• Title/Summary/Keyword: 소형 시편

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Investigation of the Filling Unbalance and Dimensional Variations in Multi-Cavity Injection Molded Parts (다수 캐비티의 사출성형품에서 충전의 불균형과 성형품 치수 편차의 교찰)

  • Kang, Min-A;Lyu, Min-Young
    • Polymer(Korea)
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    • v.32 no.6
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    • pp.501-508
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    • 2008
  • Small injection molded articles such as lens and mobile product parts are usually molded in multi-cavity mold. The problem occurring in multi-cavity molding is flow unbalance among the cavities. The flow unbalance affects the dimensions and physical properties of molded articles. First of all, the origin of flow unbalance is geometrical unbalance of the delivery system. However, even the geometry of the delivery system is well balanced, cavity unbalance occurs. This comes from the temperature distributions in the cross-section of runner. Temperature distribution depends upon injection speed because heat generation near runner wall is high at high injection speed. Among the operational conditions, injection speed is the most significant process variable affecting the filling unbalances in multi-cavity injection molding. In this study, experimental study of flow unbalance has been conducted for various injection speeds and materials. Also, the filling unbalances were compared with CAE results. The dimensions and weights of multi-cavity molded parts were examined. The results showed that the filling unbalances vary according to the injection speeds and resins. Subsequently, the unbalanced filling and pressure distribution in the multi-cavity affect the dimensions and physical states of molded parts.

Observation of Shrinkage Features of Cross Sectional Surface of Wood by LV-SEM (저진공주사현미경(LV-SEM)을 이용한 목재횡단면의 수축거동관찰)

  • Kang, Chunwon;Matsumura, Junji;Kang, Wook
    • Journal of the Korean Wood Science and Technology
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    • v.36 no.3
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    • pp.17-23
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    • 2008
  • The purpose of this study is to estimate the shrinkage of wood by LV-SEM (Low-Vacuum Scanning Electron Microscope) which can observe wetted wood sample. The shrinkage of small sample specimen by the dehumidification in the specimen chamber was investigated and compared with that of normal wood specimen. The observation of cross sectional surface of wood from wetted condition to dried condition can be achieved in about twenty minutes by means of the dehumidification in the specimen chamber of LV-SEM. The volumetric shrinkage of earlywood was almost the same as that of latewood. The shrinkage of SEM observation specimen was similar to that of normal wood specimen. From the correlation of the shrinkages between SEM observation specimen and normal wood specimen, it is surmised that the shrinkage of wood is more strictly dominated by shrinkage of latewood than that of earlywood.

Assessment of Material Degradation of High-Temperature Components for Process Plant by Grain Boundary Etching Method (입계부식법에 의한 공정설비 고온요소의 재질열화 평가)

  • Han Sang In;Yoon Kee Bong;Kim Ji Yoon;Chung Se Hi
    • Journal of the Korean Institute of Gas
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    • v.2 no.1
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    • pp.74-82
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    • 1998
  • The grain boundary etching method as a technique for assessing degradation of structural materials used at elevated temperature has received much attention since it is simple, inexpensive and easy to apply to real plant components. In this study, the technique is applied to some aged petroleum and chemical plant components such as reactors and drums. As a degradation parameter, intersection number ratio ($N_i/N_o$), is employed. The intersection number ratio ($N_i/N_o$) is defined as the ratio of intersection number ($N_i$) obtained from 5-minute picric acid etched surface to the number ($N_o$) obtained from Nital etched surface. In order to study degradation level, several relationships were measured such as the correlation between shift in ductile brittle transition temperature, $({\Delta}DBTT)_{sp}$ and intersection number ratio, ($N_i/N_o$) and the correlation between the measured ($N_i/N_o$) values and Larson-Miller Parameter values.

