• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.480-480
• /
• 2013

태양에너지는 신재생 에너지 중에서 무한한 에너지원으로서 태양에너지에 대한 활발한 연구가 이루어지고 있다. 그 중에서도 결정형 실리콘 태양전지에 대해 다양한 연구가 진행 중이다. 이러한 실리콘 태양전의 제작은 실리콘 식각 용액을 이용하여 기판의 절삭 손상된 부분을 식각한 후 텍스쳐링(texturing) 공정을 통해 표면의 흡수율을 높이고, 반면에 반사율을 감소시킨다. 텍스쳐링 공정이 끝난 후 도핑 공정을 통해 에미터(emitter)를 형성, 반사방지막을 증착, 기판의 전면과 후면에 페이스트를 바르고 스크린인쇄법으로 전극을 형성한 후 마지막으로 형성된 전극을 소성 공정을 통해 전극이 에미터와 접촉하면 태양전지가 완성된다. 하지만 텍스쳐링 공정을 통해 만들어진 피라미드 구조는 도핑공정을 하게 되면, 꼭짓점 부분의 균일한 도핑이 이루어지지 않는다. 이러한 균일하지 않은 공정으로 인해 전극 소성 공정에서 일부의 에미터층을 뚫어버리게 되므로 누설전류가 증가하게 된다. 그래서 본 논문에서는, 변환 효율을 개선시키기 위해 표면 구조와 반사방지막의 열처리 공정에 대한 연구를 하였다. 우선 피라미드 구조를 균일하게 만들었으며, 반사방지막 형성 후 열처리를 하여 소수 캐리어 수명을 증가시켰으며, 누설전류를 감소하였다. 균일한 도핑 및 전극 형성을 용이하게 하는 부드러운 피라미드 구조를 형성하기 위해 HND (HF：HNO3 : D.I wafer=5 : 100 : 100) 용액을 사용하여 식각하였다. 그 결과 직렬저항은 NHD용액을 사용하여 300초 동안 식각하였을 때 $1.284{\Omega}$ 낮아지는 결과를 얻을 수 있었으며, 도핑을 균일화하여 누설전류를 감소시킬 수 있었다.

• Journal of Welding and Joining
• /
• 제13권3호
• /
• pp.55-64
• /
• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2008년도 제39회 하계학술대회
• /
• pp.1005-1006
• /
• 2008

기존의 전자식 안정기 특히 펄스로 시동되는 HID램프용의 안정기에서는 부가적인 시동회로가 필요하게 된다. 하지만 램프 제조업자에 의해 규정된 점화 펄스폭은 제조업자 간에서도 다양하며, 대단히 높게 되어 있으며 그 펄스폭에는 최소 필요한 값이 있고 이것은 통상 $1.5{\sim}2.5us$정도이다. 이와 같은 시동 펄스폭의 조건을 만족하기 위해서는 시동회로 또한 복잡해지고 제작비용도 고가가 된다. 본 연구는 전력소모가 20[%]이상 절감되면서도 광량이 더 많이 방사되는 메탈핼라이드 램프를 UV경화 시스템 즉, LCD, PDP OLED 모듈조립, 평면, 곡면 스크린 인쇄용, 코팅용, 실험용 UV경화 및 UV노광 시스템 등에 사용 가능한 전자식 안정기를 고주파 시동의 이점을 유지해 가면서 지연 시간에 기인하는 램프의 꺼짐 및 대순환 전류의 문제를 해소하고 고압 대용량 램프를 구동할 수 있는 20KW급 전자식 안정기를 제안하여 22KW UV LAMP를 사용하여 전자식 안정기를 구동 실험으로 검증하였다.

• 한국응용과학기술학회지
• /
• 제14권2호
• /
• pp.115-122
• /
• 1997

The field of printing use to pressurization ink using screen gassamer that is called screen printing. Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. Besides, cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic and vibration cleaning process be substituted for existing mixed cleaning method of dipping and polish.

• 한국전기전자재료학회논문지
• /
• 제13권4호
• /
• pp.294-299
• /
• 2000

For practical application as a humidity sensor SnO$_2$thick films devices were fabricated on the refresh type electrode by screen printing method and their material and humidity sensing properties were investigated. As a function of Sb$_{2}$/O$_{3}$ addition rate grain size was increased while porosity and initial resistance were rapidly decreased. And the area of resistance variation according to relative humidity was decreased with increasing heat treatment temperature. SnO$_2$thick film device heat treated at 95$0^{\circ}C$ and contained 0.05mole% Sb$_{2}$/O$_{3}$ had a best humidity sensing properties. From this result it is conformed that humidity sensing properties of SnO$_2$thick film devices could be approved by very small amount of Sb$_{2}$/O$_{3}$ addition.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
• /
• pp.55-58
• /
• 2001

