• Title/Summary/Keyword: 스윙암

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Study on the design and the control of an underwater construction robot for port construction (항만공사용 수중건설로봇의 기구설계 및 제어에 관한 연구)

  • Kim, Tae-Sung;Kim, Chi-Hyo;Lee, Min-Ki
    • Journal of Navigation and Port Research
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    • v.39 no.3
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    • pp.253-260
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    • 2015
  • There are many efforts to mechanize the process for underwater port construction due to the severe and adverse working environment. This paper presents an underwater construction robot to level rubbles on the seabed for port construction. The robot is composed of a blade and a multi-functional arm to flatten the rubble mound with respect to the reference level at uneven terrain and to dig and dump the rubbles. This research analyzes the kinematics of the blade and the multi-functional arm including track and swing motions with respect to a world coordinate assigned to a reference depth sensor. This analysis is conducted interfacing with the position and orientation sensors installed at the robot. A hydraulic control system is developed to control a track, a blade and a multi-functional arm for rubble leveling work. The experimental results of rubble leveling work conducted by the robot are presented in land and subsea. The working speed of the robot is eight times faster than that of a human diver, and the working quality is acceptable. The robot is expected to have much higher efficiency in deep water where a human diver is unable to work.

A Study on Pad Profile Variation Using Kinematical Analysis on Swing Ann Conditioner (스윙 암 컨디셔너의 기구학적 해석을 통한 CMP 패드 프로파일 변화에 관한 연구)

  • Oh, Ji-Heon;Kim, Yong-Min;Lee, Ho-Jun;Lee, Sang-Jik;Kim, Hyoung-Jae;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.47-48
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    • 2007
  • A CMP Process has many factors that affect result of a polished wafer. Dominant factors are velocity, pressure and temperature in process. A pad profile is also considered as affecting factor of CMP. Accoding to variation of a pad profile, the each pan of a wafer is differently pressured. It appears to affect the uniformity of a wafer. A pad profile varies as a swing arm conditioner which have been ordinarily used in industry. A swing arm conditioner has several sectors in its swing path. This study aims that a wafer get a good uniformity as swing arm conditioner's path on pad is analyzed and simulated. Through the simulation, tendency of pad profile after conditioning will be predicted and the result of simulation compared with the result of experiment. The optimized pad profile would be made by to vary swing arm's velocity on each sector. In order to maintain the optimized profile, conditioner design or swing arm's velocity should be changed and designed.

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