• Title/Summary/Keyword: 스틱/슬립

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Observation and Characterization of Squeak Noises of Polymeric Materials for Automotive Interior Parts Under Field-Degradation (자동차 내장재용 고분자 재료의 필드 열화에 따른 마찰소음 특성변화)

  • Lee, Changhun;Kang, Byunghyun;Choi, Byoung-Ho;Lee, Jongho;Lee, Kwanghee
    • Transactions of the Korean Society of Automotive Engineers
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    • v.25 no.2
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    • pp.257-265
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    • 2017
  • In this work, the effect of field-degradation of automotive polymeric interior parts on the squeak characteristics was studied for a number of used vehicles with various mileages and years of service. The purpose of this study was to characterize the squeak noise related with long-term degradation in service life. The characteristics of field-degraded polymeric samples are analyzed using Fourier transform infrared(FT-IR) spectroscopy and scanning electron microscopy(SEM). Complicated carbonyl spectra from FT-IR were deconvoluted into various carbonyls to trace field-degradation phenomenon. In addition, various mechanical tests, i.e. tensile test, hardness test as well as coefficient of friction test, were performed to analyze the variation in mechanical properties due to field-degradation. Squeak noise was measured and analyzed by frequency analysis. It was shown that the changes in the chemical structures of polymer due to field-degradation influenced the variation in mechanical properties, and squeak noise may worsen by increasing the squeak noise level in the wide frequency range. The results indicated that customer complaints regarding the squeak noise coming from used vehicles might be one of the important reliability issues because the increase in sound pressure level especially in the high frequency range could annoy drivers and passengers.

Development of Virtual Science Experience Space(VSES) using Haptic Device (역감 제시 장치를 이용한 가상 과학 체험 공간 개발)

  • 김호정;류제하
    • Journal of KIISE:Software and Applications
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    • v.30 no.11
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    • pp.1044-1053
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    • 2003
  • A virtual science experience space(VSES) using virtual reality technology including haptic device is proposed to overcome limits which the existing science education has and to improve the effect of it. Four example scientific worlds such as Micro World, Friction World, Electromechanical World and Macro World are demonstrated by the developed VSES. Van der Waals forces in Micro World and Stick-Slip friction in Friction World, the principle of induction motor and power generator in Electromechanical World and Coriolis acceleration that is brought about by relative motion on the rotating coordinate are modeled mathematically based on physical principles. Emulation methods for haptic interface are suggested. The proposed VSES consists of haptic device, HMD or Crystal Eyes and a digital computer with stereoscopic graphics and GUI. The proposed system is believed to increase the realism and immersion for user.

Stick-slip in Chemical Mechanical Polishing Using Multi-Particle Simulation Models (다수의 연마입자를 고려한 CMP 공정의 Stick-Slip 고찰)

  • Jung, Soyoung;Sung, In-Ha
    • Tribology and Lubricants
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    • v.34 no.6
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    • pp.279-283
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    • 2018
  • In this study, we investigate the behavior of abrasive particles and change of the stick-slip pattern according to chemical mechanical polishing (CMP) process parameters when a large number of abrasive particles are fixed on a pad. The CMP process is simulated using the finite element method. In the simulation, the abrasive grains are composed of those used in the actual CMP process. Considering the cohesion of the abrasive grains with the start of the CMP process, abrasive particles with various sizes are fixed onto the pad at different intervals so that stick-slip could occur. In this analysis, we determine that when the abrasive particle size is relatively large, the stick-slip period does not change as the pressure increases while the moving speed is constant. However, if the size of the abrasive grains is relatively small, the amount of deformation of the grains increases due to the elasticity of the pad. Therefore, the stick-slip pattern may not be observed. As the number of abrasive particles increases, the stick-slip period and displacement decrease. This is consistent with the decrease in the von Mises yield stress value on the surface of the wafer as the number of abrasive grains increases. We determine that when the number of the abrasive grains increases, the polishing rate, and characteristics are improved, and scratches are reduced. Moreover, we establish that the period of stick-slip increases and the change of the stick-slip size was not large when the abrasive particle size was relatively small.