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Comparison of Degradation due to Fenton Reaction between Reinforced and Non-reinforced Membranes Used in PEMFC (PEMFC에 사용되는 강화막과 비강화막의 Fenton 반응에 의한 열화 비교)

  • Oh, Sohyeong;Yoo, Donggeun;Lee, Mihwa;Park, Jisang;Park, Kwon-Pil
    • Korean Chemical Engineering Research
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    • v.59 no.4
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    • pp.508-513
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    • 2021
  • In order to improve the durability of a proton exchange membrane fuel cells (PEMFC), it is essential to improve the durability of the polymer membrane. In order to improve the durability of the membrane, an e-PTFE support and a radical scavenger are added. In this study, the chemical durability of the reinforced membrane with ePTFE support and the non-reinforced membrane was compared by Fenton reaction. In the Fenton experiment of the polymer membrane without the addition of a radical scavenger, the absorption rate of hydrogen peroxide solution and iron ions through the cross section of the specimen cut into small pieces was higher in the reinforced membrane, so that the fluorine outflow concentration was higher. According to the type and amount of radical scavenger added, the fluorine outflow concentration of the reinforced membrane has a large difference of more than 3 times, indicating that the effect of the radical scavenger was stronger than that of the support.

THE EFFECT OF LOCATION AND ANGLE OF DRILLING ON THE CHANGES OF THE DISTANCE BETWEEN TWO BLOCK SPECIMENS DURING SCREWING ON MINIPLATE FIXATION (소형금속판에 고정나사의 삽입시 drilling의 위치 및 각도에 따른 시편의 이동량에 대한 효과)

  • Oh, Hyun-Chul;An, Jin-Suk;Gu, Hong;Kook, Min-Suk;Park, Hong-Ju;Oh, Hee-Kyun
    • Maxillofacial Plastic and Reconstructive Surgery
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    • v.28 no.3
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    • pp.213-221
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    • 2006
  • Purpose This study was aimed to evaluate the effect of the location and angle of drilling on the changes of the distance between the two block specimens. Materials and methods In experimental group 1, the screw holes were prepared by drilling in the distal portion of compression part of the plate at $90^{\circ}$. In experimental group 2, the drilling was performed at an angle of $30^{\circ}$ proximal to the miniplate, and in experimental group 3, at $30^{\circ}$ distal respectively. In control group, the drilling was performed to the center of hole at $90^{\circ}$. The fixation screw length was 5 mm, 7 mm, and 9 mm in all groups. The results were as follows. Results 1. In control group, the mean changes between two specimens were 0.01 mm, 0.02 mm, and 0.00 mm in 5 mm, 7 mm, and 9 mm screws respectively. 2. In experimental group 1, the compression part was moved toward the retention part. The range of mean changes were from -0.39 mm to -0.43 mm. 3. In experimental group 2, the compression part was moved toward the retention part. The range of mean changes were from -0.51 mm to -0.56 mm. 4. In experimental group 3, the compression part was moved apart from the retention part and the range of mean changes were from 0.55 mm to 0.56 mm. 5. The changes were significantly different between all groups(p<0.01). Conclusion These results suggest that 0.4$\sim$0.5 mm of compressive effect can be achieved by drilling on the distal area of the screw hole at an angle of $90^{\circ}$ and by the proximal angulation to the miniplate, and the gap between specimens can be increased by distal angulation to the miniplate during drilling.

Tensile and Fatigue Behavior of ASS304 for Cold Stretching Pressure Vessels at Cryogenic Temperature (Cold Stretching 압력용기용 ASS304 소재의 극저온 인장 및 피로거동)

  • Choi, Hoon Seok;Kim, Jae Hoon;Na, Seong Hyun;Lee, Youn Hyung;Kim, Sung Hun;Kim, Young Kyun;Kim, Ki Dong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.40 no.5
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    • pp.429-435
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    • 2016
  • Cold stretching(CS) pressure vessels from ASS304 (austenitic stainless steel 304) are used for the transportation and storage of liquefied natural gas(LNG). CS pressure vessels are manufactured by pressurizing the finished vessels to a specific pressure to produce the required stress ${\sigma}_k$. After CS, there is some degree of plastic deformation. Therefore, CS vessels have a higher strength and lighter weight compared to conventional vessels. In this study, we investigate the tensile and fatigue behavior of ASS304 sampled by CS pressure vessels in accordance with the ASME code at cryogenic temperature. From the fatigue test results, we show S-N curves using a statistical method recommended by JSEM-S002. We carried out the fractography of fractured specimens using scanning electron microscopy (SEM).