In this paper, we present the results of the design and fabrication of the VCO(Voltage controlled Oscillator) using RF circuit simulator GENESYS and electromagnetic field simulator EMpower Frequency range is fabricated VCO is 850 MHz ~ 950 MHz, which is used Colpitts Circuit. the fabricated VCO is consisted of resonator, oscillator and MSL(Microstrip Line) is used in LC tuning circuit.(operated by negative feedback) MSL(Microstrip Line), Varactor(Plastic package), low noise TR(SOT-23), chip inductor(1608), chip capacitor(1005), chip resistance(1005). 1005 type is used for sample fabrication of VCO. In the fabrication process, circuit pattern is screen printed on the alumina substrates of over 99.9% purity. Center frequency of the sample VCO is 850MHz at $V_T=1.5V$, while the simulated value was 1.0GHz at $V_T=1.5V$. Variable frequency range of the sample is 860~950MHz in contrast to the 1068~1100MHz of the simulated values.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
• /
• pp.153-156
• /
• 2001

In this paper, we present the results of the design and fabrication of the VCO(Voltage controlled Oscillator) using RF circuit simulator GENESYS and electromagnetic field simulator EMpower Frequency range is fabricated VCO is 850 MHz ~ 950 MHz, which is used Colpitts Circuit. the fabricated VCO is consisted of resonator, oscillator and MSL(Microstrip Line) is used in LC tuning circuit.(operated by negative feedback) MSL(Microstrip Line), Varactor(Plastic package), low noise TR(SOT-23), chip inductor(1608), chip capacitor(1005), chip resistance(1005). 1005 type is used for sample fabrication of VCO. In the fabrication process, circuit pattern is screen printed on the alumina substrates of over 99.9% purity. Center frequency of the sample VCO is 850MHz at $V_T$=1.5V, while the simulated value was 1.0GHz at $V_T$=1.5V. Variable frequency range of the sample is 860~950MHz in contrast to the 1068~1100MHz of the simulated values.

• 반도체디스플레이기술학회지
• /
• 제11권4호
• /
• pp.43-48
• /
• 2012

The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc. for forming the high precision micro-pattern. Also A number of studies of screen printing method has been conducted as the method for the cost down through the improvement of productivity. Because of being the dot printing method of the cylindrical shape not being the line printing method like the existing PDP barrier rib and phosphor, the pillar arrays using the screen printing method is deposited in the hemispherical type not being cylindrical shape in the existing printing process conditions. In this paper, the parameters were set on the screen printing device in order to deposit the cross-sectional shape with the cone or trapezoid shape of the pillar in depositing the pillars used the screen printing device for vacuum glazing. The cross-sectional shape slope of the pillar according to the parameters was measured. And analysis the effect of the screen printing process conditions on the cross-sectional shape slope of pillars based upon the result of being measured. The processing conditions were drawn to minimize the cross-sectional shape slope of pillar.

• 한국정밀공학회지
• /
• 제31권6호
• /
• pp.505-511
• /
• 2014

In this paper, silver pastes were printed on polyethylene terephthalate (PET) film using screen printing and evaluated the drying characteristics by using dry oven and NIR drying system. The printed Ag films were dried at $140^{\circ}C$ and the drying time was changed from 10 to 90 seconds. To evaluate the electrical properties of printed Ag film, sheet resistance was compared. The sheet resistance of the dried thin silver film by using NIR drying system more rapidly decreased. To clarify this phenomena, the morphology and component of the dried surfaces were measured by using the scanning electron microscope (SEM) and the energy dispersive X-ray Spectroscopy (EDX), respectively. In the EDX measurement results, the oxidation of the surface was observed in the dried thin film by using the dry oven. The NIR drying system is more applicable than conventional hot air drying to apply continuous printing system.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.309-309
• /
• 2008

전자 산업의 발달로 인해 전자기기에 소형화, 경량화 및 다기능화가 요구되면서 고밀도화, 고집적화가 필요하게 되었다. 이와 같은 부품의 고집적화 기술로 최근 제시되고 있는 방법 중 하나는 ceramic powder로 구성된 유전층에 polymer를 infiltration시키고 cure 과정을 거쳐 소결공정 없이 유전층을 완성하는 것이다. 그리고 이 유전층을 layer 단위로 build up하는 방법을 이용하여 반복적으로 형성하는 기술이 연구되고 있다. 그러나 고충전된 polymer/ceramic composite에서 유전 특성은 기존에 알려진 저충전 구조에서의 mixing 이론을 따를 것인지에 대한 실증적인 연구는 이루어지지 않았다. 본 연구에서는 ceramic powder $Al_2O_3$를 이용하여 polymer의 함량을 최소화하여 paste 를 제조하고, 스크린 프린팅 방법으로 인쇄하여 ceramic layer를 제작하였다. 그리고 이 위에 polymer infiltration 과정을 동하여 고충전 ceramic/polymer composite layer를 제작하였다. 또한, $Al_2O_3$를 filter로 사용한 저충전 polymer/ceramic composite에서의 mixing rule과 비교하여 복합체의 유전 특성을 설명하였다.