-N 코팅막의 강화 기구를 복합시킨 새로운 개념의 Cr-Al-Si-N 코팅막을 초경(WC-Co)시험편에 증착하여 Si 첨가량에 따른 미세구조의 미세경도 특성을 파악하였다. 공구성능 평가는 고속가공조건하에 마이크로 밀링기에서 무코팅(초경공구), Cr-Al-Si-N (Si : 0, 4.5, 8.7, 16 at.%) 코팅 마이크로엔드밀에 대하여 공구마멸에 대한 공구수명을 비교, 평가하였다.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.17-21
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• 2004

Aluminum nitride(AlN) thin films were deposited on silicon substrate by reactive RF magnetron sputtering without substrate heating. We investigated the dependence of some properties for AlN thin film on sputtering conditions such as working pressure, $N_2$ concentration and RF power. XRD, Ellipsometer and AES has been measured to find out structural properties and preferred orientation of AlN thin films. Deposition rate of AlN thin film was increased with an increase of RF power and decreased with an increase of $N_2$ concentration. AES in-depth measurements showed that stoichiometry of Aluminium and Nitrogen elements were not affected by $N_2$ concentration. It has shown that low working pressure, low $N_2$ concentration and high RF power should be maintained to deposit AlN thin film with a high degree of (0002) preferred orientation.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.105-108
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• 2003

본 논문은 파이렉스 #7740 유리박막을 이용한 MEMS용 MLCA와 Si기판의 양극접합 특성에 관한 것이다. 최적의 RF 마그네트론 스퍼터링 조건(Ar 100 %, input power $1W/\textrm{cm}^2$)하에서 MLCA 기판위에 파이렉스 #7740 유리의 특성을 갖는 박막을 증착한 후 600 V, $400^{\circ}C$에서 1시간동안 양극접합했다. 그 다음에 Si 다이어프램을 제조한 후, MLCA/Si 접합계면과 MLCA 구동을 통한 Si 다이어프램 변위특성을 분석 및 평가하였다. 다이어프램 형상에 따라 정밀한 변위 제어가 가능했으며 0.05-0.08 %FS의 우수한 선형성을 나타내었다. 또한, 측정동안 접합계면 균열이나 계면분리가 일어나지 않았다. 따라서, MLCA/Si기판 양극접합기술은 고성능 압전 MEMS 소자 제작공정에 유용하게 사용가능할 것이다.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.83-89
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• 2011

In this study, we investigated the effects of shutter control by Reactive Magnetron Sputtering using Inductively-Coupled Plasma(ICP) for obtaining ZnO thin films with high purity. The surface morphologies and structure of deposited ZnO thin films were characterized using Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM) and X-ray Diffractometer (XRD). Also, optical and chemical properties of ZnO thin films were analyzed by Spectroscopic Ellipsometer (SE) and X-ray Photoelectron spectroscopy (XPS). As a result, it observed that ZnO thin films grown at reactive sputtering using shutter control and ICP were higher density, lower surface roughness, better crystallinity than other conventional sputtering deposition methods. For obtaining better quality deposition ZnO thin films, we will investigate the effects of substrate temperature and RF power on shutter control by a reactive magnetron sputtering using inductively-coupled plasma.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.200-200
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• 2009

아크이온플래이팅 기술과 DC 마그네트론 스퍼터링 기술이 결합된 하이브리드 코팅 시스템을 이용하여 STS 304와 Si 기판에 4성분계 CrAlCxN1-x 코팅을 증착하였다. 합성된 CrAlCxN1-x 코팅은 주로 유도결합형로 f구성되었다. CrAlCxN1-x 코팅의 carbon 함량이 0.17 at.%일 때 약 34 GPa을 나타내었으며 마찰계수는 carbon 함량이 0에서 1 at.%로 증가함에 따라 0.82에서 0.38까지 크게 감소하였다. 이는 코팅 표면과 steel 볼 사이에 amorphous carbon layer가 형성되어 고체윤활제로 작용한 것으로 사료된다.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.111-116
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• 2010

In a large area magnetron sputtering system, which is under the influence of high heat load from the plasma, it is necessary to use the effective water cooling in order to maintain the proper deposition performance and the economic use of target materials. A series of three-dimensional numerical simulations are carried out on the simplified model of the large area magnetron sputtering system with the cooling plate that includes the U-shaped water channel. The analysis is focused on the effects of water channel geometry, cooling water flowrate, thermal conductivity of target material, and the degree of target erosion on the cooling performance of cooling plate, which is represented by the temperature distribution of target material.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.89-93
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• 2017

For various process pressures, aluminum doped zinc oxide(AZO) films were deposited by in-line pulsed-DC sputtering. The deposited AZO films were optically and electrically investigated and analyzed for the window layers of CIGS solar cell systems. As the pressure was increased from 9 mtorr to 15 mtorr, the thickness of AZO was decreased as a result of scattering and its sheet resistance was rapidly increased. The transmittance of AZO was slightly decreased as the pressure was increased and the calculation of figure of merit(F.O.M) was dependent on the sheet resistance. The structural characteristics of AZO thin films analyzed by X-ray diffraction(XRD) showed no significant dependency according to the pressure.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.16-19
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• 2017

For the economical and environmental-friendly fabrication of polisher, Mo mask layer were sputtered on glass substrate instead of Cr mask material. Mo mask layers were sputtered by pulsed-DC sputtering and Photoresist patterns were formed on Mo mask layer for different develop times and optimized. After Mo mask layer were patterned and exposed glass was wet etched by HF solution for different etching times, the remaining Mo mask was stripped by using Al etchant. Develop time of 30 sec and HF wet etching time of 3 min were selected as optimized process condition and applied to the fabrication of polisher.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.53-57
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• 2019

In this study, we prepared sputtering cathode for large sputtering thin film in the facing targets sputtering(FTS) system. Before fabrication of cathode equipment, we investigated optimal magnetic flux in the sputtering cathode by using magnetic field stimulation(Comsol). According to the result of magnetic field stimulation, we manufactured the cathode. After we mounted laboratory-designed cathode on FTS system, the discharge properties were observed in vacuum condition. In addition, ITO films were deposited on glass substrate and their electrical and optical properties were investigated by various measurements (four-point probe, UV-VIS spectrometer, field emission scanning electron microscopy(FE-SEM), Hall-effect measurement).