AE Characteristics of Fatigue Crack Opening and Closure in Structural Aluminum Alloy (구조용 알루미늄 합금에서의 피로균열 열림 및 닫힘 시 AE 발생특성 연구)

  • Jeong, Jung-Chae;Park, Phi-Lip;Kim, Ki-Bok;Lee, Seung-Seok;Yoon, Dong-Jin
    • Journal of the Korean Society for Nondestructive Testing
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    • v.22 no.2
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    • pp.155-169
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    • 2002
  • The objective of this study was to investigate the effect of crack opening and closure in the AE activities during fatigue test. Laboratory experiment using various materials and test conditions were carried out to identify AE characteristics of fatigue crack propagation. Compact tension specimens of 2024-T4 and 6061-T6 aluminum alloy were prepared for fatigue test. AE activities were analyzed based on the phase of the loading cycle. Generally, most of AE were generated when the crack begins' opening and the crack closes fully, whereas a few in the pull opening of the crack. Also AE activity in the peak loading of cycle was different with each specimen. However, in the same material, AE activity was not affected by the change of cyclic frequency (0.1, 0.2, 1.0Hz). It was found that AE activities during crack opening and closure depend on material properties such as micro-structure, tensile strength and yield strength.

Study of adhesion properties of flexible copper clad laminate having various thickness of Cr seed layer under constant temperature and humidity condition (항온항습 조건하에서 Ni/Cr 층의 두께에 따른 FCCL의 접합 신뢰성 평가)

  • Choi, Jung-Hyun;Noh, Bo-In;Yoon, Jeong-Won;Kim, Yong-Il;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2010.05a
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    • pp.80-80
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    • 2010
  • 전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.

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Improving Stability and Characteristic of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module (Dual band Antenna Switch Module의 LTCC 공정변수에 따른 안정성 및 특성 개선에 관한 연구)

  • Lee Joong-Keun;Yoo Joshua;Yoo Myung-Jae;Lee Woo-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.105-109
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    • 2005
  • A compact antenna switch module for GSM/DCS dual band applications based on multilayer low temperature co-fired ceramic (LTCC) substrate is presented. Its size is $4.5{\times}3.2{\times}0.8 mm^3$ and insertion loss is lower than 1.0 dB at Rx mode and 1.2 dB at Tx mode. To verify the stability of the developed module to the process window, each block that is diplexer, LPF's and bias circuit is measured by probing method in the variation with the thickness of ceramic layer and the correlation between each block is quantified by calculating the VSWR In the mean while, two types of bias circuits -lumped and distributed - are compared. The measurement of each block and the calculation of VSWR give good information on the behavior of full module. The reaction of diplexer to the thickness is similar to those of LPF's and bias circuit, which means good relative matching and low value of VSWR, so total insertion loss is maintained in quite wide range of the thickness of ceramic layer at both band. And lumped type bias circuit has smaller insertion itself and better correspondence with other circuit than distributed stripline structure. Evaluated ceramic module adopting lumped type bias circuit has low insertion loss and wider stability region of thickness over than 6um and this can be suitable for the mass production. Stability characterization by probing method can be applied widely to the development of ceramic modules with embedded passives in them.

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Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes (OSP.ENIG 표면 처리된 기판과 Sn-3.0Ag-0.5Cu 솔더 접합부의 낙하충격 신뢰성 평가)

  • Ha, Sang-Ok;Ha, Sang-Su;Lee, Jong-Bum;Yoon, Jeong-Won;Park, Jai-Hyun;Chu, Yong-Chul;Lee, Jun-Hee;Kim, Sung-Jin;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.1
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    • pp.33-38
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    • 2009
  • The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

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